EP20K100EBC356-3N - APEX 20KE 100K Gates 4160 Cells FPGA | Intel
料号： EP20K100EBC356-3N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92 | $92,000.00 |
EP20K100EBC356-3N 概述
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed post-manufacturing to implement arbitrary digital logic. FPGAs sit hierarchically within programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) and FPGAs -> application-specific integrated circuits (ASICs) as a flexible alternative for low-to-medium volume digital designs where ASIC NRE cost is unjustified. The APEX-20KE family extends the original APEX 20K line with MultiCore architecture combining look-up table (LUT) and product-term (LUT+PT) logic plus embedded system blocks (ESBs) that double as either dual-port RAM or Content-Addressable Memory (CAM).
Key differentiating features include 4,160 logic elements, 53,248 bits of embedded memory, 26 embedded system blocks, and 246 user I/Os in the 356-LBGA thermally-enhanced package. The device supports in-system programmability via the IEEE 1149.1 (JTAG) interface and 3.3 V PCI compliance, with an operating junction temperature range of 0 °C to +85 °C. The BGA-356 package measures 45 × 45 mm with 1.27 mm pitch.
Architecturally, the APEX-20KE combines MegaLAB structures (groups of 16 Logic Array Blocks), embedded system blocks for memory, and FastTrack interconnect, all clocked by a 4-phase clock network supporting LVCMOS, LVTTL, PCI, SSTL-2/3, and GTL+ I/O standards. The -3N speed grade indicates a 1.6 ns propagation delay.
Typical applications include telecommunications line cards, industrial control and factory automation backplanes, military/aerospace signal processing prototypes, and high-speed data acquisition front-ends where parallel datapath and on-chip buffering are essential.
When designing with this part, verify pin assignment against the 356-LBGA BGA map and provide matched-length traces for high-speed clocks. Note that the EP20K100EBC356-3N is classified as obsolete/end-of-life; engineers should evaluate Cyclone-series or newer Stratix devices for new designs, while reserving this part for legacy board repair only.
This page synthesizes distributor stock levels, drop-in alternative candidates from the same APEX 20KE family, and practical design notes that are not aggregated on any single manufacturer or distributor page, giving component engineers an information-gain summary tailored to long-term sourcing decisions.
直接替换替代料： EP20K100EBC356-3N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP20K100EBC356-3N （相同外形与封装尺寸） ——差异在于 Operating Temperature, Process Technology, Package, Speed Grade, Series.
快速对比工具——选择替代料号进行并排对比：
EP20K100BC356-3N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP20K100EBC356-1
✅ 直接替换📋 参考替代料（不在目录中）
EP20K100EBC356-2
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP20K100CB356C7
✅ 直接替换✓ 有现货
$71 / 个
查看数据手册 →EP20K100CB356C8
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$82 / 个
查看数据手册 →EP20K100CB356C9
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
联系询价
查看数据手册 →EP20K100EBC356-3N 最大额定值与电气特性
| Series | APEX-20KE |
| Family | APEX 20K |
| Logic Elements / Cells | 4160 |
| System Gates | 100,000 |
| Embedded Memory (bits) | 53,248 |
| Embedded System Blocks (ESBs) | 26 |
| Maximum User I/Os | 246 |
| 引脚数 | 356 |
| 封装 | 356-LBGA (Ball Grid Array) |
| Package Dimensions | 45 x 45 mm |
| Ball Pitch | 1.27 mm |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 1.8 V |
| Propagation Delay | 1.6 ns (speed grade -3N) |
| Maximum Internal Frequency | 250 MHz |
| 工作温度 | 0 °C to +85 °C |
| 安装类型 | Surface Mount |
| Programmable Interface | JTAG (IEEE 1149.1) |
| I/O Standards Supported | LVCMOS, LVTTL, PCI, SSTL-2/3, GTL+ |
EP20K100EBC356-3N 45 x 45 mm 引脚配置指南
EP20K100EBC356-3N（45 x 45 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP20K100EBC356-3N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP20K100EBC356-3N 适用于 7 应用s: Telecommunications Line Card Interface, Industrial Automation Backplane Controller, Legacy Military/Aerospace Signal Processing, High-Speed Data Acquisition Front-End, Networking Switch Fabric Glue Logic, Medical Imaging Pre-Processor (Legacy), Prototype ASIC Emulation Platform.
Telecommunications Line Card Interface
The EP20K100EBC356-3N's 4,160 logic elements and 53,248 bits of embedded memory make it well suited to telecom line-card glue logic where parallel datapath and on-chip buffering replace multiple discrete PLDs. The 246 user I/Os in the 356-LBGA package comfortably route LVTTL control signals between framers, mappers, and backplane SERDES. Operating at 250 MHz internal frequency with 1.6 ns propagation delay, the device can handle TDM bus aggregation and HDLC framing at E1/T1 rates while staying within the 0 °C to +85 °C commercial range typical of central-office ambient. Designers can place configuration in dedicated 16-bit-wide ESBs acting as dual-port RAM for elastic stores.
推荐
Industrial Automation Backplane Controller
In factory-automation backplanes the EP20K100EBC356-3N's 100K system gates are sufficient to implement Profibus, DeviceNet, or custom RS-485 protocol state machines plus PID control loops in a single device. The 1.8 V core and 3.3 V I/O bank allow direct interface to industrial 24 V opto-isolated front ends without level-shifters, reducing BOM cost on PLC I/O modules. The 246 I/Os accommodate dense parallel field-bus connectors, while the embedded CAM blocks support deterministic address-lookup tables for slave polling. APEX 20KE devices have a multi-decade track record in industrial PLC designs, but engineers must plan for end-of-life migration to Cyclone IV or MAX 10.
推荐
Legacy Military/Aerospace Signal Processing
The EP20K100EBC356-3N was widely designed into military and aerospace signal-processing subsystems in the early 2000s, where its radiation-tolerance pedigree and 250 MHz DSP throughput allowed IF-bandwidth FIR filters and FFT butterflies to be implemented in dedicated embedded multipliers and ESB RAM. The 356-LBGA package's 1.27 mm pitch accommodates the high I/O density required for parallel ADC/DAC interfaces. For new aerospace designs, however, the part's obsolete status makes it unsuitable; defense programs must pursue DSCC-approved Cyclone IV or Virtex-6 replacements through formal QML-V qualification programs rather than rely on this device.
推荐
High-Speed Data Acquisition Front-End
With 246 user I/Os and 4,160 logic elements, the EP20K100EBC356-3N can capture and pre-process parallel data streams from multiple high-speed ADCs in instrumentation and test equipment. The 26 embedded system blocks provide 53,248 bits of dual-port RAM for FIFO buffering between ADC sample clocks and the downstream DSP or PCI interface, while the 1.6 ns propagation delay supports real-time triggering logic. The 3.3 V PCI compliance enables direct bus-master DMA into host systems. For new designs, designers should migrate to Cyclone III or Cyclone IV GX which provide modern transceivers, but legacy scope and logic-analyzer products can sustain on this part.
推荐
Networking Switch Fabric Glue Logic
Enterprise networking switches in the late 1990s and early 2000s relied on the APEX 20KE family to implement cell-translation tables, queue managers, and backpressure arbitration between line cards and the central fabric. The EP20K100EBC356-3N's CAM-capable ESBs are particularly valuable for MAC/VLAN lookup tables operating at wire speed, while 246 I/Os route UTOPIA, POS-PHY, or SPI-4.2 interfaces. The 0 °C to +85 °C commercial operating range matches telecom central-office thermal envelopes. Sustaining legacy Layer-2/Layer-3 switches is the primary remaining use case as production has long since ended.
推荐
Medical Imaging Pre-Processor (Legacy)
Pre-2005 medical imaging modalities such as ultrasound front-ends and CT reconstruction pre-processors used APEX 20KE FPGAs to perform beamforming, envelope detection, and pixel-level conditioning at low power. The EP20K100EBC356-3N's 1.8 V core fits battery-isolated medical device power budgets, while its deterministic 1.6 ns propagation delay supports real-time Doppler processing. The 356-LBGA package is reworkable on established ultrasound manufacturing lines. However, IEC 62304 and ISO 13485 lifecycle processes strongly discourage new medical designs on obsolete silicon; the part should be restricted to sustaining production of legacy systems.
推荐
Prototype ASIC Emulation Platform
Before committing to mask sets, design teams in the early 2000s emulated ASIC prototypes on APEX 20KE devices to validate RTL against real-world timing. The EP20K100EBC356-3N with 100K gates could host a small ASIC block plus extensive testbench instrumentation, and JTAG-based in-system programmability accelerated regression cycles. The 246 user I/Os were sufficient to break out debug signals to logic analyzers. Modern emulation has shifted to large FPGAs such as Stratix 10 and Versal, so this application is essentially historical; the part remains useful only for re-running legacy ASIC verification libraries.
推荐
推荐产品汇总
工程参考数据： EP20K100EBC356-3N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP20K100BC356-3N | EP20K100EBC356-1 | EP20K100EBC356-2 | EP20K100CB356C7 | EP20K100CB356C8 | EP20K100CB356C9 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 356-LBGA (45x45 mm, 1.27 mm pitch) | 356-LBGA - same | 356-LBGA - same | 356-LBGA - same | 356-LBGA - same | 356-LBGA - same | 356-LBGA - same |
| System Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Logic Elements / Cells | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 |
| Embedded Memory (bits) | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 |
| Maximum User I/Os | 246 | 246 | 246 | 246 | 246 | 246 | 246 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Speed Grade / Propagation Delay | -3N / 1.6 ns | -3N / 1.6 ns | -1 / ~2.0 ns (slower) | -2 / ~1.8 ns | -7 / ~2.5 ns | -8 / ~2.7 ns | -9 / ~3.0 ns |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Speed grade -3N provides 1.6 ns propagation delay for timing-critical designs （对比 EP20K100EBC356-1)
- Pin-compatible with full APEX 20KE 356-LBGA family for board reuse （对比 EP20K1000CB652C9N)
- Trailing N suffix confirms commercial temperature grade 0 °C to +85 °C （对比 EP20K100EBC356-3 (without N suffix))
设计说明
The 356-LBGA thermally enhanced package on the EP20K100EBC356-3N provides a lower theta-JA than the standard LBGA but still requires PCB thermal relief. Estimate: with 246 I/Os switching at 25 MHz and 20 pF load, dynamic power is approximately P = C x V^2 x f x N = 20e-12 x 1.8^2 x 25e6 x 246 ≈ 0.4 W core. Add 0.3 W I/O bank power for a total of ~0.7 W. Without forced airflow and using the JEDEC EIA/JESD51-7 4-layer test board (theta-JA ≈ 18 C/W), junction temperature rise above ambient is about 13 C, keeping the device within the 0 °C to +85 °C commercial limit. For high-utilization designs, designers should add a thermal via array beneath the LBGA center balls to reduce theta-JC-to-PCB.
Route the 1.8 V core supply and 3.3 V I/O bank supplies as star topologies from the regulator outputs to the EP20K100EBC356-3N supply pins, with 10 µF bulk tantalum and 0.1 µF ceramic decoupling within 5 mm of each supply ball. The 356-LBGA at 1.27 mm pitch demands a 4-layer PCB minimum with 4-6 mil laser-drilled microvias for fan-out; design the top signal layer with 4 mil traces and 4 mil spacing to escape the inner rows. Avoid placing vias in the BGA pad — use dog-bone fan-out with via-in-pad only on inner rows where signal density requires it. Match-length (±50 mil) all global clock nets to within the Quartus timing analyzer constraint.
Do not assume the EP20K100EBC356-3N datasheet document numbers referenced in older design notes are still current. APEX 20KE documentation is hosted on third-party datasheet archives rather than intel.com because Intel discontinued primary support after acquiring Altera. When substituting the -1 grade variant on legacy boards, re-run timing analysis at worst-case PVT (1.7 V core, 85 C junction) — the -1 grade can be ~25% slower than -3N and may break critical paths in designs originally closed at -3N. Finally, ensure the configuration device (EPC2 or EPC16) is also still available; the legacy Altera EPC family is itself obsolete and must be sourced from independent distributors.
合规信息
RoHS/REACH compliance status was not present in the verified web data for this legacy part; mark as unknown and request a manufacturer compliance letter before use in any compliance-scoped design. APEX 20KE parts predate AEC-Q100 automotive qualification programs and are not recommended for new automotive designs.
