DSPIC33EV64GM104-E/ML - 16-bit 60 MIPS 5V DSC, CAN | Microchip
料号： DSPIC33EV64GM104-E/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.49 | $4.49 |
| 10 | $4.3 | $43.00 |
| 100 | $4.23 | $423.00 |
| 500 | $4.05 | $2,025.00 |
| 1,000 | $3.85 | $3,850.00 |
DSPIC33EV64GM104-E/ML 概述
A digital signal controller combines the computational architecture of a digital signal processor with the peripheral set and ease of use of a microcontroller. DSCs sit within the broader microcontroller hierarchy of embedded processors and are optimized for real-time control loops where multiply-accumulate (MAC) operations, fast interrupts, and deterministic response are required, such as motor control and power conversion.
Key features include a 5V-tolerant operating supply of 4.5V to 5.5V, which simplifies designs in harsh industrial and automotive environments where 3.3V parts need level shifting; a CAN 2.0B controller for robust in-vehicle and industrial networking; six motor-control PWM channels; and three on-chip operational amplifiers that reduce external component count in current-sense signal chains. A Charge Time Measurement Unit (CTMU) supports capacitive touch and precision time measurement, while the SENT peripheral targets automotive sensor interfaces. ECC Flash protects program memory integrity, supporting functional safety (FuSa) objectives.
Architecturally, the dsPIC33EV core pairs a 16-bit pipeline with DSP instructions, a barrel shifter, and multiple internal bus structures, enabling efficient FIR filtering, PID control, and coordinate transformation (Clarke/Park) algorithms in sensorless motor drives. The -E temperature grade and 5V robustness make the part well suited to electrically noisy settings.
Typical applications include BLDC/PMSM motor drives, automotive body and powertrain auxiliaries, industrial power supplies, appliances, and CAN-networked sensor nodes.
Design consideration: the 44-QFN exposed-pad package requires a solid ground pour and via array under the pad for thermal and electrical performance; keep decoupling capacitors within 2 mm of VDD pins.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： DSPIC33EV64GM104-E/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33EV64GM104-E/ML （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Functional Safety Support, On-chip Op Amps, RAM Size.
快速对比工具——选择替代料号进行并排对比：
DSPIC33EV64GM104-I/ML
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.11 / 个
查看数据手册 →DSPIC33EV32GM104T-I/ML
✅ 直接替换✓ 有现货
$2.95 / 个
查看数据手册 →DSPIC33EV256GM104-E/ML
✅ 直接替换✓ 有现货
$3.9 / 个
查看数据手册 →DSPIC33EV64GM104-E/MR
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33EV64GM104-E/ML 最大额定值与电气特性
| Core | dsPIC33EV 16-bit DSC |
| Maximum CPU Speed | 60 MIPS |
| Program Memory Size | 64KB (22K x 24) Flash |
| Program Memory Type | ECC Flash |
| RAM Size | 8KB |
| Supply Voltage Range | 4.5 V to 5.5 V |
| 工作温度 | -40C to +125C (Grade E) |
| 封装 | 44-QFN (8x8 mm) |
| 安装类型 | Surface Mount |
| CAN | Yes (CAN 2.0B controller) |
| Motor Control PWM | 6 channels |
| On-chip Op Amps | 3 |
| CTMU | Yes (Charge Time Measurement Unit) |
| SENT Peripheral | Yes |
| Functional Safety Support | FuSa (per Microchip product classification) |
DSPIC33EV64GM104-E/ML 44-qfn (8x8 mm) 引脚配置指南
DSPIC33EV64GM104-E/ML（44-qfn (8x8 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33EV64GM104-E/ML.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33EV64GM104-E/ML 适用于 6 应用s: BLDC/PMSM Motor Drives, Automotive Body and Auxiliary Modules, CAN-Networked Industrial Sensor Nodes, Appliance Control Boards, Industrial Power Supplies and Digital Power Conversion, Safety-Oriented Embedded Control (FuSa).
BLDC/PMSM Motor Drives
The DSPIC33EV64GM104-E/ML fits motor-control applications through its combination of six motor-control PWM channels with dead-time insertion, three on-chip op amps for shunt-current amplification, and a 60 MIPS DSP core capable of field-oriented control (FOC) inner loops at 10-20 kHz PWM frequencies. In a typical PMSM drive, the on-chip op amps condition two shunt resistor signals, the ADC samples them synchronized to the PWM center, and the DSP core executes Clarke/Park transforms and PI current loops within one PWM period. The native 5V supply improves gate-driver interface noise margin in industrial cabinets, and ECC Flash protects control firmware integrity over a 10-year product life.
推荐
Automotive Body and Auxiliary Modules
For automotive auxiliaries such as pumps, fans, and actuators, the -40C to +125C (Grade E) temperature rating and 5V robust operation make the DSPIC33EV64GM104-E/ML well suited to under-hood-adjacent environments where 3.3V MCUs require protection circuitry. The integrated CAN 2.0B controller connects the node to vehicle networks without an external CAN controller, while the SENT peripheral interfaces modern automotive sensors that output nibble-encoded SENT signals. The CTMU supports capacitive-touch user interfaces in cabin modules. Designers should validate the specific ordering code against their AEC-Q/PPAP requirements with Microchip, and can reference the MCHV-2 development platform for early motor-control prototyping before committing hardware.
推荐
CAN-Networked Industrial Sensor Nodes
Industrial automation nodes benefit from the DSPIC33EV64GM104-E/ML's on-chip CAN 2.0B controller, 64KB ECC Flash for protocol stacks plus application code, and 8KB RAM for message buffering. The 5V supply directly powers and interfaces industrial 5V sensors and optocoupler-isolated CAN PHYs without level shifting, reducing BOM count versus 3.3V designs. DSP instructions accelerate filtering of raw sensor data (IIR/FIR) before transmission, and the CTMU enables precision time-of-flight or capacitance measurements. In DIN-rail or cabinet installations, the extended -40C to +125C grade tolerates thermal buildup near power electronics. The 44-QFN 8x8 mm footprint keeps the node compact while the exposed pad provides a solid ground connection for EMC performance.
推荐
Appliance Control Boards
Home and commercial appliances - washing machines, dishwashers, HVAC blowers - require robust motor control with sensor inputs and user interfaces, exactly the dsPIC33EV family's stated target market. The DSPIC33EV64GM104-E/ML drives the motor PWM, reads NTC or CTMU-based touch inputs, and handles 5V relay/TRIAC drive logic natively. The extended temperature grade survives enclosed, poorly ventilated appliance chassis, and ECC Flash preserves program integrity through years of power cycling and electrical noise from motor commutation. The three on-chip op amps reduce external analog components in current-sense paths, lowering total control-board cost. Firmware such as sensorless BEMF commutation fits comfortably within the 64KB program memory with room for communication and diagnostics.
推荐
Industrial Power Supplies and Digital Power Conversion
Digitally controlled AC-DC and DC-DC converters use the DSPIC33EV64GM104-E/ML's 60 MIPS DSP core and high-resolution PWM capability to implement voltage-mode or average-current-mode control loops at switching frequencies of 100 kHz and above. The 5V domain simplifies interfacing with gate-drive optocouplers and analog telemetry that already operate at 5V in industrial power stages. ECC Flash protects control firmware in mission-critical rectifiers and UPS systems, while the CAN controller enables PMBus-like supervisory communication in modular power shelves. The on-chip op amps can condition output-current shunt signals, removing a dedicated amplifier IC. Layout effort should focus on keeping the ADC sampling path away from the PWM switching nodes for measurement fidelity.
推荐
Safety-Oriented Embedded Control (FuSa)
DigiKey classifies this device under the dsPIC 33EV Functional Safety (FuSa) category, and the ECC Flash program memory provides single-bit error detection and correction - foundational mechanisms for safety-oriented control systems in industrial drives and automotive actuators. The 5V noise margin improves signal integrity in electrically harsh cabinets, and the extended temperature grade supports high-ambient installations. Design teams building toward IEC 61508 or ISO 26262 targets should obtain Microchip's formal FuSa collateral (safety manual, FMEDA) for the dsPIC33EV family and pair the hardware mechanisms with software diagnostics such as clock monitoring and RAMMarch tests. The CAN controller supports communication-layer safety protocols used in distributed drive systems.
推荐
推荐产品汇总
工程参考数据： DSPIC33EV64GM104-E/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33EV64GM104-I/ML | DSPIC33EV32GM104T-I/ML | DSPIC33EV256GM104-E/ML | DSPIC33EV64GM104-E/MR |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (alternate body variant) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Program Flash | 64KB ECC | 64KB ECC | 32KB ECC | 256KB ECC | 64KB ECC |
| RAM | 8KB | 8KB | 8KB | 8KB | 8KB |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) |
| Peripherals | CAN, 6 MC PWM, 3 op amps, CTMU, SENT | Same peripheral set | Same peripheral set | Same peripheral set | Same peripheral set |
关键差异点
- Extended -40C to +125C temperature grade in QFN-44 （对比 DSPIC33EV64GM104-I/ML)
- Twice the program memory at identical pinout （对比 DSPIC33EV32GM104T-I/ML)
- Integrated analog (3 op amps, CTMU, SENT) reduces external BOM （对比 DSPIC33EV256GM104-E/ML)
设计说明
The 44-QFN 8x8 mm package has an exposed thermal pad that must be soldered to a ground pour with a via array (typically 5x5, 0.3 mm vias) to achieve datasheet thermal performance and low ground impedance. Place one 100 nF X7R ceramic capacitor within 2 mm of each VDD/VSS pin pair, plus a single 10 uF bulk capacitor near the supply entry. The QFN perimeter pads require a solder-mask-defined or non-solder-mask-defined pattern per Microchip's QFN application note; verify stencil aperture design (approximately 60-70% coverage on the center pad) to avoid voiding.
Operating at 5V means the internal regulator dissipates more power than 3.3V parts at equal MIPS; budget roughly 60-90 mA typical core-plus-peripheral current (Estimated: based on family-typical 5V DSC consumption at 60 MIPS - confirm exact IDD in the family data sheet electrical tables for your clock configuration). At 5.5V worst case this is under 0.5 W, manageable with the exposed-pad pour, but avoid stacking a high-current CAN transceiver and motor gate-drive supply on the same local regulator without thermal review. Sequence VDD rise monotonically; hold MCLR low until VDD is stable.
Three recurring mistakes with dsPIC33EV GM10x designs: (1) assuming 70 MIPS family capability applies to every ordering code - this device is specified at 60 MIPS by DigiKey, so size your control-loop timing against 60 MIPS; (2) omitting pull-down/pull-up on PGC/PGD programming pins, which can cause spurious entry into ICSP mode in noisy environments; (3) using the wrong compiler device selection - dsPIC33EV parts require XC16 with the GM104 device file; dsPIC33EP code is not binary-compatible. Always cross-check pin multiplexing in the family data sheet DS70005144H pin diagrams before routing.
合规信息
Compliance data was not present in the provided verified web data; the -E/ML suffix denotes an extended-temperature lead-free-solderable package per Microchip convention, but formal RoHS/REACH status must be confirmed from the Microchip product page or environmental data sheet.