EP20K200CF484I7 - APEX 20KC 200K Gates FPGA 1.8V FBGA-484 | Altera
料号： EP20K200CF484I7 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118 | $11,800.00 |
| 500 | $102 | $51,000.00 |
| 1,000 | $89.5 | $89,500.00 |
EP20K200CF484I7 概述
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the designer after manufacturing to implement arbitrary digital logic. APEX 20KC sits in the FPGA taxonomy as a high-density SRAM-based device - hierarchically: PLD (programmable logic device) -> CPLD/FPGA -> SRAM-based FPGA -> high-density FPGA family. The APEX 20KC family combines look-up-table (LUT) based logic elements with embedded array blocks (EABs) used for memory, multipliers, and DSP-like functions, allowing dense implementation of datapath, glue logic, and bus-interface functions on a single die.
Key specifications of the EP20K200CF484I7 include 8,320 logic elements, 8,320 flip-flops, a maximum internal operating frequency around 375 MHz (per Altera device-family data), 376 user I/O pins, and 4 dedicated inputs. It is offered in the -7 speed grade and the industrial temperature range (-40 °C to +85 °C case), as denoted by the I7 suffix. The 1.8 V VCCINT, 1.71 V - 1.89 V tolerance, and 0.15 µm copper interconnect give the part its characteristic balance of integration density, static power, and toggle performance that made it a workhorse for telecom line cards, industrial controllers, and prototyping platforms in the early-to-mid 2000s.
Typical applications include telecommunications infrastructure (bridges, switches, line cards), industrial machine control, test and measurement backplanes, and ASIC prototyping. The MultiVolt I/O makes it especially useful for bridging 5 V legacy peripherals to 3.3 V or 2.5 V processors on the same board, while the embedded array blocks accelerate RAM, ROM, and DSP functions.
A key design consideration when using the EP20K200CF484I7 today is component longevity: APEX 20KC is an older Altera (now Intel PSG) family with limited active support. Designers should verify lifecycle status, long-term supply, and second-source options (Cyclone, MAX, or newer Stratix equivalents) before committing to new production designs. For new designs, modern Cyclone IV/V or Cyclone 10 LP devices are recommended pin-compatible successors with active lifecycles and lower static power.
The I7 suffix denotes the industrial temperature grade and -7 speed grade, while the CF484 package code identifies the 484-ball FineLine BGA. This page synthesizes distributor pricing, lifecycle signals, and drop-in alternatives not consolidated on a single manufacturer datasheet, enabling faster component selection for both legacy maintenance and cost-down redesigns.
直接替换替代料： EP20K200CF484I7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP20K200CF484I7 （相同外形与封装尺寸） ——差异在于 Speed Grade, Package, Process Technology, Operating Temperature, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
EP20K200CF484C7
✅ 直接替换✓ 有现货
$82 / 个
查看数据手册 →EP20K200CF484C8
✅ 直接替换✓ 有现货
$410.75 / 个
查看数据手册 →EP20K200CF484C9
✅ 直接替换✓ 有现货
$201.04 / 个
查看数据手册 →EP20K200CF484C8N
✅ 直接替换✓ 有现货
$102.95 / 个
查看数据手册 →EP20K200CF484C9N
✅ 直接替换✓ 有现货
$201.04 / 个
查看数据手册 →EP20K200CF484I7 最大额定值与电气特性
| Family | APEX 20KC |
| Logic Elements | 8,320 |
| Typical Gate Count | 200,000 system gates |
| Maximum Operating Frequency | 375.94 MHz (per device-family data) |
| Process Technology | 0.15 µm CMOS with copper interconnect |
| Internal Supply Voltage (VCCINT) | 1.8 V (1.71 V to 1.89 V) |
| I/O Supply Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt I/O) |
| User I/O Pins | 376 |
| Dedicated Inputs | 4 |
| 封装 | 484-pin FBGA (FineLine BGA) |
| Package Body Size | 23 mm × 23 mm |
| Ball Pitch | 1.000 mm |
| Speed Grade | -7 |
| Temperature Grade (I7 suffix) | Industrial, -40 °C to +85 °C |
| Configuration Technology | SRAM-based, re-programmable in-system |
EP20K200CF484I7 23 mm × 23 mm 引脚配置指南
EP20K200CF484I7（23 mm × 23 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP20K200CF484I7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP20K200CF484I7 适用于 6 应用s: Telecommunications Line Cards, Industrial Machine Controllers, ASIC Prototyping and Emulation, Test and Measurement Backplanes, Mixed-Voltage Legacy Bridging, Legacy Avionics and Defense Systems.
Telecommunications Line Cards
The EP20K200CF484I7's 200K system gates and 376 user I/Os make it well suited for legacy telecom line-card designs requiring high-density glue logic, custom bus interfacing, and protocol adaptation. Its MultiVolt I/O bridges 5 V TDM framers to 3.3 V or 2.5 V network processors without level shifters, while embedded array blocks (EABs) implement small FIFOs and lookup tables common in telecom datapaths. Estimated: at 1.8 V VCCINT with ~50% toggle activity, typical core current is on the order of hundreds of mA; designers should budget for the 1.8 V regulator to supply at least 1 A continuous headroom.
推荐
Industrial Machine Controllers
The EP20K200CF484I7 in industrial temperature grade (-40 °C to +85 °C) fits PLC-style machine controllers where custom deterministic logic, encoder decoding, and motor-control state machines must coexist on one die. The 8,320 logic elements and EAB-based memory support encoder counters, lookup-table-driven PWM, and safety-logic blocks while keeping all timing on a single device. MultiVolt I/O interfaces both 5 V industrial sensors and 3.3 V processors. Note: the APEX 20KC family is last-time-buy; new industrial designs should evaluate Cyclone IV/V with active lifecycle support instead.
推荐
ASIC Prototyping and Emulation
The 200K-gate density of the EP20K200CF484I7 makes it a useful vehicle for prototyping and pre-silicon validation of medium-complexity ASICs in the early 2000s era. Designers mapped RTL into 8,320 logic elements and EAB-based RAM/ROM, validated system behavior at near-ASIC clock rates, and refined the design before tape-out. SRAM-based configuration enables rapid design-iteration cycles. For modern ASIC prototyping, larger Stratix or Cyclone devices in similar FineLine BGA packages offer much higher logic densities and faster compile times, but the EP20K200CF484I7 remains a known, documented platform for maintaining legacy emulation flows.
推荐
Test and Measurement Backplanes
The EP20K200CF484I7 supports custom backplane interfacing in test and measurement systems where 376 user I/Os can be partitioned across multiple VCCIO banks to mix 5 V, 3.3 V, and 2.5 V instruments on one bus. EABs implement small pattern memories and capture buffers, while general LUT logic handles protocol conversion between PXI, VXI, or proprietary test buses. Estimated: at full -7 speed grade the part supports internal clock rates around 375 MHz per device-family data, suitable for high-throughput parallel test patterns. Industrial temperature grade enables deployment in lab and light-industrial environments.
推荐
Mixed-Voltage Legacy Bridging
The MultiVolt I/O capability of the EP20K200CF484I7 makes it a strong choice for bridging legacy 5 V peripherals to modern 3.3 V or 2.5 V processors on the same PCB, eliminating discrete level-shifter ICs. Bank-by-bank VCCIO selection allows 5 V on one bank and 3.3 V on another, simplifying board layout and reducing BOM cost in industrial and instrumentation designs with mixed-vintage components. The 8,320 logic elements handle protocol conversion and timing adaptation between buses. Note: lead-free / RoHS-compliant variants (N suffix) may be required for new EU production; verify finish before substituting.
推荐
Legacy Avionics and Defense Systems
Long-lifecycle defense and avionics platforms that adopted APEX 20KC in the early 2000s continue to use the EP20K200CF484I7 for sustainment because re-qualification of a new FPGA family would be prohibitively expensive. The industrial temperature grade covers most cockpit and ground-vehicle environments, while the FBGA-484 footprint and -7 speed grade are documented and stable across manufacturing lots. Long-term support depends on remaining factory and channel inventory plus third-party test services; programs should track DoD Diminishing Manufacturing Sources alerts and consider aftermarket up-screening for high-reliability deployments.
推荐
推荐产品汇总
工程参考数据： EP20K200CF484I7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP20K200CF484C7 | EP20K200CF484C8 | EP20K200CF484C9 | EP20K200CF484C8N | EP20K200CF484C9N |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel PSG) | Altera (now Intel PSG) | Altera (now Intel PSG) | Altera (now Intel PSG) | Altera (now Intel PSG) | Altera (now Intel PSG) |
| Package | FBGA-484 (23x23mm, 1.0mm pitch) | FBGA-484 (23x23mm, 1.0mm pitch) - same | FBGA-484 (23x23mm, 1.0mm pitch) - same | FBGA-484 (23x23mm, 1.0mm pitch) - same | FBGA-484 (23x23mm, 1.0mm pitch) - same | FBGA-484 (23x23mm, 1.0mm pitch) - same |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | -7 | -7 (same) | -8 (slower) | -9 (slowest) | -8 (slower) | -9 (slowest) |
| Logic Elements | 8,320 | 8,320 (same) | 8,320 (same) | 8,320 (same) | 8,320 (same) | 8,320 (same) |
| User I/O Pins | 376 | 376 (same) | 376 (same) | 376 (same) | 376 (same) | 376 (same) |
| Internal Supply (VCCINT) | 1.8 V | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
关键差异点
- Industrial temperature grade in the same FBGA-484 footprint as commercial variants （对比 EP20K200CF484C7)
- Faster -7 speed grade versus -8 or -9 alternatives （对比 EP20K200CF484C8 / EP20K200CF484C9)
- Highest-density APEX 20KC member in the FBGA-484 package （对比 EP20K100CF324C9 (lower-density sibling))
设计说明
EP20K200CF484I7 requires a clean 1.8 V VCCINT rail (1.71 V to 1.89 V tolerance) plus separate VCCIO rails per bank at 1.8/2.5/3.3/5.0 V. Estimated: at typical industrial operating activity the core current is on the order of several hundred mA, so a low-dropout regulator capable of at least 1 A continuous with adequate bulk decoupling (e.g., 470 µF aluminum polymer + 10 µF + 100 nF ceramic) is recommended. Sequence VCCINT before VCCIO to prevent I/O latch-up during power-up.
Estimated: at 1.8 V core supply with high toggle activity and ~50% I/O switching, total power dissipation can reach 1-2 W; the 23 × 23 mm FBGA has moderate thermal resistance but benefits from a thermal pad or internal PCB copper plane tied to a quiet ground. Use thermal vias under the package center ball grid to spread heat into inner copper layers, and avoid placing the device directly above heat-generating components on the opposite PCB side.
The 484-ball FBGA at 1.000 mm pitch requires 4-6 layer PCB with microvia or laser-drilled stacked-via technology for reliable fanout; standard 8/8 mil trace-and-space rules with 12 mil via pads typically work but require design-for-manufacturing review. Place 100 nF decoupling capacitors as close as possible to every VCCINT and VCCIO ball, with bulk capacitors around the package perimeter; keep configuration / JTAG traces short and impedance-controlled.
Common pitfalls include: (1) ignoring last-time-buy status and designing in EP20K200CF484I7 for new production without planning a Cyclone migration; (2) mixing industrial and commercial temperature grades unintentionally when substituting C7/I7 variants; (3) assuming MultiVolt I/O makes all banks 5 V tolerant - each bank has its own VCCIO and must be configured separately; (4) using N-suffix parts only when RoHS compliance is required and verifying the customer bill-of-materials is consistent.
合规信息
RoHS / lead-free status not explicitly stated in the provided verified data; verify with the manufacturer before use in EU production. N-suffix variants (e.g., EP20K200CF484C8N) indicate lead-free finishes. AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade IC in the AEC-Q100 sense.