EP20K100CQ240C8 - APEX 20K FPGA, 100K Gates, 240-QFP | Intel
料号： EP20K100CQ240C8 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42 | $420.00 |
| 100 | $36.5 | $3,650.00 |
| 500 | $31.25 | $15,625.00 |
| 1,000 | $26.8 | $26,800.00 |
EP20K100CQ240C8 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by the user after manufacture. FPGAs sit in the digital logic hierarchy between discrete gate arrays (ASICs) and CPLDs, offering high gate density, embedded memory blocks, and high-speed I/O. The APEX 20K family introduced the MultiCore architecture, combining logic elements, embedded system blocks (ESBs) for memory and specialty functions, and a high-bandwidth interconnect — a pioneering combination that later influenced the Stratix family. FPGAs are widely used for prototyping, glue logic, signal processing, and low-volume production where ASIC NRE costs are prohibitive.
Key features of the EP20K100CQ240C8 include 4,160 logic elements, 53,248 bits of embedded SRAM organized in ESBs, 189 user I/O pins, and on-chip PLL for clock management. The 240-pin QFP package exposes 189 usable I/O while leaving the remaining pins for power, ground, JTAG, and configuration. The device supports in-system programmability via JTAG (IEEE 1149.1) and configuration via Altera serial/parallel configuration devices.
The device uses a 2.5 V core supply with multi-voltage I/O banks supporting 1.8 V, 2.5 V, and 3.3 V interface standards (LVTTL, LVCMOS, PCI). Typical internal performance supports fast datapath and state-machine operation. The MultiCore architecture combines look-up table (LUT) logic with embedded array blocks (EABs) that can implement RAM, ROM, or product-term logic, enabling efficient implementation of memory-intensive functions.
Typical applications include telecommunications line-card glue logic, industrial control and instrumentation, DSP pre/post-processing, video processing front ends, and PCI interface bridging. Engineers select the EP20K100CQ240C8 when moderate gate count, embedded memory, and legacy QFP-package manufacturing compatibility are required.
When designing with this part, evaluate whether the speed grade and I/O count are sufficient for your timing budget. APEX 20K devices are now legacy parts; verify the latest Altera/Intel product-discontinuance notices and plan obsolescence migration paths (Cyclone, Stratix, or MAX series) for new designs.
This page synthesizes distributor pricing, replacement options, and engineering notes drawn from manufacturer datasheets and distributor listings, providing context not found in any single source.
直接替换替代料： EP20K100CQ240C8 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP20K100CQ240C8 （相同外形与封装尺寸） ——差异在于 Speed Grade, Operating Temperature, Family, Package Type, Package.
快速对比工具——选择替代料号进行并排对比：
EP20K100CQ240C7
✅ 直接替换✓ 有现货
$92 / 个
查看数据手册 →EP20K100CQ240C7ES
✅ 直接替换✓ 有现货
$112 / 个
查看数据手册 →EP20K100CQ208C8
✅ 直接替换✓ 有现货
$13.4 / 个
查看数据手册 →EP20K100CQ240C8 最大额定值与电气特性
| Family | APEX 20K |
| Series | EP20K100 |
| Typical Gates | 100,000 |
| Maximum System Gates | 263,000 |
| Logic Elements | 4,160 |
| Embedded Memory (ESB) | 53,248 bits |
| User I/O Pins | 189 |
| 封装 | 240-pin PQFP (QFP) |
| Speed Grade | C8 (commercial, -8) |
| 工作温度 | 0C to +85C (commercial) |
| Core Voltage | 2.5 V |
| I/O Standards | LVTTL, LVCMOS, PCI |
| Configuration Interface | JTAG (IEEE 1149.1), serial/parallel |
| Programming Method | SRAM-based, in-system programmable |
EP20K100CQ240C8 240-pin pqfp (qfp) 引脚配置指南
EP20K100CQ240C8（240-pin pqfp (qfp) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP20K100CQ240C8.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP20K100CQ240C8 适用于 6 应用s: Telecommunications Line-Card Glue Logic, Industrial Control and Instrumentation, DSP Pre- and Post-Processing, PCI Bus Interface Bridging, Video Processing Front Ends, Legacy ASIC Replacement and Prototyping.
Telecommunications Line-Card Glue Logic
The EP20K100CQ240C8 fits telecommunications line-card glue logic because its 100,000 typical gates and 4,160 logic elements handle bus interfacing, address decoding, and protocol conversion in legacy TDM/SONET architectures. Its 189 user I/O pins in the 240-PQFP package provide ample connectivity for backplane glue between ASICs, microprocessors, and SERDES devices. The MultiCore architecture with 53,248 bits of embedded SRAM enables fast FIFO and lookup-table implementation for packet-header processing. Compared with discrete 74-series logic, the EP20K100CQ240C8 integrates hundreds of glue functions into one device, reducing board area and BOM cost. JTAG-based in-system programmability simplifies design changes and field updates.
推荐
Industrial Control and Instrumentation
The EP20K100CQ240C8 is well-suited for industrial control applications because its 189 I/O pins accommodate multiple sensor and actuator interfaces in motor controllers, PLCs, and process instrumentation front ends. The C8 commercial temperature grade (0C to +85C) covers most factory-floor environments, while the EP20K100CQ240C7ES extended-temperature variant serves harsher enclosures. Embedded SRAM (ESB) blocks implement PID-loop state tables and waveform look-up ROM, while logic elements handle encoder decoding and PWM generation. Compared with microcontrollers, the FPGA provides deterministic timing and parallel I/O for high-speed control loops. Plan migration to Cyclone IV E or MAX 10 for new industrial designs.
推荐
DSP Pre- and Post-Processing
The EP20K100CQ240C8 fits DSP pre- and post-processing roles where moderate gate count and high I/O bandwidth are required between a dedicated DSP processor and external converters. With 53,248 bits of embedded SRAM, the device hosts FIR-filter coefficient tables, sample buffers, and FFT twiddle factors on-chip, eliminating expensive external memory transactions. The 189 I/O pins support parallel LVCMOS connections to high-speed ADCs and DACs, while PLL-based clock management aligns sample domains. Compared with discrete FIFO-plus-CPLD designs, the EP20K100CQ240C8 integrates buffering, formatting, and protocol adaptation in one device. Choose a C7 speed grade for tighter DSP timing margins.
推荐
PCI Bus Interface Bridging
The EP20K100CQ240C8 is ideal for PCI-bus interface bridging, supporting both 33 MHz and 66 MHz PCI operation with up to 189 user I/Os available for side-band signals. The MultiCore architecture implements the PCI target or master state machine, configuration-space registers, and FIFOs entirely in on-chip logic elements and ESBs, eliminating the need for a companion bridge chip. Compared with discrete PCI-controller ASICs, the EP20K100CQ240C8 allows custom protocol extension and engineering change without re-spinning the ASIC. The 240-PQFP package provides sufficient pin count for full 32-bit PCI plus auxiliary I/O. Engineers should evaluate the Altera PCI Compiler IP core for compliance verification.
推荐
Video Processing Front Ends
The EP20K100CQ240C8 is well-suited to video-processing front ends, where 189 I/O pins and embedded SRAM accommodate line buffers, color-space converters, and timing generators. The 53,248-bit ESB memory enables dual-port line-buffer implementation for progressive-scan conversion, de-interlacing, and scaling. With MultiCore architecture, parallel pixel processing at 27 MHz (SD) or 74 MHz (HD) is feasible in the C7 speed grade; C8 grade targets standard-definition and lower resolutions. Compared with dedicated video-ASICs, the EP20K100CQ240C8 allows custom resolution and timing support without tooling re-spins. Verify JTAG-based in-system programming for field firmware updates.
推荐
Legacy ASIC Replacement and Prototyping
The EP20K100CQ240C8 functions as a drop-in ASIC replacement for low-volume production and as an ASIC prototyping vehicle for high-volume products. Its 100,000 typical gates and SRAM-based programmability allow rapid design iterations without NRE charges; engineers can validate logic and timing before committing to a gate-array mask set. The 240-PQFP package preserves through-hole-compatible assembly for legacy boards where BGA rework is not viable. Compared with hard-ASICs, the EP20K100CQ240C8 trades per-unit cost for design flexibility and inventory consolidation across multiple SKUs. Plan a Cyclone or MAX migration for high-volume ramps.
推荐
推荐产品汇总
工程参考数据： EP20K100CQ240C8 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP20K100CQ240C7 | EP20K100CQ240C7ES | EP20K100CQ208C8 | EP20K100CF324C8 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 240-PQFP | 240-PQFP - same | 240-PQFP - same | 208-PQFP - different | 324-BGA - different |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 |
| Embedded SRAM | 53,248 bits | 53,248 bits | 53,248 bits | 53,248 bits | 53,248 bits |
| Speed Grade | C8 (commercial) | C7 (faster) | C7 extended temp | C8 (commercial) | C8 (commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Drop-in faster speed grade available in identical package （对比 EP20K100CQ240C7)
- Extended-temperature variant for industrial environments （对比 EP20K100CQ240C7ES)
- Higher pin-count variant for richer I/O （对比 EP20K100CF324C8)
设计说明
The EP20K100CQ240C8 in a 240-PQFP package typically dissipates 1-3 W at moderate toggle rates. Because the PQFP package has no exposed thermal pad, rely on PCB copper area for heat spreading. Estimate: with a 100 mm x 100 mm 4-layer board and natural convection, junction-to-ambient thermal resistance is approximately 30 C/W; design with at least 30% margin for sustained operation. For dense designs, add copper pours on inner ground planes and use thermal vias under the package body.
Place 0.1 uF decoupling capacitors within 5 mm of every VCCINT and VCCIO pin pair. Use one bulk 47-100 uF tantalum or polymer capacitor per supply rail, plus multiple ceramic capacitors distributed around the package. Separate analog (VCCIO for LVCMOS/PCI) and digital (VCCINT) ground returns to reduce switching-noise coupling. Maintain continuous ground planes beneath the PQFP body for signal-return integrity on the high-speed I/O.
Configuration failure is the most common EP20K100CQ240C8 board bring-up issue. Verify nCONFIG is held low during power-up, then released after all rails are stable. Check that CONF_DONE goes high within the configured timeout; an open MSEL[0..2] or incorrect pull-up/down on nSTATUS will prevent successful configuration. Always confirm the configuration bitstream matches the device ID by reading JTAG IDCODE before programming. Use a configuration device such as EPC2LC20 for board-level autonomous loading.
PQFP packages require fine-pitch (0.5 mm) fanout. Route signals on inner layers between package pads to escape the dense perimeter; use dog-bone or via-in-pad only if the assembly house supports it. Maintain 50 ohm controlled impedance for clock and JTAG traces. Keep JTAG signals (TCK, TMS, TDI, TDO) away from switching I/O to prevent programming failures. Reserve a ground ring around the device to suppress edge radiation.
合规信息
RoHS, REACH, and lead-free status not specified in the verified web data. As a legacy part predating widespread RoHS adoption, original inventory may be non-compliant. Request CoC from distributor to confirm compliance for your specific lot.
