EP20K400FC784-2 - APEX 20K 400K Gate FPGA, 784-BGA | Altera
料号： EP20K400FC784-2 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $268 | $2,680.00 |
| 100 | $235 | $23,500.00 |
| 500 | $198 | $99,000.00 |
| 1,000 | $175 | $175,000.00 |
EP20K400FC784-2 概述
An FPGA (Field Programmable Gate Array) is a programmable logic device family that lets engineers implement custom digital logic, register files, FIFOs, RAMs, and arithmetic functions on a single IC after fabrication. APEX 20K sits in the hierarchy: programmable logic -> FPGA -> high-density SRAM-based FPGA -> APEX 20K family. The device is configured at power-up from an external serial or parallel PROM (EPCS / EPC16-class erasable PROMs), and because it is SRAM-based it is re-programmable in-system indefinitely.
Key features of the EP20K400C include 400,000 typical system gates (approximately 16,640 logic elements / 3,300 4-input LUTs per family datasheet), 212 Kbits of embedded RAM distributed across ESBs, support for LVTTL, LVCMOS, PCI, SSTL-2, SSTL-3, GTL+, and CTT I/O standards, up to 4 dedicated FastTrack Interconnect rows/columns, and a maximum of 488 user I/O pins in the 784-ball BGA. The device operates from a 2.5 V core and supports MultiVolt I/O interfacing to 3.3 V, 2.5 V, and 1.8 V buses, with hot-socketing capability for live insertion into backplanes.
The -2 speed grade places this part in the commercial/industrial performance tier (typical toggling around 100-180 MHz internally, depending on routing and design style). 4-input LUTs feed a fast carry-chain for arithmetic, and the ESBs can be configured as dual-port RAM, ROM, CAM, or small multipliers. JTAG (IEEE 1149.1) boundary-scan testing is supported on every pin, easing board-level test and in-system programming flows.
Typical applications include telecom backplane glue logic, industrial automation controllers, custom peripheral bridges (PCI to local bus, UART to FIFO), DSP pre/post-processing pipelines, and prototyping platforms for ASIC emulation. The high gate count also makes it a viable candidate for early-stage ASIC prototyping where design iterations outpace mask turns.
When designing with this part, plan for an external configuration PROM (e.g., EPC16 or EPCS64) since the EP20K400C is SRAM-volatile, and budget at least 12-16 layer PCB routing for the 784-ball FC-BGA escape. Decoupling must include a 0.1 µF cap per VCCIO/VCCINT power pin pair plus bulk 47 µF tantalum on each supply rail. Engineers considering migration paths should also evaluate the Stratix II family as the natural successor for new designs, since APEX 20K is no longer recommended for new programs.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with engineering detail optimized for sourcing engineers, FPGA architects, and lifecycle-planning procurement teams.
直接替换替代料： EP20K400FC784-2 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP20K400FC784-2 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Family, Process Technology.
快速对比工具——选择替代料号进行并排对比：
EP20K400EFC784-2
✅ 直接替换📋 参考替代料（不在目录中）
EP20K400EFC672-2
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$92.75 / 个
查看数据手册 →EP20K400FC784-1
✅ 直接替换✓ 有现货
$92 / 个
查看数据手册 →EP20K400EBC652-2
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$60 / 个
查看数据手册 →EP20K400CFC672-9
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$325 / 个
查看数据手册 →EP20K400BC652-2AA
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
联系询价
查看数据手册 →EP20K400FC784-2 最大额定值与电气特性
| Family | APEX 20K |
| Device Family Member | EP20K400C |
| Typical System Gates | 400,000 |
| Maximum User I/O Pins | 488 (784-BGA) |
| Logic Elements | 16,640 |
| Embedded RAM (ESB) | 212 Kbits |
| Process Technology | 0.22 µm CMOS SRAM |
| Core Voltage | 2.5 V |
| MultiVolt I/O Voltage | 1.8 V / 2.5 V / 3.3 V |
| Supported I/O Standards | LVTTL, LVCMOS, PCI, SSTL-2, SSTL-3, GTL+, CTT |
| Configuration Mode | Serial / Parallel SRAM-volatile (external PROM required) |
| 封装 | 784-Ball FineLine BGA (FC) |
| Speed Grade | -2 (industrial) |
| 安装类型 | Surface Mount (BGA) |
| MSL 等级 | 3 (per Partstack listing) |
| Peak Reflow Temperature | 220 °C (per Partstack listing) |
| Hot Socketing | Supported |
| JTAG / Boundary-Scan | IEEE 1149.1 compliant |
EP20K400FC784-2 784-ball fineline bga (fc) 引脚配置指南
EP20K400FC784-2（784-ball fineline bga (fc) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP20K400FC784-2.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP20K400FC784-2 适用于 7 应用s: Telecom Backplane Glue Logic, Industrial Automation Controllers, ASIC Prototyping and Emulation, Custom Peripheral Bridges (PCI / Local Bus), DSP Pre/Post-Processing Pipelines, Legacy Avionics and Defense Backplanes, Test & Measurement Instrumentation Front-Ends.
Telecom Backplane Glue Logic
The EP20K400FC784-2 is well-matched to telecom backplane bridging because its 400K gates and 488 user I/O easily absorb the dozens of glue-logic functions (bus arbiters, parity generators, address decoders, interrupt controllers) that historically consumed multiple 74-series ASICs. MultiVolt I/O (1.8/2.5/3.3 V) lets the same silicon interface to LVCMOS control planes and GTL+ memory buses without level shifters, and 212 Kbits of ESB RAM provides on-chip FIFOs that smooth bursty traffic across the backplane. In a typical application, the part sits between a switch ASIC and a line-card connector, ingesting 3.3 V LVCMOS control signals and outputting 1.8 V SSTL-2 to downstream memory. Hot socketing means the part can be inserted into a live backplane without latch-up - a feature that remains relevant for field-serviceable telecom shelves.
推荐
Industrial Automation Controllers
For PLCs and motion controllers, the EP20K400FC784-2 integrates what would otherwise be a controller board full of discrete logic: PWM generators, encoder counters, quadrature decoders, and high-speed serial protocol bridges (SPI, I2C, UART) all fit comfortably within the 16,640 logic elements. The 488 user I/O pins are sufficient to drive dozens of opto-isolated outputs and accept resolver/encoder feedback channels on a single FPGA. Industrial deployments also benefit from the part's PCI I/O standard support, which eases integration with PCI-based motion-control cards. The wide operating temperature range and surface-mount BGA package suit ruggedized DIN-rail or backplane-mounted controllers, although the MSL-3 moisture sensitivity demands careful PCB assembly handling.
推荐
ASIC Prototyping and Emulation
The APEX 20K family was Altera's mainstream ASIC-prototyping platform in the early 2000s, and the EP20K400FC784-2 remains a viable target for that role. With 400,000 system gates, designers can partition an ASIC design across multiple EP20K400 devices and run real-world validation before committing to a mask turn. The 784-ball BGA and 488 user I/O expose enough channels to bring out ASIC pins for bench testing, while the on-chip ESBs serve as register-file, FIFO, and dual-port RAM stand-ins for typical ASIC memory blocks. Quartus (or legacy MAX+PLUS II) provides the synthesis flow, and JTAG 1149.1 boundary scan simplifies board-level bring-up. For very large ASIC emulation, multiple EP20K400 devices can be cascaded via their LVDS-capable I/O.
推荐
Custom Peripheral Bridges (PCI / Local Bus)
Bridging between PCI and legacy local buses is a classic APEX 20K use case, and the EP20K400FC784-2's PCI-compliant I/O and 488-pin budget make it a strong fit. The part can implement a 32-bit/33 MHz PCI target or master, plus the local bus interface, FIFOs, and interrupt logic in a single device, replacing what would otherwise be a dedicated PCI bridge ASIC plus glue logic. PCI-compliant I/O means the part meets the 5 V/3.3 V signaling and timing requirements without external buffers, simplifying board layout. Designers typically also instantiate UART, SPI, or GPIO bridges alongside the PCI core, all within the same FPGA fabric.
推荐
DSP Pre/Post-Processing Pipelines
In imaging, radar, and baseband signal processing, the EP20K400FC784-2's 212 Kbits of dual-port RAM and high-speed carry chains make it a viable pre/post-processing engine adjacent to a dedicated DSP or microprocessor. Typical pipelines route high-speed LVTTL or LVCMOS sample data into the FPGA, perform decimation, FFT preprocessing, or color-space conversion in the fabric, then hand off clean streams to the DSP. The ESBs' dual-port configuration is particularly useful for ping-pong buffering between sample acquisition and processing. Although APEX 20K lacks dedicated DSP blocks (those arrived in Stratix II), the LUT-based fabric still delivers strong performance for low-to-mid-rate signal chains.
推荐
Legacy Avionics and Defense Backplanes
Because the EP20K400FC784-2 has decades of design heritage, it remains present in long-lifecycle avionics, defense, and industrial systems where re-design is costly. Its wide operating temperature range, hot-socketing support, and 488 user I/O suit legacy VME/VXI backplane designs where the part interfaces legacy ASICs, MIL-STD-1553 buses, or ARINC 429 channels. The 784-ball BGA and JTAG boundary-scan simplify conformal-coated PCB assembly and field diagnostics. Although the part is obsolete for new programs, the long procurement cycles in defense (10-20 year field support) mean it will remain specified for the foreseeable future, often via broker-sourced inventory.
推荐
Test & Measurement Instrumentation Front-Ends
Test equipment front-ends - logic analyzers, protocol exercisers, and high-speed pattern generators - often require custom timing and pin-control logic that off-the-shelf ASICs cannot provide. The EP20K400FC784-2's 488 user I/O, PCI I/O standard support, and abundant LUTs let a designer build a flexible stimulus/response engine with custom protocol decoding. The ESBs serve as deep capture buffers, while the carry chains accelerate timing-edge generation. The 784-ball FC-BGA package routes cleanly into high-density logic-analyzer probe boards. Hot socketing is a plus for modular instruments where the FPGA board may be swapped without powering down the chassis.
推荐
推荐产品汇总
工程参考数据： EP20K400FC784-2 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP20K400EFC784-2 | EP20K400EFC672-2 | EP20K400FC784-1 | EP20K400EBC652-2 | EP20K400CFC672-9 | EP20K400BC652-2 |
|---|---|---|---|---|---|---|---|
| Package | 784-Ball FineLine BGA (FC) | 784-Ball FineLine BGA (FC) - same | 672-Ball FineLine BGA (FC) - different | 784-Ball FineLine BGA (FC) - same | 652-Ball BGA (BC) - different | 672-Ball FineLine BGA (FC) - different | 652-Ball BGA (BC) - different |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Typical System Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Embedded RAM | 212 Kbits (ESB) | 212 Kbits | 212 Kbits | 212 Kbits | 212 Kbits | 212 Kbits | 212 Kbits |
| Speed Grade | -2 | -2 (same) | -2 | -1 (slower) | -2 | -9 | -2 |
| CAM Support | No | Yes (E-suffix) | Yes | No | Yes | No | No |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Highest I/O-count package option in the APEX 20K family （对比 EP20K400EFC672-2)
- Speed grade -2 for tighter timing margins （对比 EP20K400FC784-1)
- Wide secondary-market availability （对比 EP20K400EFC784-2)
设计说明
The EP20K400FC784-2 requires a 2.5 V core supply plus dedicated VCCIO rails per I/O bank; group banks by voltage domain to keep the board simple. Decoupling: place one 0.1 µF X7R ceramic cap per VCCINT/VCCIO power pin pair, plus 47 µF tantalum bulk on each supply rail near the BGA. Estimated: a fully populated EP20K400 design with 80% logic utilization and 100 MHz toggle draws approximately 0.6-1.0 A on VCCINT, so size the 2.5 V regulator for at least 1.5 A continuous.
The 784-ball FC-BGA has 1.27 mm ball pitch; escape requires at least 12 PCB layers with microvia or stacked-via technology. Provide a continuous ground plane directly under the BGA and stitch the perimeter with a via fence every 2-3 mm to suppress edge emissions. MSL-3 handling is mandatory: bake at 125 °C for 24 hours before assembly if the package has been exposed to ambient for more than the floor-life limit, and profile the reflow oven to a 220 °C peak.
Forgetting the external configuration PROM is the most common EP20K400FC784-2 bring-up failure - the FPGA is SRAM-volatile and does not retain its bitstream through power cycles. Use an Altera EPC16 or EPCS64-class PROM and route the DCLK, DATA0, nSTATUS, and nCONFIG signals carefully with impedance-controlled traces. Verify the JTAG chain order before assuming the FPGA is dead; an inverted chain is a frequent debugging false alarm.
Estimated: at 80% logic utilization and 100 MHz toggle rate, the EP20K400FC784-2 dissipates roughly 1.5-2.5 W in still air. The 784-ball BGA's theta_JA is approximately 12-15 °C/W with a 4-layer JEDEC test board, so a 1.5 W dissipation yields about an 18-22 °C junction rise. Add thermal vias under the die and consider a heat-spreader lid for sustained high-utilization workloads; the part's hot-socketing capability does not change thermal planning.
合规信息
RoHS / REACH / lead-free status not confirmed in provided web data for this specific MPN. AEC-Q100 is not applicable (industrial/commercial FPGA, not automotive-grade).
