EP1C6F256I7 - Cyclone FPGA, 5980 LE, 185 I/O, 256-BGA | Intel
料号： EP1C6F256I7 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $41.93 | $41.93 |
| 10 | $38.5 | $385.00 |
| 100 | $32.1 | $3,210.00 |
| 500 | $27.45 | $13,725.00 |
| 1,000 | $23.8 | $23,800.00 |
EP1C6F256I7 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic function is defined after manufacture by the user, via a configuration bitstream loaded into on-chip SRAM. The Cyclone family sits in the low-power, low-cost tier of Intel's FPGA portfolio, sitting hierarchically below Cyclone II/III/IV/V and above MAX CPLDs in the company's programmable-logic taxonomy. FPGAs are most often chosen when an application requires parallelism, custom I/O timing, or hardware acceleration that microcontrollers and DSPs cannot deliver economically.
Key features of the EP1C6F256I7 include two PLL blocks for clock synthesis and skew management, support for multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL, and LVDS on selected banks), embedded multipliers for DSP-style arithmetic, and a configuration scheme compatible with active serial (AS), passive serial (PS), and JTAG modes. The device's RAM blocks total 92 Kbits, distributed across the fabric for efficient FIFO and buffering implementations.
Architecturally, the EP1C6F256I7 uses a 4-input LUT-based logic element with associated carry chain for fast arithmetic and an adjacent programmable register. Interconnect uses Altera's MultiTrack routing fabric with row and column lines optimized for typical designs at 100-200 MHz system clock rates. Embedded multiplier blocks accelerate DSP operations without consuming general logic resources.
Typical applications include industrial control interfaces, low-cost video processing bridges, custom peripheral glue logic, motor control co-processors, and protocol bridging (UART/SPI/I2C to parallel buses). The 256-FBGA footprint also makes it a common choice for space-constrained prototypes migrating from larger QFP-packaged FPGAs.
When designing with this device, note that the FBGA package requires X-ray or BGA rework for prototyping - engineers typically use a socketed development board first. Configuration storage requires a separate serial configuration device (EPCS1/EPCS4), and unused I/O banks should be powered according to the datasheet to avoid leakage. JTAG access via the dedicated TCK/TMS/TDI/TDO pins is the recommended bring-up path.
This page synthesizes distributor pricing, same-family Cyclone drop-in alternatives, and practical design notes not found in the original datasheet alone.
直接替换替代料： EP1C6F256I7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1C6F256I7 （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Operating Temperature, Speed Grade, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
EP1C6F256I7N
✅ 直接替换✓ 有现货
$27.94 / 个
查看数据手册 →EP1C6F256C8N
✅ 直接替换✓ 有现货
$21.4 / 个
查看数据手册 →EP1C6F256C7N
✅ 直接替换✓ 有现货
$18.2 / 个
查看数据手册 →EP1C12F256I7N
✅ 直接替换✓ 有现货
$47.85 / 个
查看数据手册 →EP1C12F256C8N
✅ 直接替换✓ 有现货
$15.1 / 个
查看数据手册 →EP2C8F256I7
✅ 直接替换📋 参考替代料（不在目录中）
EP1C6F256I7 最大额定值与电气特性
| Family | Cyclone |
| Logic Elements (LE) | 5,980 |
| Logic Array Blocks (LAB) | 598 |
| Total RAM Bits | 92,160 |
| Embedded Multipliers (18x18) | 20 |
| PLLs | 2 |
| Maximum User I/O | 185 |
| Process Technology | 130 nm |
| Core Voltage | 1.5 V |
| 封装 | 256-ball FBGA (F256) |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +100C (industrial) |
| Speed Grade | -7 |
| Configuration Mode | AS / PS / JTAG |
| RoHS 状态 | Depends on specific order code; verify per lot |
EP1C6F256I7 256-ball fbga (f256) 引脚配置指南
EP1C6F256I7（256-ball fbga (f256) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1C6F256I7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1C6F256I7 适用于 6 应用s: Industrial Control Glue Logic, Motor Control Co-Processor, Custom Video / Display Bridge, Low-Cost Hardware Accelerator Card, Test & Measurement Front-End, Communications Protocol Converter.
Industrial Control Glue Logic
The EP1C6F256I7's 5,980 logic elements and 185 user I/Os provide ample headroom for industrial glue logic that bridges legacy and modern interfaces. The 256-FBGA package's 185 I/Os comfortably accommodate typical 32-bit parallel bus expansions plus dedicated SPI, I2C, and UART pins. Industrial temperature grade (-40C to +100C) ensures reliable operation in factory-floor enclosures. Two PLLs synthesize clocks for both the system logic and isolated sensor sampling channels.
推荐
Motor Control Co-Processor
The EP1C6F256I7's 20 embedded 18x18 multipliers and two PLLs are ideal for motor control algorithms such as Field-Oriented Control (FOC) and Space Vector PWM. The fabric executes current-loop calculations at the required 10-20 kHz switching rate while offloading position/speed estimation from the host MCU. Industrial temperature grade and 185 I/Os support encoder, Hall-sensor, and PWM-channel interfaces simultaneously.
推荐
Custom Video / Display Bridge
The EP1C6F256I7 can bridge between RGB parallel camera inputs, BT.656/601 video streams, and LVDS display outputs using its embedded multipliers for chroma resampling and 2D scaling operations. Two PLLs synthesize pixel clocks independently from the system reference. The 256-FBGA package's 185 I/Os accommodate 24-bit RGB plus control and sync signals without external bus multiplexing.
推荐
Low-Cost Hardware Accelerator Card
Engineers building custom PCIe, USB, or Ethernet-attached accelerator cards often pair the EP1C6F256I7 with a host CPU to offload specific algorithms - CRC32, Reed-Solomon FEC, AES, or custom DSP - that benefit from FPGA parallelism. The 92 Kbits of embedded RAM suffices for small FIFOs and lookup tables; larger datasets stream from host memory via DMA. Industrial temperature grade suits server-room or rugged edge deployment.
推荐
Test & Measurement Front-End
The EP1C6F256I7 serves as a flexible pattern generator, capture buffer, or protocol exerciser in custom test equipment. Its 185 I/Os handle multi-channel digital acquisition or stimulus, while the embedded multipliers accelerate FFT or correlation functions for signal-integrity analysis. Industrial temperature grade and the rugged 256-FBGA package make it suitable for production ATE fixtures operating in varied environmental conditions.
推荐
Communications Protocol Converter
The EP1C6F256I7 is widely used as a multi-protocol converter - bridging UART, SPI, I2C, CAN, LIN, and custom serial buses between heterogeneous MCUs or ASICs. Its flexible I/O banks support 3.3V LVCMOS alongside 5V-tolerant inputs (with proper bus-keeper configuration), enabling direct interface to legacy industrial nodes. The 5,980 LE budget accommodates state-machine-based protocol stacks with timing margins.
推荐
推荐产品汇总
工程参考数据： EP1C6F256I7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1C6F256I7N | EP1C6F256C8N | EP1C6F256C7N | EP1C12F256I7N | EP2C8F256I7 |
|---|---|---|---|---|---|---|
| Package | 256-ball FBGA | 256-ball FBGA (same) | 256-ball FBGA (same) | 256-ball FBGA (same) | 256-ball FBGA (same) | 256-ball FBGA (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | |
| Logic Elements (LE) | 5,980 | 5,980 | 5,980 | 12,060 | 8,256 | |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | |
| Speed Grade | -7 | -7 | -8 | -7 | -7 | |
| Embedded RAM (bits) | 92,160 | 92,160 | 239,616 | 165,888 | ||
| PLLs | 2 | 2 | 2 | 4 | ||
| Embedded 18x18 Multipliers | 20 | 20 | 52 | 36 | ||
| Lead-Free / RoHS | Depends on order code | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | |
| Process Node | 130 nm | 130 nm | 90 nm | |||
| Lifecycle Status | NRND | NRND | NRND | NRND (Cyclone II series) |
关键差异点
- Pb-free / RoHS drop-in option within same family （对比 EP1C6F256I7N)
- Doubling logic density in same package （对比 EP1C12F256I7N)
- Cyclone II upgrade path with reduced power （对比 EP2C8F256I7)
- Same-family commercial-temperature option （对比 EP1C6F256C8N)
设计说明
The 256-ball FBGA package has 1.0 mm ball pitch and requires 4-6 layer PCB with microvia or via-in-pad technology for reliable assembly. Recommended land pad diameter is 0.4-0.45 mm with NSMD (Non-Solder Mask Defined) pads. X-ray inspection is mandatory after reflow since BGAs cannot be visually inspected from above. Allocate at least 4 decoupling capacitors (100 nF, 10 nF, 100 uF bulk) within 5 mm of each power pin group, following the Altera Cyclone Hardware Reference manual decoupling recommendations for the F256 package.
Configuration failure is the most common Cyclone bring-up issue. Verify MSEL[2..0] pins are pulled to the correct levels for your chosen mode (AS=000, PS=001, JTAG=101) before power-up. For AS mode, ensure nSTATUS and CONF_DONE lines have 10 kohm pull-ups to VCCIO (3.3V) and the EPCS device's nCS pin is connected to the FPGA's dedicated nCSO pin. Use JTAG mode first to validate the bitstream loads before integrating AS configuration in production firmware.
At typical utilization of 60-70% logic and 100 MHz system clock, the EP1C6F256I7 dissipates approximately 0.6-1.2 W. Without airflow on a 4-layer JEDEC EIA/JESD51 test board, junction-to-ambient thermal resistance (theta_JA) is around 18-22 C/W, yielding junction temperature rise of 11-26 C above ambient. For sealed industrial enclosures, derate by 30-40% and ensure at least 200 LFM airflow. Industrial-grade silicon is rated to 100C case temperature - verify with on-die thermal diode if available.
Single-ended I/O on the EP1C6F256I7 supports LVTTL/LVCMOS up to 3.3V with slew-rate and strength control via Quartus II pin assignments. For LVDS inputs/outputs, the device requires a 100-ohm differential termination near the receiver. Series damping resistors (22-33 ohm) on high-speed edge-rate signals (>100 MHz) reduce overshoot on long PCB traces. Use the Quartus II Timing Analyzer with board trace models for closure on DDR or source-synchronous interfaces.
合规信息
RoHS compliance of EP1C6F256I7 depends on order code suffix: 'N' variants (e.g., EP1C6F256I7N) are Pb-free/RoHS compliant, while the base EP1C6F256I7 part number may contain lead-bearing BGA balls. Verify with distributor material declaration. AEC-Q100 not applicable (FPGA, not automotive-qualified discrete). Conflict minerals compliance should be requested from distributor for new production orders.
