DSPIC33CK32MP505T-I/M4 - 100MHz 16-bit DSC 32KB Flash | Microchip
料号： DSPIC33CK32MP505T-I/M4 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.02 | $2.02 |
| 10 | $1.95 | $19.50 |
| 100 | $1.82 | $182.00 |
| 500 | $1.7 | $850.00 |
| 1,000 | $1.61 | $1,610.00 |
DSPIC33CK32MP505T-I/M4 概述
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and ease of use of a microcontroller, sitting between a general-purpose MCU and a dedicated DSP in the embedded processing hierarchy. The dsPIC33CK family uses a modified Harvard architecture with a single 100 MHz dsPIC33CK core, making it a natural fit for power conversion and motor control systems that need deterministic closed-loop execution.
Key differentiating features of the MP505 variant include three integrated operational amplifiers (op amps), three analog comparators, a CAN-FD interface, and a Programmable Gain Amplifier-based analog front end, plus a Pattern Generator (PTG) peripheral for autonomous event sequencing. The device supports Functional Safety (FuSa) documentation packages, dual-partition Flash with Live Update for field firmware upgrades, and ECC on program Flash for high-integrity designs.
Architecturally, the dsPIC33CK core executes most instructions in a single cycle and pairs high-resolution PWM peripherals with fast 12-bit ADC sampling, enabling sub-microsecond current-loop bandwidths in digitally controlled power supplies and PMSM/BLDC motor drives without external signal-conditioning ICs.
Typical applications include digital power supplies (LLC, totem-pole PFC), brushless and permanent-magnet motor control, solar micro-inverters, and industrial sensing and control nodes that require the CAN-FD interface.
Designers should plan power sequencing and decoupling for the 3.0V to 3.6V supply and verify ADC channel allocation against package pin availability early, since the 48-pin UQFN constrains analog pin multiplexing.
This page synthesizes distributor pricing from LCSC, DigiKey and Mouser, drop-in alternative analysis, and practical design notes not consolidated in the manufacturer datasheet.
直接替换替代料： DSPIC33CK32MP505T-I/M4 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33CK32MP505T-I/M4 （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Analog Comparators, CAN Interface, Data SRAM.
快速对比工具——选择替代料号进行并排对比：
DSPIC33CK32MP505T-E/M4
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33CK64MP505T-I/M4
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33CK32MP504T-I/M4
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33CK32MP503T-I/M4
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33CK32MC105-E/M4
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.2 / 个
查看数据手册 →DSPIC33CK32MP505T-I/M4 最大额定值与电气特性
| Core | dsPIC33CK 16-bit DSC core |
| CPU Speed | 100 MHz (100 MIPS) |
| Program Flash Size | 32 KB (with ECC, dual-partition Live Update) |
| SRAM Size | 8 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| 工作温度 | -40C to +125C (I grade) |
| On-chip Op Amps | 3 |
| Analog Comparators | 3 |
| CAN Interface | CAN-FD |
| Pattern Generator | PTG peripheral |
| 封装 | 48-UQFN (6x6 mm), code M4 |
| 安装类型 | Surface Mount |
| Functional Safety | FuSa support package available |
| Flash Architecture | Dual-partition with Live Update |
| Packaging | Tape and Reel (T suffix) |
DSPIC33CK32MP505T-I/M4 48-uqfn (6x6 mm), code m4 引脚配置指南
DSPIC33CK32MP505T-I/M4（48-uqfn (6x6 mm), code m4 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33CK32MP505T-I/M4.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33CK32MP505T-I/M4 适用于 6 应用s: Digital Power Supplies (LLC / PFC), BLDC / PMSM Motor Control, Solar Micro-Inverters and Power Conversion, Industrial Sensing and Control Nodes, Automotive-Adjacent and CAN-FD Networked Devices, Wireless Power Transfer and Charging Control.
Digital Power Supplies (LLC / PFC)
The DSPIC33CK32MP505T-I/M4 fits digitally controlled power stages because its 100 MHz (100 MIPS) core closes voltage and current loops with deterministic single-cycle instruction timing, while 32 KB of ECC Flash safely stores compensator code and dual-partition Live Update allows firmware refresh without bricking a deployed supply. The three on-chip comparators provide nanosecond-class overcurrent protection independent of software, and the on-chip op amps condition shunt or current-transformer signals before the fast ADC samples them. Placed as the sole supervisory controller between the feedback dividers and the gate-driver PWM inputs, the DSC replaces analog compensation networks, giving digital adjustability of loop gains across line and load conditions at a bill-of-material cost near $2 as of 2026-09-23.
推荐
BLDC / PMSM Motor Control
Field-oriented control of brushless DC and permanent-magnet synchronous motors is a primary target for the dsPIC33CK32MP505: the 100 MHz core executes Clarke/Park transforms and PI current loops at PWM-frequency rates, and the three integrated operational amplifiers amplify low-side shunt voltages without external amplifier ICs, saving board area and offset error. The three analog comparators implement hardware overcurrent trips that shut off PWM within microseconds even if firmware stalls. In a typical servo drive the DSC reads two or three phase-current channels at high sample rate, computes the FOC loop, and drives six PWM outputs through a gate driver; CAN-FD provides the command interface to a higher-level motion controller. The 48-UQFN 6x6 mm package keeps controller footprint minimal inside compact drive housings.
推荐
Solar Micro-Inverters and Power Conversion
Micro-inverters need one controller to juggle maximum-power-point tracking, grid-synchronized current injection, and protective relaying - a workload the DSPIC33CK32MP505T-I/M4 handles with its 100 MHz single-cycle core and hardware dividers/DSP MAC instructions for fast sinewave generation and MPPT arithmetic. ECC-protected Flash guards control code against solar-enclosure thermal stress from -40C to +125C, and Live Update dual-partition Flash permits field firmware updates after installation on a rooftop. The on-chip op amps condition AC-coupled current-sense signals, and the comparators back up software protection during grid faults. CAN-FD or UART links report per-panel telemetry to a gateway controller. The industrial temperature rating and small UQFN footprint suit potted, thermally constrained inverter enclosures.
推荐
Industrial Sensing and Control Nodes
As a sensor-fusion and actuation node, the dsPIC33CK32MP505 combines a 100 MHz DSP core with enough analog integration - three op amps, three comparators, and a rich ADC mux - to digitize bridge and shunt sensors directly, and CAN-FD to publish processed results on modern industrial networks. The Pattern Generator (PTG) peripheral autonomously sequences measurements and triggers with CPU-free timing, cutting interrupt jitter in deterministic sampling systems such as vibration or power-quality monitors. The 32 KB ECC Flash supports Functional Safety documentation flows for machinery compliance, and 8 KB SRAM buffers waveform capture windows. Estimated cost around $2.02 per unit as of 2026-09-23 makes it economical to distribute intelligence across many nodes rather than centralizing it.
推荐
Automotive-Adjacent and CAN-FD Networked Devices
Systems migrating from classical CAN to CAN-FD - e-mobility auxiliary boards, battery telemetry packs, industrial vehicle accessories - can adopt the dsPIC33CK32MP505's integrated CAN-FD controller without an external network chip, moving up to 64-byte payloads at higher data-phase bit rates. The DSC's 100 MHz core locally pre-processes sensor data (filtering, FFT windowing via DSP instructions) before transmission, reducing bus loading, while the comparators protect battery-pack or actuator hardware independent of software latency. ECC Flash and the available Functional Safety package support customers building safety-relevant documentation under IEC-style flows even where full AEC-Q100 parts are not yet required. The 48-UQFN (6x6 mm) package suits compact control boards with limited Z-height.
推荐
Wireless Power Transfer and Charging Control
Wireless power transmitters and receivers require precise frequency-tracking of a resonant converter plus foreign-object and overtemperature protection - duties the DSPIC33CK32MP505T-I/M4 serves well. Its 100 MHz core executes frequency-tracking PI loops and Q-factor estimation routines in real time, the three comparators trip on coil overcurrent within microseconds via hardware paths, and the on-chip op amps amplify small coil-current sense signals for the fast ADC. CAN-FD or UART reports charge state to a host, while PTG automates periodic safety re-checks without firmware intervention. With 32 KB ECC Flash and a -40C to +125C rating, the controller tolerates the thermal cycling typical of charging pads, and its $2-class price as of 2026-09-23 keeps charging-base BOM cost competitive.
推荐
推荐产品汇总
工程参考数据： DSPIC33CK32MP505T-I/M4 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33CK32MP505T-E/M4 | DSPIC33CK64MP505T-I/M4 | DSPIC33CK32MP504T-I/M4 | DSPIC33CK32MC105-E/M4 |
|---|---|---|---|---|---|
| Package | 48-UQFN (6x6 mm) | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Program Flash | 32 KB (ECC, dual-partition) | 32 KB | 64 KB | 32 KB | 32 KB |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Temperature Range | -40C to +125C (I) | -40C to +150C (E) | -40C to +125C (I) | -40C to +125C (I) | -40C to +150C (E) |
| CAN Interface | CAN-FD | CAN-FD | CAN-FD | CAN-FD | CAN-FD |
关键差异点
- Three integrated op amps eliminate external signal-conditioning ICs （对比 DSPIC33CK32MC105-E/M4)
- Extended-temperature option on identical silicon （对比 DSPIC33CK32MP505T-E/M4)
- Lowest-cost entry into the 48-UQFN MP-series analog feature set （对比 DSPIC33CK64MP505T-I/M4)
设计说明
The 48-UQFN (6x6 mm, M4) is a no-lead package with a central exposed pad. Solder the exposed pad to a grounded PCB thermal pad with a via array for both heat dissipation and low-inductance ground return; insufficient center-pad solder coverage is the most common reflow defect on QFN parts. Follow Microchip's package outline drawing for the M4 land pattern, and use a divided stencil aperture (roughly 50-70% coverage) to avoid solder voiding under the die paddle.
All VDD pins must be connected to a 3.0V to 3.6V supply and all VSS pins grounded - Microchip's dsPIC33CK32MP505 programming notes explicitly require every supply pin pair to be powered during both operation and ICSP. Place 0.1uF ceramic decoupling capacitors at each VDD/VSS pin pair as close to the pins as possible, plus bulk capacitance near the regulator. In motor-drive and power-conversion boards, isolate the analog supply (AVDD) with an RC or ferrite filter to preserve op-amp and ADC accuracy.
For ICSP programming/debugging, use PGECx and PGEDx pins strictly as matched pairs - if PGEC2 carries ICSPCLK then ICSPDAT must connect to PGED2 (per Microchip dsPIC33CK32MP505 documentation). Mixing pairs from different channels is a frequent bring-up failure. Also note that this T-orderable is tape and reel: choose the non-T orderable for hand-placed prototypes, and respect MSL bake requirements if reels have been opened and stored.
On a 48-pin package, analog and digital functions are heavily multiplexed. Assign shunt/amplifier inputs to the pins serving the on-chip op amps early in schematic capture, and route high-di/dt gate-drive traces away from the ADC/op-amp inputs and the CAN-FD pair. Provide a solid ground plane under the QFN and keep the exposed pad as the single low-impedance ground reference to minimize ground bounce between power and analog domains.
合规信息
Compliance status was not published in the retrieved distributor listings; verify RoHS/REACH status on the official Microchip product page or distributor compliance certificates before procurement.
