Intel

EP4CE22F17I7N - Cyclone IV E FPGA, 22K LE, 256-FBGA | Intel

料号: EP4CE22F17I7N ✓ 量产中
有现货 1-3 个工作日内发货
1.2 V (typical); 1.0 V operation supported Vdss 256-ball FBGA (F17) Package 20 Speed 608,256 bits (594 Kbits) Memory
低至 $43.4 USD / 件
最小起订量: 1 |
价格更新于: 2026-09-09
批量定价
数量 单价 小计
1 $69.44 $69.44
10 $62.5 $625.00
100 $55.55 $5,555.00
500 $48.61 $24,305.00
1,000 $43.4 $43,400.00
ℹ️ 所有价格均以 USD 计价

EP4CE22F17I7N 概述

The Intel (Altera) EP4CE22F17I7N is a Cyclone IV E field-programmable gate array (FPGA) with 22,320 logic elements, 608,256 bits of embedded memory, and 153 maximum user I/O pins, housed in a 256-ball FineLine BGA (FBGA) package. Built on a low-power 60 nm process, this device combines high logic density with a 1.2 V core voltage and a 1.0 V operating range typical of the Cyclone IV E family.

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks and multipliers. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) -> CPLDs/FPGAs -> digital logic ICs -> semiconductors. Unlike an ASIC, an FPGA's function is defined after manufacture by loading a configuration bitstream into SRAM cells, enabling rapid prototyping and field upgrades.

Key features of the EP4CE22F17I7N include up to 22,320 logic elements, 594 Kbits (76 Kbits M9K + 4 Mbits of total) of embedded RAM arranged in M9K blocks, 66 embedded 18x18 multipliers for DSP operations, four general-purpose PLLs, and a hard memory controller. The 256-pin FBGA package supports high-speed LVDS signaling and offers ample I/O bandwidth for parallel interfaces, video, and embedded processing pipelines.

Architecturally, Cyclone IV E devices use a sea-of-LABs fabric with 8-input adaptive logic modules (ALMs), each containing two combinational adaptive LUTs and two registers. The device integrates embedded transceivers-free, low-cost I/O, multi-standard support (LVDS, SSTL, HSTL, PCI Express soft IP), and a dedicated AES encryption block for secure configuration bitstream loading. Configuration modes include JTAG, AS, PS, and FPP.

Typical applications for this FPGA include industrial motor control, video surveillance and image processing, low-cost ASIC prototyping, embedded vision, automotive driver-assistance pre-processing, communications protocol bridging, and test & measurement instrumentation. Designers frequently pair the EP4CE22F17I7N with external DDR2/DDR3 SDRAM, QDR II+ SRAM, and LVDS-interfaced ADCs/DACs.

When designing with this part, pay attention to power sequencing: the 1.2 V core and PLL analog supply must ramp before or simultaneously with I/O banks to avoid latch-up. Use the Quartus Prime design software for synthesis, place-and-route, and timing closure; the EP4CE22 family is supported by both the Quartus Prime Lite (free) and Standard editions.

This page synthesizes distributor pricing, drop-in replacement options within the Cyclone IV E family, and practical design notes not aggregated on a single manufacturer or distributor page.

直接替换替代料: EP4CE22F17I7N ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: EP4CE22F17I7N (相同外形与封装尺寸) ——差异在于 Package, Configuration Modes, Process Technology, Operating Temperature, RoHS Status.

Altera
Package: 256-pin FBGA (F17)
Configuration Modes: JTAG, Active Serial (AS), Passive Serial (PS)
Process Technology: 60 nm low-power
对比 EP4CE22F17I7N →
Intel
Package: FBGA-324 (F19)
Configuration Modes: JTAG, Active Serial, Passive Serial
Process Technology: 60 nm
对比 EP4CE22F17I7N →
Intel
Package: 780-BGA (FBGA-780)
Configuration Modes: JTAG / Active Serial (AS) / Passive Parallel (PP)
Operating Temperature: -40C to +85C (Industrial)
对比 EP4CE22F17I7N →
Altera
Package: 256-FBGA (17x17 mm, 1.0 mm pitch)
Configuration Modes: JTAG, Active Serial, Passive Serial
Process Technology: 60 nm low-power
对比 EP4CE22F17I7N →

快速对比工具——选择替代料号进行并排对比:

EP4CE22F17C7N

✅ 直接替换
📦 256-FBGA (F17)
same die and package, commercial 0C-85C temperature grade vs industrial -40C-100C; pin-to-pin compatible

📋 参考替代料(不在目录中)

EP4CE22F17C8N

✅ 直接替换
📦 256-FBGA (F17)
same die and package, commercial 0C-85C, speed grade 8 (faster Fmax); pin-to-pin compatible

📋 参考替代料(不在目录中)

EP4CE22F17A7N

✅ 直接替换
📦 256-FBGA (F17)
same die and package, automotive -40C-125C AEC-Q100 grade; pin-to-pin compatible

📋 参考替代料(不在目录中)

EP4CE22U14I7N

✅ 直接替换 ⚠️ 规格未核验
📦 256-FBGA (F17)
same die and package, ultra-high I/O count variant (U14 family, same FBGA footprint); pin-to-pin compatible

📋 参考替代料(不在目录中)

EP4CE22F17I7

✅ 直接替换
📦 256-FBGA (F17)
same die, tray packaging variant (N suffix denotes tape-and-reel); pin-to-pin compatible

📋 参考替代料(不在目录中)

EP4CE15F17I7N

✅ 直接替换
📦 256-FBGA (F17)
lower density 15,408 LEs vs 22,320 LEs (-31%), same 256-FBGA footprint; pin-to-pin compatible but reduced logic capacity

📋 参考替代料(不在目录中)

EP4CE22F17I7N 最大额定值与电气特性

Series Cyclone IV E
Logic Elements (LE) 22,320
Embedded Memory 608,256 bits (594 Kbits)
Embedded Memory Blocks 66 M9K blocks
Embedded 18x18 Multipliers 66
Maximum User I/O Pins 153
General-Purpose PLLs 4
Global Clock Networks 20
Process Technology 60 nm low-power CMOS
Core Voltage (VCCINT) 1.2 V (typical); 1.0 V operation supported
Operating Temperature Grade Industrial (-40C to +100C), I7 grade
封装 256-ball FBGA (F17)
安装类型 Surface Mount
Configuration Mode JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP)
RoHS 状态 Compliant
Lead-Free Yes
MSL 等级 3 (per JEDEC J-STD-020)

EP4CE22F17I7N 256-ball fbga (f17) 引脚配置指南

EP4CE22F17I7N(256-ball fbga (f17) 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

EP4CE22F17I7N 的 256-ball fbga (f17) 封装引脚图

暂无详细引脚数据: EP4CE22F17I7N.

请参阅 数据手册 以查看完整引脚配置。

典型应用

EP4CE22F17I7N 适用于 7 应用s: Industrial Motor Control, Video Surveillance / Image Processing, ASIC Prototyping, Communications Protocol Bridging, Test & Measurement Instrumentation, Automotive Driver-Assistance Pre-Processing, LED Display & Signage Controllers.

🏭

Industrial Motor Control

The EP4CE22F17I7N fits industrial motor control because its 22,320 logic elements and 66 18x18 hardware multipliers support field-oriented control (FOC) algorithms, space-vector PWM, and encoder interfaces simultaneously. Industrial servo drives typically require 10-20K LEs for the control loop, leaving headroom for safety logic and CANopen/EtherCAT communication. The 256-FBGA package provides 153 user I/Os, sufficient for parallel ADC sampling of three-phase currents at 50 kSPS, plus isolated gate-driver PWM outputs and incremental encoder inputs.

🎥

Video Surveillance / Image Processing

The EP4CE22F17I7N suits entry-level video surveillance and image preprocessing with its 594 Kbits of embedded M9K memory and 66 hardware multipliers for 2D convolution and Sobel edge detection. The device can ingest a 720p DVP/ITU-R BT.656 video stream and run motion-detection pipelines at 30-60 fps without an external DSP. The 256-FBGA package's 153 I/Os accommodate parallel sensor interfaces and DDR2 SDRAM controllers (via soft IP) for frame buffering, enabling compact IP-camera designs with on-FPGA analytics.

🔧

ASIC Prototyping

The EP4CE22F17I7N provides a high-fidelity prototyping platform for ASIC RTL verification, with 22,320 LEs emulating approximately 2-3 million ASIC gates when accounting for 4-6x LUT-to-gate ratio. The 256-FBGA package exposes 153 I/Os for connecting to testbench ASIC pad models, and the 4 PLLs allow ASIC clock-domain emulation with controllable skew. Quartus Prime supports industry-standard Verilog/VHDL simulation flows and time-domain switching for multi-clock ASIC verification.

🌐

Communications Protocol Bridging

The EP4CE22F17I7N handles protocol bridging between industrial buses (PROFIBUS, Modbus, CAN, SPI, UART, I2C) and Ethernet thanks to its abundant logic resources and 153 I/Os. Industrial protocol gateways typically need 8-15K LEs for stack processing plus MAC/PCS logic; the EP4CE22 leaves 30-40% headroom for application-layer processing. LVDS support at up to 840 Mbps per pair enables connection to high-speed LVDS-based ADCs or inter-FPGA links in modular systems.

🖥️

Test & Measurement Instrumentation

The EP4CE22F17I7N fits portable test and measurement instruments with its 66 hardware multipliers accelerating FFT/IFFT, FIR filtering, and digital modulation/demodulation. The 594 Kbits of block RAM stores sample buffers and windowing coefficients, while the 4 PLLs generate precise sample clocks for 16-bit ADCs at 100+ MSPS. Industrial-grade temperature range (-40C to +100C) supports outdoor or factory-floor deployments where consumer FPGAs would fail.

🚗

Automotive Driver-Assistance Pre-Processing

Although the EP4CE22F17I7N itself is industrial-grade (I7 suffix), designers select it as a low-cost pre-processor for ADAS sensor fusion in development platforms. Its 22,320 LEs handle radar FFT preprocessing, ultrasonic sensor timestamping, and CAN-FD bus arbitration simultaneously. The 153 I/Os accept 4-8 ultrasonic channels plus LVDS radar data streams. For production, designers migrate to the pin-compatible automotive-grade EP4CE22F17A7N (AEC-Q100) without PCB changes.

📺

LED Display & Signage Controllers

The EP4CE22F17I7N drives large LED video walls and signage controllers with its abundant logic for hub75 chain multiplexing and color-space conversion pipelines. 594 Kbits of M9K memory buffers 1-2 scan lines of video at 32-bit depth, and 153 I/Os multiplex to 8-12 parallel hub75 data channels. The industrial temperature grade ensures reliable operation in outdoor or semi-outdoor enclosures where display cabinets experience thermal cycling.

What is the logic element count of EP4CE22F17I7N?
The EP4CE22F17I7N contains 22,320 logic elements (LEs), organized as 22,320 adaptive logic modules (ALMs) in the Cyclone IV E fabric. According to the Cyclone IV Device Handbook, each ALM contains two combinational adaptive LUTs and two dedicated registers, giving designers approximately 44,640 effective 4-input LUT equivalents for fine-grained logic, DSP pre/post-processing, and state-machine implementation.
How much embedded memory does EP4CE22F17I7N have?
The EP4CE22F17I7N integrates 608,256 bits (594 Kbits) of embedded SRAM arranged as 66 M9K blocks, each 9 Kbits with parity support. The M9K blocks can be configured as RAM, ROM, shift registers, or FIFO buffers, with true dual-port and simple dual-port modes supporting independent read/write clocks up to 250 MHz in the Cyclone IV E family.
How many DSP multipliers does EP4CE22F17I7N provide?
The EP4CE22F17I7N provides 66 dedicated 18x18 hardware multipliers that can be combined to implement 9x9, 18x18, 27x27, or 36x36 signed/unsigned multiplications, or 18x18 complex multiplications. These multipliers support DSP workloads such as FIR filters, FFT butterflies, and matrix operations at speeds up to 250 MHz per multiplier.
Where can I buy EP4CE22F17I7N and what is the current price?
As of 2026-09-10, the EP4CE22F17I7N is in stock at DigiKey (per the DigiKey product page), Mouser, Arrow, and Heisener, with the unit price starting at $69.44 for quantity 1. Heisener lists in stock with same-day shipping. For volume quotes, request pricing through Arrow or Avnet directly, as bulk discounts typically reduce unit price by 30-50%.
What is the lead time for EP4CE22F17I7N orders?
Heisener reports the EP4CE22F17I7N ships immediately with an estimated delivery window of Aug 10 - Aug 15 for expedited shipping as of 2026-09-10. DigiKey and Mouser show factory stock with same-day shipment available. The part is not listed as NRND or obsolete on any major distributor, so standard lead time is 2-6 weeks for production-volume orders.
What is the difference between EP4CE22F17I7N and EP4CE22F17C8N?
The EP4CE22F17I7N is the industrial-temperature variant rated -40C to +100C with a 1.0 V/1.2 V core, while the EP4CE22F17C8N is the commercial-temperature variant rated 0C to +85C at 1.2 V only. Both share the same 256-ball FBGA package, 22,320 LEs, and pin-to-pin compatibility, allowing designers to drop in the I7 grade for harsher thermal environments.
What is the difference between EP4CE22F17I7N and EP4CE15F23C7?
The EP4CE22F17I7N offers 22,320 logic elements in the 256-ball FBGA package, while the EP4CE15F23C7 provides only 15,408 LEs in a different 484-ball FBGA package. The EP4CE22 is a logic/memory upgrade path but cannot be a drop-in replacement for the EP4CE15F23C7 due to differing package footprints and pinouts. Choose EP4CE22 for higher density; EP4CE15 for designs already laid out for the F23 package.
When should I choose EP4CE22F17I7N over EP4CE115F23I7N?
Choose the EP4CE22F17I7N when your design needs under 22,320 logic elements and you want to minimize unit cost ($69 vs $200+ for the EP4CE115). Choose the EP4CE115F23I7N when your design requires more than ~80K LEs, additional DSP blocks, or a larger transceiver/memory subsystem. Both share the same Quartus Prime toolchain and IP catalog, easing migration.
What is the best drop-in replacement for EP4CE22F17I7N?
The closest drop-in replacement for the EP4CE22F17I7N is the EP4CE22F17C7N - same 256-ball FBGA footprint, same 22,320 LEs, same 66 M9K memory blocks, only differing by commercial 0C-85C temperature grade instead of industrial -40C-100C. For higher performance, the EP4CE22F17C8N offers faster speed grade 8 in the same package.
Is there an Intel/Altera equivalent for EP4CE22F17I7N from Lattice or AMD/Xilinx?
A direct cross-brand drop-in equivalent does not exist for the EP4CE22F17I7N because no Lattice or Xilinx device shares the identical 256-ball FBGA pinout. The closest functional substitutes are the Lattice ECP5 LFE5U-25F-8BG256C (lower density, different package ballmap) and Xilinx Spartan-6 XC6SLX25-3FTG256 (legacy, different toolchain). These require PCB redesign, not drop-in replacement.
Where can I download the EP4CE22F17I7N datasheet PDF?
The official Cyclone IV Device Datasheet covering the EP4CE22F17I7N is available as a 42-page PDF from Altera/Intel at https://www.alterasemi.com/datasheet/alterasemi/EP4CE22F17I7N.pdf. The Cyclone IV Device Handbook, which includes detailed information on configuration, transceivers, I/O features, and memory interfaces, can be downloaded from the Intel FPGA documentation library at intel.com.
Where can I find the EP4CE22F17I7N pinout for the 256-FBGA?
The pinout for the EP4CE22F17I7N 256-ball FBGA is documented in the Cyclone IV Device Datasheet Pin-Outs section, with bank assignments, differential pair mapping, and dedicated configuration pin locations. Intel's Pin-Out Files (.qsf/.csv) are available for download in the Cyclone IV Pin Connection Guidelines document, and the Quartus Prime Pin Planner can autogenerate the diagram once a device is selected.
What software is needed to program EP4CE22F17I7N?
Program the EP4CE22F17I7N using Intel Quartus Prime Lite (free, supports Cyclone IV E fully) or Quartus Prime Standard/Pro for advanced features. Design flow: write RTL in Verilog/VHDL/SystemVerilog, synthesize with Quartus, place-and-route, generate .sof/.pof bitstream, and load via JTAG (USB-Blaster) or Active Serial EPCS/EPCQ configuration device. Cyclone IV E devices are not supported by newer Quartus Prime Pro features.
What are the key specifications of EP4CE22F17I7N that engineers should know?
The EP4CE22F17I7N is a Cyclone IV E FPGA with 22,320 logic elements, 594 Kbits of embedded memory in 66 M9K blocks, 66 18x18 hardware multipliers, 4 PLLs, 153 maximum user I/O, and a 256-ball FBGA package. Core voltage is 1.2 V (with 1.0 V low-power mode supported), industrial -40C to +100C operating range, and 60 nm low-power process. It is supported by Quartus Prime Lite (free) and integrates hard AES configuration bitstream encryption.

工程参考数据: EP4CE22F17I7N ——对比、设计指导和合规信息。

选型指南

Choose the EP4CE22F17I7N when your design needs 15K-22K logic elements in an industrial-temperature (-40C to +100C) Cyclone IV E FPGA, with 153 I/Os and a 256-ball FBGA footprint. The industrial grade makes it ideal for outdoor enclosures, factory automation, and automotive prototype work. If your design runs only at room temperature, the EP4CE22F17C7N offers cost savings. If you need faster Fmax for high-speed DSP, choose the EP4CE22F17C8N. For AEC-Q100 automotive production, the EP4CE22F17A7N is the pin-compatible alternative. Avoid the EP4CE15F17I7N unless your design fits within 15,408 LEs - the LE reduction from 22K to 15K can force architectural changes. All alternatives share the same 256-FBGA pinout, so PCB redesign is not required.

与替代料对比

参数 本产品 EP4CE22F17C7N EP4CE22F17C8N EP4CE22F17A7N EP4CE22F17I7 EP4CE15F17I7N
Brand Intel Intel Intel Intel Intel Intel
Package 256-FBGA (F17) 256-FBGA (F17) - same 256-FBGA (F17) - same 256-FBGA (F17) - same 256-FBGA (F17) - same 256-FBGA (F17) - same
Logic Elements 22,320 22,320 22,320 22,320 22,320 15,408
Embedded Memory 594 Kbits 594 Kbits 594 Kbits 594 Kbits 594 Kbits 516 Kbits
Embedded 18x18 Multipliers 66 66 66 66 66 56
Maximum User I/O 153 153 153 153 153 153
Temperature Grade Industrial -40C to +100C Commercial 0C to +85C Commercial 0C to +85C Automotive -40C to +125C (AEC-Q100) Industrial -40C to +100C Industrial -40C to +100C
Speed Grade 7 7 8 (faster) 7 7 7
Estimated Unit Price (qty 1) $69.44 Lower (commercial grade) Similar / slightly higher Higher (AEC-Q100) Similar Lower (reduced LE)

关键差异点

  • Industrial temperature grade in a low-cost Cyclone IV E (对比 EP4CE22F17C7N)
  • Faster speed grade option in same package (对比 EP4CE22F17C8N)
  • Automotive-grade migration path (对比 EP4CE22F17A7N)

设计说明

The EP4CE22F17I7N requires multiple supply rails: VCCINT (1.2 V core), VCCA (2.5 V PLL analog), VCCD_PLL (1.2 V PLL digital), and per-bank VCCIO (1.2/1.5/1.8/2.5/3.3 V). Power sequencing per Cyclone IV Device Handbook: VCCINT and VCCA must ramp together, and VCCIO banks must not exceed VCCINT by more than 0.4 V during ramp-up to avoid latch-up. Use a dedicated power supervisor (e.g., TPS3808 or ADM1085) to enforce sequencing, especially in hot-swap or battery-tolerant designs.

The 256-ball FBGA has 1.0 mm pitch - escape routing requires 4-6 layer PCB with 0.2-0.3 mm laser micro vias or 0.4 mm via-in-pad for BGA fanout. Per Cyclone IV Device Handbook pin connection guidelines, decouple every VCCINT and VCCIO pin with a 0.1 uF X7R capacitor placed within 100 mils of the supply ball. Use a continuous power plane on an inner layer for VCCINT and stitch VCCIO with vias around the BGA perimeter.

Estimated: Differential LVDS pairs require matched-length routing within 50 mils and 100-ohm differential impedance; the 256-FBGA allows up to 68 LVDS channels. Dedicated clock inputs (CLK0-CLK15) should be routed on inner stripline layers with via counts minimized; reference CLK inputs to global clock network pins only for best skew performance. JTAG chain signals (TCK, TMS, TDI, TDO) need 4.7 kohm pull-ups on TCK/TMS/TDI per the configuration handbook.

Do not leave nCONFIG, nSTATUS, or CONFIG_DONE floating - tie nCONFIG to VCCA through a 4.7 kohm pull-up, and nSTATUS/CONFIG_DONE need 10 kohm pull-ups to VCCA. Failure to pull these up can cause intermittent configuration failures or JTAG chain lockups. Also, CONF_DONE pin must not be driven externally during configuration; use a 10 kohm pull-up to VCCIO of the bank it resides in.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
无铅
Yes
无卤
Unknown
冲突矿物
Compliant

RoHS and lead-free per Altera/Intel product page; AEC-Q100 qualification available only on the A7 automotive variant (EP4CE22F17A7N). The I7 grade is industrial (-40C to +100C), not automotive.

数据核验日期: 2026-09-10 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

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相关元器件 & 术语

Intel Altera EP4CE22F17I7N EP4CE22F17C7N EP4CE22F17C8N EP4CE22F17A7N EP4CE15F17I7N FPGA field-programmable gate array programmable logic device Cyclone IV E logic element adaptive logic module M9K memory block embedded multiplier phase-locked loop FBGA fine-pitch ball grid array surface mount Quartus Prime JTAG AEC-Q100 RoHS REACH industrial temperature grade LVDS
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