EP1SGX40DF1020I6N - Stratix GX FPGA, 41.25K LEs, 1020-FBGA | Intel
料号： EP1SGX40DF1020I6N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1650 | $165,000.00 |
| 500 | $1550 | $775,000.00 |
| 1,000 | $1450 | $1,450,000.00 |
EP1SGX40DF1020I6N 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic fabric, interconnect, I/O cells, and embedded memory/blocks can be reconfigured by the end user after manufacture. FPGAs sit hierarchically between ASICs (Application-Specific Integrated Circuits) and general-purpose processors: they offer ASIC-class parallelism and deterministic latency while retaining the programmability of software-defined hardware. The Stratix GX family specifically adds hardened multi-gigabit transceivers, making it a sub-class often referred to as an FPGA with SerDes or a communications-grade FPGA, distinguishing it from lower-cost Cyclone families and from non-transceiver Stratix variants.
Key features of the EP1SGX40DF1020I6N include 624 maximum user I/O pins, 4,125 LABs (Logic Array Blocks), 3,423,744 embedded RAM bits, embedded DSP blocks for fixed- and floating-point arithmetic, and 1.5V core supply operation. The 'GX' designation indicates integrated high-speed serial transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet, freeing the user from building serializer/deserializer (SerDes) logic in soft fabric. The 1020-ball FBGA package exposes all transceivers, I/O, configuration, and clock signals while providing excellent signal-integrity characteristics for multi-gigabit signalling.
Typical applications include telecommunications line cards, military/aerospace signal processing, ASIC prototyping, high-speed data-acquisition front-ends, and embedded digital-signal-processing systems. Industrial-grade temperature screening and legacy process maturity make it a long-life-cycle component for OEM programs that must run for 10-15 years.
When designing with this device, ensure your power architecture can supply the 1.5V core rail with sufficient decoupling, and validate pin-out against the 1020-BGA land pattern before PCB fabrication. Configuration is handled via the dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL) - consult the Stratix GX device family datasheet for the supported configuration schemes (Passive Serial, Fast Passive Parallel, JTAG, etc.).
直接替换替代料： EP1SGX40DF1020I6N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1SGX40DF1020I6N （相同外形与封装尺寸） ——差异在于 Operating Temperature, Process Technology, Package, Speed Grade, Family.
快速对比工具——选择替代料号进行并排对比：
EP1SGX40DF1020C6N
✅ 直接替换✓ 有现货
$142 / 个
查看数据手册 →EP1SGX40DF1020I5N
✅ 直接替换✓ 有现货
$388.5 / 个
查看数据手册 →EP1SGX40DF1020I6
✅ 直接替换✓ 有现货
$198 / 个
查看数据手册 →EP1SGX40DF1020I7N
✅ 直接替换✓ 有现货
$2290 / 个
查看数据手册 →EP1SGX40CF1020I5
✅ 直接替换✓ 有现货
$370 / 个
查看数据手册 →EP1SGX40DF1020I6N 最大额定值与电气特性
| Series | Stratix GX |
| Family | Stratix (First Generation) |
| Manufacturer | Intel (formerly Altera) |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Number of Logic Elements (LEs) | 41,250 |
| Number of LABs (Logic Array Blocks) | 4,125 |
| Total RAM Bits | 3,423,744 |
| Maximum User I/O Pins | 624 |
| 封装 / 外壳 | 1020-BBGA / 1020-FBGA |
| Package Size | 33 x 33 mm, 1.0 mm pitch |
| Supplier Device Package | 1020-FBGA (33 x 33) |
| 工作温度 | 0 C to 85 C (industrial grade 'I') |
| Speed Grade | 6 (I6) |
| 安装类型 | Surface Mount (BGA) |
| Logic Family | CMOS (SRAM-based configuration) |
| Packaging | Tray / Bulk |
| Configuration Mode | Passive Serial / Fast Passive Parallel / JTAG (per Stratix GX handbook) |
EP1SGX40DF1020I6N 1020-fbga (33 x 33) 引脚配置指南
EP1SGX40DF1020I6N（1020-fbga (33 x 33) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1SGX40DF1020I6N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1SGX40DF1020I6N 适用于 6 应用s: Telecommunications Line Cards, ASIC Prototyping, Military and Aerospace Signal Processing, High-Speed Data Acquisition Front-Ends, Embedded DSP and Software-Defined Radio, Industrial Networking and Protocol Bridging.
Telecommunications Line Cards
The EP1SGX40DF1020I6N suits telecommunications line-card designs because its integrated multi-gigabit SerDes directly supports protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet without consuming soft logic resources. Its 41,250 logic elements and 3,423,744 RAM bits are sufficient to implement packet-processing engines, traffic managers, and serializer/deserializer framer logic. The industrial 0C-85C temperature screening allows deployment in central-office equipment that must operate 24/7 over 10-15 year life cycles. Designers can rely on the Stratix GX handbook reference designs for backplane interconnects.
推荐
ASIC Prototyping
The EP1SGX40DF1020I6N is well established as an ASIC prototyping vehicle. Its 41,250 logic elements and 3.4 Mbit of embedded RAM reproduce the bulk of mid-density ASIC RTL within a single device, while the hardened DSP blocks accelerate arithmetic-intensive pre-silicon verification. Designers partition larger ASICs across multiple FPGAs using chip-to-chip SerDes channels for high-bandwidth pin-multiplexing. Quartus II software (and Pro/Standard for newer devices) provides timing-driven place-and-route and synthesis support. The 1020-FBGA exposes sufficient I/O (up to 624 user I/O) for prototype-to-ASIC pin mapping.
推荐
Military and Aerospace Signal Processing
The EP1SGX40DF1020I6N's industrial-grade temperature screening (0C-85C) and long-life-cycle availability make it applicable to military and aerospace signal-processing platforms such as radar front-ends, electronic-warfare subsystems, and SIGINT receivers. The integrated SerDes channels carry digitized RF samples to downstream processors, while the embedded DSP blocks perform FFT, digital down-conversion, and pulse-Doppler processing. Programs that already standardized on first-generation Stratix GX can maintain supply chains through Rochester Electronics and authorized brokers. For full MIL-PRF screening, the equivalent military part number should be ordered through the appropriate MIL-supply channel.
推荐
High-Speed Data Acquisition Front-Ends
In data-acquisition front-ends, the EP1SGX40DF1020I6N's hardened SerDes channels accept digitized samples from high-speed ADCs and route them into on-chip RAM buffers or out through parallel LVDS links. The 3.4 Mbit of embedded RAM supports multi-channel DMA buffering at hundreds of MSPS sample rates. Designers can build digital down-conversion, channelization, and trigger logic in the 41,250-LE fabric. The industrial temperature grade supports laboratory and field-deployable instrumentation. Quartus II MegaWizard Plug-In Manager provides turnkey IP for common ADC interface protocols (LVDS, DDR, JESD204 equivalents).
推荐
Embedded DSP and Software-Defined Radio
The EP1SGX40DF1020I6N supports embedded DSP and software-defined radio (SDR) workloads through its hardened DSP blocks (multipliers, adders, accumulators) and 3.4 Mbit of memory. SDR applications such as digital up-/down-conversion, FFT-based spectral analysis, and baseband modem processing fit comfortably within 41,250 logic elements. The integrated multi-gigabit transceivers backhaul digital samples between RF cards and baseband processing modules, removing the need for external SerDes ICs. This combination of DSP density, memory, and SerDes was a hallmark of the Stratix GX generation and remains valuable for long-life SDR programs.
推荐
Industrial Networking and Protocol Bridging
Industrial networking platforms benefit from the EP1SGX40DF1020I6N's mix of multi-gigabit SerDes and substantial general-purpose logic. Designers can build fieldbus-to-Ethernet bridges, real-time Ethernet switches (EtherCAT, PROFINET, EtherNet/IP) and legacy protocol converters inside a single device. The 0C-85C industrial temperature grade is critical for factory-floor equipment where ambient temperatures fluctuate and shock/vibration are common. The 1020-FBGA's high pin count also allows direct connection to DDR SDRAM memories for packet buffering. Reference designs in the Stratix GX handbook illustrate representative industrial-bridging topologies.
推荐
推荐产品汇总
工程参考数据： EP1SGX40DF1020I6N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1SGX40DF1020C6N | EP1SGX40DF1020I5N | EP1SGX40DF1020I6 | EP1SGX40DF1020I7N | EP1SGX40CF1020I5 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-FBGA (33 x 33 mm, 1.0 mm pitch) | 1020-FBGA (33 x 33) - same | 1020-FBGA (33 x 33) - same | 1020-FBGA (33 x 33) - same | 1020-FBGA (33 x 33) - same | 1020-FBGA (33 x 33) - same |
| Logic Elements | 41,250 | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) |
| Temperature Grade | Industrial 0C-85C | Commercial 0C-70C | Industrial 0C-85C | Industrial 0C-85C | Industrial 0C-85C | Industrial 0C-85C |
| Speed Grade | 6 | 6 | 5 (slower) | 6 | 7 (faster) | 5 |
| High-Speed Transceivers | Yes (Stratix GX) | Yes (Stratix GX) | Yes (Stratix GX) | Yes (Stratix GX) | Yes (Stratix GX) | Yes (Stratix GX) |
| Maximum User I/O | 624 | 624 | 624 | 624 | 624 | 624 |
| Embedded RAM Bits | 3,423,744 | 3,423,744 (same die) | 3,423,744 (same die) | 3,423,744 (same die) | 3,423,744 (same die) | 3,423,744 (same die) |
| Core Supply Voltage | 1.425 V - 1.575 V (1.5 V nominal) | 1.425 V - 1.575 V | 1.425 V - 1.575 V | 1.425 V - 1.575 V | 1.425 V - 1.575 V | 1.425 V - 1.575 V |
关键差异点
- Largest logic capacity in the first-generation Stratix GX family at this speed/temperature grade （对比 EP1SGX25DF1020I6N)
- Industrial temperature grade 0C-85C for factory and telecom deployments （对比 EP1SGX40DF1020C6N)
- Speed grade 6 - mid-position in the Stratix GX speed grade range （对比 EP1SGX40DF1020I5N)
设计说明
Estimated power analysis: a fully populated EP1SGX40 at 100% utilization across logic, 3.4 Mbit RAM, DSP blocks, and all SerDes channels can exceed 10 W core dissipation. Use a 4-layer (or more) PCB with a continuous power plane on inner layers, and follow Intel/Altera's Stratix GX power-decoupling recommendation of approximately 20 low-ESR ceramic bypass capacitors per side of the device plus bulk polymer/tantalum capacitors at the voltage regulator outputs. A multi-phase switching controller is recommended for the 1.5 V core rail at high utilization.
The 1020-FBGA at 1.0 mm pitch requires PCB fabrication with microvia (laser-drilled) stack-up - typical 4-6 mil laser vias on 6-8 layer stack-ups. Escape routing in the inner layers should follow either dog-bone or via-in-pad patterns. After PCB assembly, BGA solder joints must be inspected via X-ray or endoscopic optical inspection because the 1020 balls are not visible from the package sides. Plan thermal relief copper pours under the BGA per the package land-pattern recommendation.
For the integrated multi-gigabit SerDes, route the high-speed transceiver channels with controlled-impedance differential pairs (typically 100 ohm differential), keep total length below the Stratix GX handbook maximum for the chosen data rate, and use matched-length tuning within each channel. Avoid routing SerDes lanes across split power planes; use solid reference planes. AC-coupling capacitors (typically 0.01-0.1 uF) are required at the transmitter side per the Stratix GX handbook.
Common pitfalls include: (1) forgetting to set the MSEL configuration-mode pins to match the chosen configuration scheme (Passive Serial, Fast Passive Parallel, JTAG); (2) failing to assert nCONFIG during power-up until the 1.5 V core rail is stable; (3) using commercial-temperature FPGAs in industrial environments; (4) ignoring JTAG pin pull-up/-down requirements during board bring-up. (5) note that 'I6' = industrial + speed grade 6 - if you see 'C6' or 'I5' in the part number, the temperature or speed grade is different even though the package matches.
合规信息
Stratix GX family pre-dates universal RoHS adoption; RoHS status for first-generation Stratix GX should be confirmed with the authorized distributor (Rochester Electronics / Intel FPGA product longevity program).
