EP20K100CQ240C8 - APEX 20K FPGA, 100K Gates, 240-QFP | Intel
MPN: EP20K100CQ240C8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42 | $420.00 |
| 100 | $36.5 | $3,650.00 |
| 500 | $31.25 | $15,625.00 |
| 1,000 | $26.8 | $26,800.00 |
Drop-in alternatives for EP20K100CQ240C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K100CQ240C7
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EP20K100CQ240C7ES
✅ Drop-In✓ In Stock
$112 / Unit
View Datasheet →EP20K100CQ208C8
✅ Drop-In✓ In Stock
$13.4 / Unit
View Datasheet →EP20K100CQ240C8 Maximum Ratings & Electrical Characteristics
| Family | APEX 20K |
| Series | EP20K100 |
| Typical Gates | 100,000 |
| Maximum System Gates | 263,000 |
| Logic Elements | 4,160 |
| Embedded Memory (ESB) | 53,248 bits |
| User I/O Pins | 189 |
| Package | 240-pin PQFP (QFP) |
| Speed Grade | C8 (commercial, -8) |
| Operating Temperature | 0C to +85C (commercial) |
| Core Voltage | 2.5 V |
| I/O Standards | LVTTL, LVCMOS, PCI |
| Configuration Interface | JTAG (IEEE 1149.1), serial/parallel |
| Programming Method | SRAM-based, in-system programmable |
EP20K100CQ240C8 240-pin pqfp (qfp) Pin Configuration Guide
Complete pinout information for EP20K100CQ240C8 (240-pin pqfp (qfp) package) with 189 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K100CQ240C8.
Refer to the datasheet for full pin configuration.
Estimated pin count: 189 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K100CQ240C8 is suitable for 6 applications: Telecommunications Line-Card Glue Logic, Industrial Control and Instrumentation, DSP Pre- and Post-Processing, PCI Bus Interface Bridging, Video Processing Front Ends, Legacy ASIC Replacement and Prototyping.
Telecommunications Line-Card Glue Logic
The EP20K100CQ240C8 fits telecommunications line-card glue logic because its 100,000 typical gates and 4,160 logic elements handle bus interfacing, address decoding, and protocol conversion in legacy TDM/SONET architectures. Its 189 user I/O pins in the 240-PQFP package provide ample connectivity for backplane glue between ASICs, microprocessors, and SERDES devices. The MultiCore architecture with 53,248 bits of embedded SRAM enables fast FIFO and lookup-table implementation for packet-header processing. Compared with discrete 74-series logic, the EP20K100CQ240C8 integrates hundreds of glue functions into one device, reducing board area and BOM cost. JTAG-based in-system programmability simplifies design changes and field updates.
Recommended
Industrial Control and Instrumentation
The EP20K100CQ240C8 is well-suited for industrial control applications because its 189 I/O pins accommodate multiple sensor and actuator interfaces in motor controllers, PLCs, and process instrumentation front ends. The C8 commercial temperature grade (0C to +85C) covers most factory-floor environments, while the EP20K100CQ240C7ES extended-temperature variant serves harsher enclosures. Embedded SRAM (ESB) blocks implement PID-loop state tables and waveform look-up ROM, while logic elements handle encoder decoding and PWM generation. Compared with microcontrollers, the FPGA provides deterministic timing and parallel I/O for high-speed control loops. Plan migration to Cyclone IV E or MAX 10 for new industrial designs.
Recommended
DSP Pre- and Post-Processing
The EP20K100CQ240C8 fits DSP pre- and post-processing roles where moderate gate count and high I/O bandwidth are required between a dedicated DSP processor and external converters. With 53,248 bits of embedded SRAM, the device hosts FIR-filter coefficient tables, sample buffers, and FFT twiddle factors on-chip, eliminating expensive external memory transactions. The 189 I/O pins support parallel LVCMOS connections to high-speed ADCs and DACs, while PLL-based clock management aligns sample domains. Compared with discrete FIFO-plus-CPLD designs, the EP20K100CQ240C8 integrates buffering, formatting, and protocol adaptation in one device. Choose a C7 speed grade for tighter DSP timing margins.
Recommended
PCI Bus Interface Bridging
The EP20K100CQ240C8 is ideal for PCI-bus interface bridging, supporting both 33 MHz and 66 MHz PCI operation with up to 189 user I/Os available for side-band signals. The MultiCore architecture implements the PCI target or master state machine, configuration-space registers, and FIFOs entirely in on-chip logic elements and ESBs, eliminating the need for a companion bridge chip. Compared with discrete PCI-controller ASICs, the EP20K100CQ240C8 allows custom protocol extension and engineering change without re-spinning the ASIC. The 240-PQFP package provides sufficient pin count for full 32-bit PCI plus auxiliary I/O. Engineers should evaluate the Altera PCI Compiler IP core for compliance verification.
Recommended
Video Processing Front Ends
The EP20K100CQ240C8 is well-suited to video-processing front ends, where 189 I/O pins and embedded SRAM accommodate line buffers, color-space converters, and timing generators. The 53,248-bit ESB memory enables dual-port line-buffer implementation for progressive-scan conversion, de-interlacing, and scaling. With MultiCore architecture, parallel pixel processing at 27 MHz (SD) or 74 MHz (HD) is feasible in the C7 speed grade; C8 grade targets standard-definition and lower resolutions. Compared with dedicated video-ASICs, the EP20K100CQ240C8 allows custom resolution and timing support without tooling re-spins. Verify JTAG-based in-system programming for field firmware updates.
Recommended
Legacy ASIC Replacement and Prototyping
The EP20K100CQ240C8 functions as a drop-in ASIC replacement for low-volume production and as an ASIC prototyping vehicle for high-volume products. Its 100,000 typical gates and SRAM-based programmability allow rapid design iterations without NRE charges; engineers can validate logic and timing before committing to a gate-array mask set. The 240-PQFP package preserves through-hole-compatible assembly for legacy boards where BGA rework is not viable. Compared with hard-ASICs, the EP20K100CQ240C8 trades per-unit cost for design flexibility and inventory consolidation across multiple SKUs. Plan a Cyclone or MAX migration for high-volume ramps.
Recommended
Recommended Products Summary
Engineering reference data for EP20K100CQ240C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K100CQ240C7 | EP20K100CQ240C7ES | EP20K100CQ208C8 | EP20K100CF324C8 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 240-PQFP | 240-PQFP - same | 240-PQFP - same | 208-PQFP - different | 324-BGA - different |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 |
| Embedded SRAM | 53,248 bits | 53,248 bits | 53,248 bits | 53,248 bits | 53,248 bits |
| User I/O | 189 | 189 | 189 | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | C8 (commercial) | C7 (faster) | C7 extended temp | C8 (commercial) | C8 (commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Drop-in faster speed grade available in identical package (vs EP20K100CQ240C7)
- Extended-temperature variant for industrial environments (vs EP20K100CQ240C7ES)
- Higher pin-count variant for richer I/O (vs EP20K100CF324C8)
Design Notes
The EP20K100CQ240C8 in a 240-PQFP package typically dissipates 1-3 W at moderate toggle rates. Because the PQFP package has no exposed thermal pad, rely on PCB copper area for heat spreading. Estimate: with a 100 mm x 100 mm 4-layer board and natural convection, junction-to-ambient thermal resistance is approximately 30 C/W; design with at least 30% margin for sustained operation. For dense designs, add copper pours on inner ground planes and use thermal vias under the package body.
Place 0.1 uF decoupling capacitors within 5 mm of every VCCINT and VCCIO pin pair. Use one bulk 47-100 uF tantalum or polymer capacitor per supply rail, plus multiple ceramic capacitors distributed around the package. Separate analog (VCCIO for LVCMOS/PCI) and digital (VCCINT) ground returns to reduce switching-noise coupling. Maintain continuous ground planes beneath the PQFP body for signal-return integrity on the high-speed I/O.
Configuration failure is the most common EP20K100CQ240C8 board bring-up issue. Verify nCONFIG is held low during power-up, then released after all rails are stable. Check that CONF_DONE goes high within the configured timeout; an open MSEL[0..2] or incorrect pull-up/down on nSTATUS will prevent successful configuration. Always confirm the configuration bitstream matches the device ID by reading JTAG IDCODE before programming. Use a configuration device such as EPC2LC20 for board-level autonomous loading.
PQFP packages require fine-pitch (0.5 mm) fanout. Route signals on inner layers between package pads to escape the dense perimeter; use dog-bone or via-in-pad only if the assembly house supports it. Maintain 50 ohm controlled impedance for clock and JTAG traces. Keep JTAG signals (TCK, TMS, TDI, TDO) away from switching I/O to prevent programming failures. Reserve a ground ring around the device to suppress edge radiation.
Compliance Information
RoHS, REACH, and lead-free status not specified in the verified web data. As a legacy part predating widespread RoHS adoption, original inventory may be non-compliant. Request CoC from distributor to confirm compliance for your specific lot.
