DSPIC33FJ64GP706AT-I/MR - 16-bit DSC 40 MIPS 64KB | Microchip
料号： DSPIC33FJ64GP706AT-I/MR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $6.67 | $6.67 |
| 10 | $6.2 | $62.00 |
| 100 | $5.8 | $580.00 |
| 500 | $5.4 | $2,700.00 |
| 1,000 | $5 | $5,000.00 |
DSPIC33FJ64GP706AT-I/MR 概述
A Digital Signal Controller combines the deterministic core of a general-purpose microcontroller with the mathematical capability of a DSP. Within the hierarchy of embedded processors, the DSC sits between an MCU and a dedicated DSP: it executes MCU-style control code and peripherals while adding hardware MAC/DSP instructions for digital filtering, motor-control loops, and power-conversion algorithms. The dsPIC33F family from Microchip Technology occupies this niche in the 16-bit embedded market, with seamless migration options to PIC24F, PIC24H MCUs and dsPIC30F DSCs in similar packages.
Key features of the DSPIC33FJ64GP706AT-I/MR include the 40 MIPS 16-bit RISC core, 64 KB self-programming FLASH, industrial (-40C to +85C) temperature rating denoted by the I suffix, and the compact thermally enhanced 64-VFQFN exposed-pad package that reduces board area versus the TQFP variant.
Technically, the device is a CMOS design operating from a 3.0 V to 3.6 V supply, with two on-chip oscillator/PLL blocks enabling operation from internal or external sources. The GP (General Purpose) peripheral set includes ADC, UART, SPI and I2C resources suited to mixed signal-control workloads, and the A revision silicon is compatible with the wider dsPIC33FJ64GP706A family toolchain.
Typical applications include digital power supplies, motor control drives, industrial sensing nodes, and embedded instrumentation where 16-bit control plus DSP math is required in a compact 9x9 mm footprint.
For design, keep the 3.3 V supply within the 3.0-3.6 V range, decouple all VDD pins, and ground the exposed thermal pad for best signal integrity and thermal performance.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： DSPIC33FJ64GP706AT-I/MR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33FJ64GP706AT-I/MR （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Core, Family, Packaging Option.
快速对比工具——选择替代料号进行并排对比：
DSPIC33FJ64GP706A-I/MR
✅ 直接替换✓ 有现货
$10.1 / 个
查看数据手册 →DSPIC33FJ64GP706-I/MR
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33FJ32GP706AT-I/MR
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33FJ128GP706AT-I/MR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$5.6 / 个
查看数据手册 →DSPIC33FJ64GP806AT-I/MR
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33FJ64GP706AT-I/MR 最大额定值与电气特性
| Core | dsPIC33F 16-bit RISC DSC |
| Max CPU Speed | 40 MIPS (40 MHz) |
| Program Memory Size | 64 KB (64K x 8) FLASH |
| Program Memory Type | FLASH |
| Supply Voltage (Vdd) | 3.0 V to 3.6 V |
| 工作温度 | -40C to +85C (I grade) |
| 封装 | 64-VQFN (9x9 mm) Exposed Pad |
| 安装类型 | Surface Mount |
| 引脚数量 | 64 |
| Family | dsPIC 33F, DSPIC33FJ64GP706A |
| Product Type | Digital Signal Controller (DSC) / Microcontroller |
| Packaging Option | Tape & Reel (T) variant |
| RoHS 状态 | Compliant (per distributor listings) |
| Migration Path | Seamless migration to PIC24F, PIC24H MCUs and dsPIC30F DSCs in similar packages |
DSPIC33FJ64GP706AT-I/MR 64-vqfn (9x9 mm) exposed pad 引脚配置指南
DSPIC33FJ64GP706AT-I/MR（64-vqfn (9x9 mm) exposed pad 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33FJ64GP706AT-I/MR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33FJ64GP706AT-I/MR 适用于 6 应用s: Digital Power Supplies, Motor Control Drives, Industrial Sensing and Automation Nodes, Embedded Instrumentation and Test Equipment, Consumer Audio and Signal Processing, Embedded Control and IoT Gateways.
Digital Power Supplies
The DSPIC33FJ64GP706AT-I/MR fits digital power conversion because its 40 MIPS 16-bit DSC core executes voltage- and current-loop compensation at switching frequency rates with deterministic timing, while the 64 KB FLASH accommodates control firmware, compensators and communication stacks in one device. Used as the supervisory and loop controller in AC-DC or DC-DC converters, the DSC replaces analog control chips and adds programmability - soft-start profiles, fault logging and protocol telemetry. Because a digital loop avoids analog drift, regulation accuracy holds across temperature, and the industrial -40C to +85C rating covers industrial power shelves. The trade-off versus dedicated analog controllers is software development effort and the need to validate loop stability in firmware rather than by passive component selection alone.
推荐
Motor Control Drives
The DSPIC33FJ64GP706AT-I/MR is well suited to embedded motor control because the 40 MIPS core sustains field-oriented control (FOC) and sensorless observer mathematics within typical 10-20 kHz loop budgets, and the GP peripheral set supplies the timers and analog interfaces required for gate-drive timing and current feedback. The 64-pin VQFN gives enough I/O for three-phase drive signaling, encoder or resolver inputs, and fault interlocks while keeping the 9x9 mm footprint compact for integrated drives. Industrial drives benefit from the -40C to +85C rating and 3.0-3.6 V logic compatibility with gate-driver isolators. For designs dominated by advanced PWM peripherals, evaluate the MC (Motor Control) family variants such as DSPIC33FJ32MC204, which trade some GP peripherals for enhanced PWM resources on the same 16-bit core.
推荐
Industrial Sensing and Automation Nodes
In industrial automation, the DSPIC33FJ64GP706AT-I/MR serves as a smart sensor node controller: the 40 MIPS core performs digital filtering and scaling of ADC readings, while the GP peripheral set covers serial links (UART, SPI, I2C) to front-ends and to PLC backplanes. The 64 KB FLASH supports protocol stacks and local decision logic, and the 64-pin package exposes enough GPIO for relays, indicators and limit switches. The industrial -40C to +85C temperature grade and 3.0-3.6 V operation align with factory-floor power architectures. Performance consideration: at 40 MIPS, sample processing typically leaves ample margin, but designers should budget FLASH for bootloader plus application, since a remote-updatable node consumes several kilobytes before application code begins.
推荐
Embedded Instrumentation and Test Equipment
Bench and portable instrumentation benefit from the DSPIC33FJ64GP706AT-I/MR's combination of 16-bit control throughput (40 MIPS) and DSP arithmetic, which handles averaging, windowing and calibration routines without an external processor. The 64 KB FLASH holds measurement state machines, compensation tables and UI firmware, while the 64-pin VQFN (9x9 mm) packs ample I/O for front-panel switches, displays and analog front-end control into handheld enclosures. The exposed-pad package grounds to the analog plane, helping manage the mixed-signal integrity that measurement accuracy demands. Consider that 3.3 V-only operation requires level shifting if legacy 5 V instrument subsystems are involved; PIC24/dsPIC33 code portability across the family eases platform reuse across instrument product lines.
推荐
Consumer Audio and Signal Processing
The General Purpose dsPIC33F architecture with hardware DSP support makes the DSPIC33FJ64GP706AT-I/MR practical for consumer audio processing - equalization, dynamic range control and simple codecs - at up to 40 MIPS in a compact 3.3 V design. The 64 KB FLASH stores coefficient tables and application firmware, and the 64-pin QFN provides sufficient I/O for I2S-adjacent glue logic, control interfaces and user controls. Because the part is RoHS-compliant and available in industrial temperature grade, it also suits commercial audio installations. Performance consideration: dsPIC33F DSP bandwidth suits processing up to moderate sample rates and channel counts; for multi-channel high-resolution audio, a dedicated audio DSP is the better fit, with this DSC handling system control and supervision.
推荐
Embedded Control and IoT Gateways
As a general embedded controller, the DSPIC33FJ64GP706AT-I/MR manages mixed analog/digital subsystems in connected devices: the 40 MIPS core runs application logic and lightweight filtering, the GP peripherals supply UART/SPI/I2C links to radio modules and sensors, and 64 KB FLASH hosts the application plus a small command parser. The 64-pin package supplies generous GPIO for LEDs, buttons and power sequencing of radio modules. The 3.0-3.6 V rail integrates directly with common Li-ion-adjacent regulator outputs, and the industrial temperature rating covers unconditioned environments. For battery-powered nodes, evaluate duty-cycling the 40 MHz clock since active-mode consumption at full speed dominates the energy budget; the device's migration compatibility with PIC24 MCUs lets the same code base scale up the family.
推荐
推荐产品汇总
工程参考数据： DSPIC33FJ64GP706AT-I/MR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33FJ64GP706A-I/MR | DSPIC33FJ64GP706-I/MR | DSPIC33FJ32GP706AT-I/MR | DSPIC33FJ128GP706AT-I/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) Exposed Pad | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | 16-bit dsPIC33F, 40 MIPS | 16-bit dsPIC33F, 40 MIPS | 16-bit dsPIC33F, 40 MIPS | 16-bit dsPIC33F, 40 MIPS | 16-bit dsPIC33F, 40 MIPS |
| FLASH Memory | 64 KB | 64 KB | 64 KB | 32 KB | 128 KB |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Temperature Grade | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| Silicon Revision | A revision, tape & reel | A revision, tube/tray | non-A revision | A revision, tape & reel | A revision, tape & reel |
| Packaging Format | Tape & Reel (T) | Tube/Tray | Tube/Tray | Tape & Reel | Tape & Reel |
关键差异点
- A-revision silicon in tape-and-reel for automated assembly （对比 DSPIC33FJ64GP706-I/MR)
- Same footprint with 2x program memory upgrade path （对比 DSPIC33FJ32GP706AT-I/MR)
- Balanced cost/memory versus maximum-memory variant （对比 DSPIC33FJ128GP706AT-I/MR)
设计说明
The 64-VQFN (9x9 mm) exposed-pad package requires a matching land pattern with the center pad tied to a solid ground pour. Use an array of thermal vias (typically 4x4 under the pad) to connect the ground plane for heat dissipation and to reduce ground inductance. Avoid routing signals directly under the exposed pad region. Per Microchip package outline drawings, follow the recommended stencil aperture design (~50-70% coverage) to prevent excessive solder paste and component floating during reflow.
Supply the device at 3.3 V nominal within the 3.0-3.6 V range stated in distributor specifications. Decouple every VDD pin with a 100 nF X7R ceramic capacitor placed within a few millimeters of the pin, and add 4.7-10 uF of bulk capacitance per power domain. The 64-pin QFN distributes VDD/VSS across all four sides, so verify each pair is bypassed. Follow the power supply and oscillator sections of the Microchip family datasheet for the exact decoupling network and PLL power filtering recommendations.
Confirm silicon revision before layout freeze: the A-revision (DSPIC33FJ64GP706A) supersedes the original non-A device, and Microchip errata differ between revisions - always read the family errata sheet alongside the datasheet. When substituting within the family (e.g., 32 KB or 128 KB FLASH variants), verify FLASH size and pin multiplexing, since peripheral mapping on shared pins can differ. Finally, the 'T' suffix denotes tape-and-reel; ordering the non-T part yields tube/tray packaging that is incompatible with pick-and-place reels.
For a 40 MIPS device switching all I/O, maintain a clean return path by keeping the exposed-pad ground unbroken under high-speed signal groups (programming pins PGC/PGD, oscillator, and fast GPIO banks). Route crystal or external oscillator traces short and guarded by ground, and series-terminate long clock or reset traces. Mixed-signal designs should partition analog and digital ground regions joined at the exposed pad to protect ADC accuracy in measurement applications.
合规信息
RoHS-compliant per standard distributor listings (LCSC, Hotenda). The related DSPIC33FJ64GP706AT-E/PT variant is described as AEC-Q100 and TS 16949 qualified in distributor data; AEC-Q100 status for this -I/MR variant is not confirmed in provided data. Obtain formal REACH and material declarations from Microchip.
