EP1SGX25CF672C6 - Stratix GX FPGA 25K LE, 672-BGA | Intel
料号： EP1SGX25CF672C6 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP1SGX25CF672C6 概述
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by the customer after manufacturing, making it suitable for hardware acceleration, rapid prototyping, and custom compute pipelines. FPGAs sit hierarchically under programmable logic devices, then programmable logic, then digital ICs, and finally semiconductors. The Stratix GX family specifically targets applications where both rich parallel logic and multi-Gbps serial I/O are required, integrating clock data recovery (CDR) and SERDES channels directly on-die to simplify board layout and reduce BOM cost.
Key features of the EP1SGX25CF672C6 include 2,852 Configurable Logic Blocks (CLBs), 455 user I/Os, 1,944,576 bits of embedded memory, and built-in transceiver support for protocols such as Gigabit Ethernet, PCI Express, SerialLite II, and XAUI. The device is built on a 130 nm CMOS process, supports a core voltage of 1.5 V, and operates over the commercial 0 C to +85 C temperature range. The package footprint is a 672-ball FineLine BGA optimized for high-speed signal integrity with matched-length routing and dedicated transceiver power/ground pin assignments.
The transceiver architecture includes rate-matching logic compliant with IEEE 802.3 clause 36 for Gigabit Ethernet, ordered-set handling (e.g. /K28.5/+/D16.2/), and per-channel programmable pre-emphasis and equalization. Combined with on-chip PLLs and dedicated clock networks, this enables designers to implement multi-lane serial interfaces without external PHY devices.
Typical applications include communications infrastructure (SONET/SDH, OTN, Gigabit Ethernet switches), high-performance digital signal processing for radar and beamforming, industrial automation with real-time control loops, ASIC prototyping, and custom hardware accelerators for data path offload. The device's combination of high logic density and integrated SERDES makes it especially well-suited to protocols requiring both parallel compute and serial connectivity.
When designing with this device, allocate sufficient decoupling capacitance near each transceiver power pin and follow Altera's recommended PCB stack-up for 3.125 Gbps operation. Verify signal-integrity simulations against the Stratix GX device handbook guidelines, particularly for the 1.0 mm pitch BGA escape routing. Use the Quartus II design software for place-and-route and timing closure.
This page synthesizes distributor pricing, drop-in same-package variants within the Stratix GX family, and practical design notes not consolidated in the manufacturer datasheet.
直接替换替代料： EP1SGX25CF672C6 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1SGX25CF672C6 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Process Technology, Logic Elements.
快速对比工具——选择替代料号进行并排对比：
EP1SGX25CF672C5
✅ 直接替换✓ 有现货
$1304.99 / 个
查看数据手册 →EP1SGX25-CF672-I6
✅ 直接替换✓ 有现货
$168 / 个
查看数据手册 →EP1SGX25CF672I6N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$171 / 个
查看数据手册 →EP1SGX25CF672C7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$338.5 / 个
查看数据手册 →EP1SGX10CF672C6
✅ 直接替换✓ 有现货
$158 / 个
查看数据手册 →EP1SGX25CF672C6 最大额定值与电气特性
| Family | Stratix GX |
| Logic Elements (LE) | 25660 |
| Configurable Logic Blocks (CLB / LAB) | 2852 LABs |
| User I/Os | 455 |
| Embedded Memory Bits | 1944576 |
| Transceiver Channels | 4 to 20 (SERDES up to 3.1875 Gbps) |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| 工作温度 | 0 C to 85 C (commercial) |
| 封装 | 672-BBGA (FBGA-672), 27 x 27 mm, 1.0 mm pitch |
| 安装类型 | Surface Mount (BGA) |
| Lead Free | Yes |
| RoHS 状态 | Compliant (lead-free per DigiKey listing) |
| Design Tool | Quartus II |
| Series Prefix | EP1SGX (Stratix GX first generation) |
EP1SGX25CF672C6 672-bbga (fbga-672), 27 x 27 mm, 1.0 mm pitch 引脚配置指南
EP1SGX25CF672C6（672-bbga (fbga-672), 27 x 27 mm, 1.0 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1SGX25CF672C6.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1SGX25CF672C6 适用于 7 应用s: Gigabit Ethernet Switch Fabric, SONET/SDH and OTN Line-Card Design, ASIC Prototyping and Hardware Emulation, Radar and Beamforming Signal Processing, Industrial Automation and Real-Time Control, PCI Express Endpoint Card Design, Custom Hardware Accelerator for Data-Path Offload.
Gigabit Ethernet Switch Fabric
The EP1SGX25CF672C6 fits Gigabit Ethernet switch fabric designs because its embedded SERDES channels deliver up to 3.1875 Gbps, comfortably covering 1G SGMII and oversampled 10G links when aggregated. Per the Stratix GX handbook, the on-chip rate matcher adheres to IEEE 802.3 clause 36 ordered-set handling, processing /K28.5/+D16.2/ compensation characters automatically without host CPU intervention. The 455 user I/Os expose the device to external PHYs and backplane serdes, while the 1,944,576 bits of embedded memory buffer packet headers and lookup tables for L2/L3 forwarding. Designers place the device between PHY transceivers and the host CPU, using the parallel I/O bank for 16-bit RGMII-style interfaces to secondary MACs.
推荐
SONET/SDH and OTN Line-Card Design
The EP1SGX25CF672C6 fits SONET/SDH and OTN line cards because its 3.1875 Gbps SERDES rate covers OC-48/STM-16 (2.488 Gbps) and OTU1 (2.666 Gbps) with margin, while the 25,660 LEs implement framer, scrambler, and FEC logic in parallel with the serial path. According to the Stratix GX handbook, the embedded PLLs and dedicated clock networks simplify multi-rate clocking for tributary mappings. The 455 I/Os expose the FPGA to mapper ASICs and overhead interfaces, and the FBGA-672 package provides sufficient ground bounce suppression for telecom environments. Designers typically pair this FPGA with an external framer or mapper to build a multi-rate line card that supports both OC-48 and OTU1 protocols from a single hardware platform.
推荐
ASIC Prototyping and Hardware Emulation
The EP1SGX25CF672C6 is well suited to ASIC prototyping because 25,660 LEs plus 1,944,576 embedded memory bits provide enough capacity to map representative sub-blocks of mid-density ASICs, while the 3.1875 Gbps SERDES replicates modern ASIC I/O such as PCIe, SATA, or XAUI in the prototype environment. According to the Stratix GX handbook, the Quartus II design flow supports time-domain multiplexing of large ASIC designs across multiple FPGAs using dedicated clock pins. Engineers map the ASIC netlist into the FPGA, run real-world I/O traffic through the SERDES channels, and verify functional behavior before tape-out. The FBGA-672 footprint provides enough I/Os to break out prototype signals to logic analyzers.
推荐
Radar and Beamforming Signal Processing
The EP1SGX25CF672C6 supports radar and beamforming designs where high-throughput DSP must run alongside multi-gigabit data links. The 25,660 LEs and embedded memory implement FIR filters, FFT kernels, and beam-steering weights, while the 3.1875 Gbps SERDES channels ingest digitized antenna data from ADC ASICs. Per the Stratix GX handbook, the dedicated DSP blocks and block-RAM tiers are tuned for high sample-rate pipelines, and the 455 I/Os route the processed beams to downstream DACs. Designers pair this FPGA with a high-speed ADC such as the ADC081000 family, performing channelization and beamforming entirely on the device before handing the result to a host processor over Ethernet.
推荐
Industrial Automation and Real-Time Control
The EP1SGX25CF672C6 fits industrial automation systems that combine real-time deterministic control loops with high-speed industrial Ethernet such as EtherCAT, PROFINET, or SERCOS III. The 25,660 LEs implement motion-control state machines and safety logic, while the SERDES channels backhaul aggregated sensor data to the factory SCADA layer. According to the Stratix GX handbook, the 1.5 V core and 130 nm CMOS process balance deterministic latency with manageable power dissipation. The 455 user I/Os expose encoder, resolver, and digital I/O banks. Engineers deploy this FPGA in CNC controllers, robotic arms, and high-speed packaging lines where deterministic microsecond response is required.
推荐
PCI Express Endpoint Card Design
The EP1SGX25CF672C6 supports PCIe Gen1 endpoint cards because its 3.1875 Gbps SERDES comfortably covers the 2.5 Gbps PCIe Gen1 physical rate, and the 25,660 LEs implement the PCIe transaction layer, DMA engine, and any user application logic on a single die. Per the Stratus GX handbook, Altera provides a hard PCIe soft-IP core with TLP handling, MSI, and legacy interrupts. The 455 user I/Os expose the device to local DDR memory and application-specific peripherals. Designers use this part for DSP accelerator cards, industrial frame grabbers, and protocol analyzers that need a single-chip PCIe endpoint with substantial parallel compute capacity.
推荐
Custom Hardware Accelerator for Data-Path Offload
The EP1SGX25CF672C6 fits custom data-path acceleration because its 25,660 LEs and 1.9 Mbits of embedded memory can host compression, encryption, regex, or packet-classification engines that offload CPU work over PCIe. The 3.1875 Gbps SERDES channels sustain line-rate ingest from 10G Ethernet or 8G Fibre Channel pipes, while the parallel I/O banks route processed data to DDR memory or directly to a host CPU. According to the Stratix GX handbook, the dedicated multiplier blocks and block-RAM tiers are tuned for streaming workloads with deterministic throughput. Designers deploy this FPGA as a coprocessor in hyperscale storage and networking appliances, where per-watt throughput justifies the FPGA premium over a general-purpose CPU.
推荐
推荐产品汇总
工程参考数据： EP1SGX25CF672C6 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1SGX25CF672C5 | EP1SGX25-CF672-I6 | EP1SGX25CF672I6N | EP1SGX25CF672C7N | EP1SGX10CF672C6 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-BBGA (FBGA-672) | 672-BBGA (FBGA-672) - same | 672-BBGA (FBGA-672) - same | 672-BBGA (FBGA-672) - same | 672-BBGA (FBGA-672) - same | 672-BBGA (FBGA-672) - same |
| Logic Elements | 25660 | 25660 (same) | 25660 (same) | 25660 (same) | 25660 (same) | 10560 (-59%) |
| Speed Grade | C6 | C5 (slower) | I6 (industrial, different grade scale) | I6N (industrial) | C7 (faster) | C6 (same speed) |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | -40 C to 100 C (industrial) | -40 C to 100 C (industrial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| SERDES Data Rate (max) | 3.1875 Gbps | 3.1875 Gbps (same) | 3.1875 Gbps (same) | 3.1875 Gbps (same) | 3.1875 Gbps (same) | 3.1875 Gbps (same) |
| Core Voltage | 1.5 V | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) |
| Lifecycle Status (2026-09-07) | NRND | NRND | NRND | NRND | NRND | NRND |
关键差异点
- Original Stratix GX family integrates SERDES and 25K logic on a single die （对比 EP1SGX10CF672C6)
- Commercial temperature grade with mid-tier speed grade balance （对比 EP1SGX25-CF672-I6)
- C6 speed grade balances cost and Fmax （对比 EP1SGX25CF672C7N)
设计说明
Estimated: EP1SGX25CF672C6 power consumption with all 20 SERDES channels active at 3.1875 Gbps and typical utilization is in the 4-6 W range, dominated by the transceiver analog blocks. Decoupling must include 0.1 uF and 0.01 uF ceramic capacitors placed within 100 mil of every transceiver power pin, plus bulk 10-47 uF tantalum or polymer capacitors on each supply rail. Per the Stratix GX handbook, separate analog and digital ground planes are recommended to prevent switching-induced jitter on the SERDES reference clocks.
The 672-BBGA package at 1.0 mm pitch requires a 4-6 layer PCB stack-up with a continuous ground plane directly beneath the BGA. Escape routing must use microvias (laser-drilled 8 mil pads) on the top layer, with the inner layers reserved for high-speed SERDES differential pairs routed to a 100 ohm differential impedance. Per Altera guidelines, matched-length routing within 5 mils for each SERDES lane and within 25 mils across lanes of the same interface is required to meet the 3.125 Gbps eye mask.
Estimated: do not assume all 672 balls are user I/Os - the FBGA-672 has dedicated transceiver power, ground, reference clock, and configuration pins that occupy a significant fraction of the package. Confusing power-pin assignments with user I/O is a common schematic error that prevents JTAG chain detection. Always cross-reference the schematic against the Quartus II pin-planner output before fabrication. Also note that JTAG chain integrity must be verified at 0 C and 85 C corners, since marginal TDI/TDO paths may fail only at temperature extremes.
Estimated: at the commercial temperature grade (0 C to 85 C) and full-die operation, the FBGA-672 package typically dissipates 3-6 W with a theta-JA in the 12-18 C/W range depending on PCB copper pour. Designers should provide at least four thermal vias in the central ball grid to conduct heat to the inner ground plane; otherwise the junction temperature may exceed 100 C at maximum utilization, causing thermal shutdown. Industrial-grade variants have stricter thermal budgets and require a dedicated heatsink for sustained full-bandwidth SERDES operation.
Per the Stratix GX handbook, transceiver channels should be AC-coupled with 0.1 uF capacitors placed within 200 mil of the FPGA ball, and the differential pair length must be matched to within 5 mils for the TX pair and 5 mils for the RX pair to maintain eye-mask compliance at 3.1875 Gbps. Reference clock routing must be isolated from the SERDES data pairs by at least 3W spacing to prevent coupling. Pre-emphasis and equalization settings should be tuned per-channel using the Quartus II transceiver toolkit.
合规信息
Lead-free and RoHS-compliant per the DigiKey listing and chipdig.com datasheet summary. REACH, halogen-free, and conflict-minerals status were not published in the verified data and are marked unknown.
