EP1C12F324I7 - Cyclone FPGA 12,060 LE | 324-FBGA | Altera
料号： EP1C12F324I7 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.3 | $723.00 |
| 100 | $64.9 | $6,490.00 |
| 500 | $58.4 | $29,200.00 |
| 1,000 | $52.1 | $52,100.00 |
EP1C12F324I7 概述
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, PLLs, and I/O transceivers. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-programmable processors, allowing hardware designers to implement arbitrary digital logic that is re-programmable in-system. The Cyclone family specifically targets low-power, low-cost designs that still require the parallelism and integration advantages of programmable logic.
Key features of the EP1C12F324I7 include 12,060 logic elements distributed across 1,206 logic array blocks (LABs), 239,616 RAM bits organized into M4K memory blocks, two phase-locked loops (PLLs) for clock management, and support for multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, and LVDS. The 130 nm process technology delivers an internal operating frequency of up to 320.1 MHz, providing ample margin for glue-logic, bridging, and digital signal processing (DSP) front-end applications.
Architecturally, the device integrates dedicated multiplier blocks, embedded memory, and a four-level routing hierarchy optimized for the Altera Quartus II design flow. Configuration is loaded from a serial PROM or via JTAG, and the part supports in-system programmability (ISP) for rapid prototyping and field upgrades.
Typical applications include industrial control and factory automation, video processing and image capture pipelines, communications infrastructure line cards, military and aerospace systems requiring industrial-grade plastic packaging, and embedded prototyping where fast time-to-market justifies FPGA unit cost over ASIC NRE. The wide I/O count also makes the EP1C12F324I7 suitable for data-acquisition front-ends and parallel bus bridging.
When designing with this part, use the Altera Quartus II (or later) toolchain for synthesis, place-and-route, and timing closure. Note that the Cyclone family has been superseded by Cyclone II/III/IV/V and MAX series devices in new designs; this part remains in distribution primarily for maintenance of legacy systems.
直接替换替代料： EP1C12F324I7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1C12F324I7 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Family, Process Technology.
快速对比工具——选择替代料号进行并排对比：
EP1C12F324I7N
✅ 直接替换✓ 有现货
$52.1 / 个
查看数据手册 →EP1C12F324C8N
✅ 直接替换✓ 有现货
$51.75 / 个
查看数据手册 →EP1C12F324C8NGA
✅ 直接替换✓ 有现货
$22.95 / 个
查看数据手册 →EP1C12F324C7N
✅ 直接替换✓ 有现货
$37.2 / 个
查看数据手册 →EP1C12F324C8L
✅ 直接替换✓ 有现货
$23.4 / 个
查看数据手册 →EP1C12F324C8
✅ 直接替换✓ 有现货
$21.5 / 个
查看数据手册 →EP1C12F324I7 最大额定值与电气特性
| Family | Cyclone |
| Logic Elements | 12,060 |
| Logic Array Blocks (LABs) | 1,206 |
| Embedded RAM Bits | 239,616 |
| Maximum User I/O | 249 |
| Maximum Operating Frequency | 320.1 MHz |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| PLLs | 2 |
| 封装 | 324-ball FBGA |
| 工作温度 | -40 °C to +100 °C (Industrial) |
| 安装类型 | Surface Mount |
| Configuration Method | SRAM / JTAG / Serial PROM |
| MSL 等级 | 3 (168 hours) |
EP1C12F324I7 324-ball fbga 引脚配置指南
EP1C12F324I7（324-ball fbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1C12F324I7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1C12F324I7 适用于 6 应用s: Industrial Control and Factory Automation, Video Processing and Image Capture, Communications Line Cards and Protocol Bridging, Embedded Prototyping and ASIC Emulation, Test and Measurement Instrumentation, Military and Aerospace Avionics.
Industrial Control and Factory Automation
The EP1C12F324I7 is well suited to industrial control platforms because its 12,060 logic elements and 249 user I/Os can absorb glue logic, motor-control interfaces, and protocol bridging on a single device. Industrial temperature operation (-40 to +100 °C) supports placement inside unshielded factory cabinets where ambient temperatures commonly exceed 70 °C. The two integrated PLLs allow frequency synthesis for CAN, RS-485, and Ethernet PHY reference clocks. Designers typically instantiate soft IP cores such as Modbus RTU or Profibus and use the M4K RAM blocks as FIFO buffers for UART and SPI peripherals. Compared with discrete 5-V TTL logic implementations, this Cyclone device consolidates an entire control board into one BGA, reducing PCB area and BOM cost.
推荐
Video Processing and Image Capture
With 239,616 bits of embedded RAM and DSP-friendly logic blocks, the EP1C12F324I7 can implement mid-resolution video pipelines including Bayer-to-RGB conversion, scaling, and overlay generation. The 249 available I/Os easily accommodate parallel ITU-R BT.656 or LVDS camera interfaces alongside DDR memory data buses. Designers pair the device with an external SDRAM frame buffer, using the M4K blocks as line buffers between pixel domains. Its 320.1 MHz maximum internal frequency supports standard-definition and low-resolution megapixel streams. For surveillance DVR or machine-vision front-ends, this Cyclone part provides the I/O density and RAM bandwidth needed for real-time pixel processing.
推荐
Communications Line Cards and Protocol Bridging
Telecom and datacom line cards commonly use the EP1C12F324I7 for protocol bridging, traffic shaping, and low-rate packet processing. The 249 user I/Os support multiple SGMII / GMII / SPI / I2C interfaces simultaneously, while the two PLLs synthesize independent reference clocks for PHY and SERDES blocks. M4K RAM blocks serve as elastic buffers for clock-domain crossing between MAC and switch fabrics. Industrial temperature grade allows deployment in outdoor remote cabinets. Quartus II soft IP (e.g., Triple-Speed Ethernet MAC) is verified against this Cyclone device, accelerating time-to-market.
推荐
Embedded Prototyping and ASIC Emulation
Engineering teams use the EP1C12F324I7 to prototype ASIC RTL before tape-out, leveraging its 12,060 logic elements to map medium-complexity subsystems such as DMA engines, memory controllers, or peripheral bridges. In-system programmability via JTAG enables rapid design-iteration cycles of minutes rather than days. The industrial temperature grade also lets the same hardware serve as a bring-up platform in lab and field environments. Designers frequently couple this FPGA with a soft 32-bit Nios II processor for SoC prototyping, validating software/firmware interaction before committing to an ASIC. Lower per-unit cost (relative to high-end FPGAs) makes it economical to deploy in production-grade prototypes.
推荐
Test and Measurement Instrumentation
Test equipment manufacturers adopt the EP1C12F324I7 to implement arbitrary waveform generators, logic-analyzer capture engines, and protocol exercisers. The wide I/O count accepts up to 249 channels of digital stimulus/response, while the M4K RAM blocks store captured samples at hundreds of megahertz. Dual PLLs provide independent clock synthesis for the stimulus and acquisition paths. Industrial temperature grade ensures bench and field-portable instruments operate reliably. Latency-critical paths benefit from the 130 nm ASIC-like routing architecture, delivering deterministic timing for protocol compliance testing.
推荐
Military and Aerospace Avionics
Legacy avionics systems and military-grade ground equipment continue to use the EP1C12F324I7 for data-acquisition, signal conditioning, and MIL-STD-1553 interface bridging. The industrial temperature range covers avionics bay requirements, and the 324-FBGA package withstands high-vibration environments when properly board-mounted. Two PLLs allow the FPGA to recover clocks from avionics buses and re-clock them for downstream processors. Embedded M4K blocks hold protocol message buffers. For long-life defense programs where re-spin is impractical, this Cyclone device remains in inventory channels.
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推荐产品汇总
工程参考数据： EP1C12F324I7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1C12F324I7N | EP1C12F324C8N | EP1C12F324C8NGA | EP1C12F324C7N |
|---|---|---|---|---|---|
| Package | 324-FBGA | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 |
| Embedded RAM Bits | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 |
| Temperature Grade | Industrial (-40 to +100 °C) | Industrial (-40 to +100 °C) | Commercial (0 to +85 °C) | Commercial (0 to +85 °C) | Commercial (0 to +85 °C) |
| Speed Grade | 7 (I7) | 7 (I7) | 8 (C8, faster) | 8 (C8, faster) | 7 (C7, equivalent timing) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
关键差异点
- Highest industrial-temperature spec-grade variant of the Cyclone I family in the 324-FBGA （对比 EP1C12F324C7N)
- RoHS-compliant lead-free alternative available as a true drop-in （对比 EP1C12F324I7N)
- Speed grade 7 (I7) versus 8 (C8) - the I7 variant is preferred for industrial noise-margin robustness （对比 EP1C12F324C8N)
设计说明
The EP1C12F324I7 requires a stable 1.5 V core supply with a tolerance of ±5% and a separate 3.3 V I/O supply. Decouple VCCINT with one 100 µF tantalum plus four 0.1 µF X7R ceramic capacitors placed adjacent to the BGA power balls. Use a dedicated LDO (e.g., Altera-recommended LT1963 or equivalent) rather than sharing the FPGA core rail with other ICs to avoid in-rush coupling during configuration. ICCINT current scales with toggle rate; estimate worst-case at 500 mA typical for a fully utilized 12,060-LE design running at 200 MHz.
The 324-FBGA package has a 1.0 mm ball pitch, requiring a 4- or 6-layer PCB with microvia (laser-drilled) stack-up. Route all signals on inner layers with microvias from the top pad; never route traces under the BGA on the top layer. Use 50 Ω controlled-impedance traces for LVDS and clock pairs, and length-match within 150 mils for DDR interfaces. Exposed die-pad ground balls must be soldered to a continuous ground pour to meet thermal and signal-integrity requirements.
Do not confuse the EP1C12F324I7 with the EP1C12F256I7 (256-FBGA package, lower I/O count of 185). The 'F324' suffix denotes the 324-ball package. Configuration mode (AS, AP, PS, JTAG) must be set via MSEL pins before power-up; incorrect settings prevent bitstream loading. The Cyclone I device does not support passive serial with continuous decompression - use passive serial (PS) mode with EPCS serial PROMs for the simplest configuration path.
合规信息
Compliance status not explicitly stated in provided web data; the lead-free variant (EP1C12F324I7N) is RoHS-compliant per standard Altera/Intel part-number suffix convention.
