EP2A25F672I-7 - APEX II FPGA 900K Gates 672-BGA | Intel
料号： EP2A25F672I-7 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP2A25F672I-7 概述
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to configure digital logic blocks and interconnects after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices -> CPLDs -> FPGAs -> semiconductor ICs. Unlike fixed-function ASICs, FPGAs offer hardware re-programmability, making them ideal for prototyping, low-volume production, and applications with evolving standards. APEX II devices specifically combine Look-Up Table (LUT)-based logic with embedded memory blocks and a high-speed interconnect fabric.
Key features of the EP2A25F672I-7 include 24,320 logic cells, approximately 900K system gates, embedded system blocks (ESBs) for memory and specialized functions, multi-voltage I/O support, and high-speed LVDS capabilities. The -7 speed grade indicates a particular performance bin within the APEX II family. The FC-FBGA (Flip Chip Fine-pitch Ball Grid Array) package provides high pin density and excellent thermal performance for high-gate-count designs.
Technically, the APEX II architecture combines four-input LUTs, embedded memory, and a MultiTrack interconnect structure for predictable timing closure. The device supports IEEE 1149.1 JTAG boundary-scan testing and in-system programmability through configuration schemes including passive serial, active serial, and JTAG-based configuration. The industrial temperature grade (-40C to +85C) makes it suitable for non-automotive rugged environments.
Typical applications include telecommunications infrastructure, high-speed data acquisition systems, digital signal processing (DSP), network packet processing, and complex glue logic replacement. The high gate count makes this device particularly suitable for protocol bridging and bus interface implementations in industrial and communications equipment.
When designing with this device, ensure proper decoupling with multiple low-ESR capacitors near each power pin, and follow Altera's APEX II hardware reference manual for impedance-controlled routing of high-speed signals. The -7 speed grade provides a specific timing margin; consult the datasheet's speed-grade tables when targeting critical paths.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes that are not readily available in the manufacturer datasheet alone.
直接替换替代料： EP2A25F672I-7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2A25F672I-7 （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Speed Grade, Operating Temperature, Embedded Memory.
快速对比工具——选择替代料号进行并排对比：
EP2A25F672C7
✅ 直接替换✓ 有现货
$118 / 个
查看数据手册 →EP2A25F672C8
✅ 直接替换✓ 有现货
$951.18 / 个
查看数据手册 →EP2A25F672C9
✅ 直接替换✓ 有现货
$700 / 个
查看数据手册 →EP2A25F672C9N
✅ 直接替换✓ 有现货
$195 / 个
查看数据手册 →EP2A25F672C8N
✅ 直接替换✓ 有现货
$205 / 个
查看数据手册 →EP2A25F672I-7 最大额定值与电气特性
| Family | APEX II |
| Manufacturer | Intel (formerly Altera) |
| Device Type | FPGA (Field-Programmable Gate Array) |
| System Gates | 900K (approximately) |
| Logic Cells / Elements | 24,320 |
| Maximum Operating Frequency | 500 MHz |
| Process Technology | 0.15 um |
| Core Voltage | 1.5 V |
| 封装 | 672-pin FC-FBGA |
| 安装类型 | Surface Mount (Flip-Chip BGA) |
| Speed Grade | -7 |
| 工作温度 | -40C to +85C (Industrial) |
| Temperature Grade | Industrial (I) |
| Configuration Method | JTAG, Passive Serial, Active Serial |
| JTAG Support | IEEE 1149.1 Boundary Scan |
| Embedded Memory | ESBs (Embedded System Blocks) |
EP2A25F672I-7 672-pin fc-fbga 引脚配置指南
EP2A25F672I-7（672-pin fc-fbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2A25F672I-7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2A25F672I-7 适用于 6 应用s: Telecommunications Infrastructure, High-Speed Data Acquisition Systems, Digital Signal Processing (DSP) Implementation, Network Packet Processing, Complex Glue Logic Replacement, Industrial Control and Automation.
Telecommunications Infrastructure
The EP2A25F672I-7's 900K system gates and 24,320 logic elements suit telecom line-card and switch fabric applications where programmable protocol bridging is required. With 500 MHz maximum operating frequency and a MultiTrack interconnect fabric, the device can implement custom packet-processing pipelines, framer/mapper functions, and backplane glue logic between ASICs. The 672-pin FC-FBGA package supports high I/O count needed for parallel SFI/XFI interfaces. Industrial -40C to +85C temperature range meets central-office environmental requirements. Designers should use the Altera APEX II hardware reference manual for impedance-controlled routing of LVDS signals.
推荐
High-Speed Data Acquisition Systems
The EP2A25F672I-7 is well suited for high-speed data acquisition front-ends where its 24,320 logic elements and embedded system blocks (ESBs) can implement parallel processing, sample buffering, and custom trigger logic. The 500 MHz maximum frequency allows real-time digital signal processing at multi-hundred MSPS sample rates. The 672-pin FC-FBGA package delivers the I/O bandwidth required for parallel LVDS ADC interfaces. Industrial temperature grade supports laboratory and field instrumentation. Decoupling must follow Altera's APEX II reference design with low-ESR ceramic capacitors at every power pin.
推荐
Digital Signal Processing (DSP) Implementation
With 24,320 logic elements and high-speed MultiTrack interconnect, the EP2A25F672I-7 supports parallel DSP architectures including FIR filters, FFT engines, and custom correlators. The 500 MHz internal frequency enables multi-hundred MHz sample-rate DSP pipelines. Embedded System Blocks (ESBs) provide dedicated memory for coefficient storage and sample buffering. The 672-pin FC-FBGA package offers the I/O bandwidth required to feed parallel data into the DSP fabric. Industrial temperature rating supports defense and industrial DSP applications.
推荐
Network Packet Processing
The EP2A25F672I-7's high gate count suits network packet classification, deep-packet inspection, and custom routing engine implementations. 24,320 logic elements can implement parallel lookup tables, TCAM emulators, and protocol decoders. The 500 MHz maximum frequency enables line-rate processing on multiple gigabit Ethernet ports. The 672-pin FC-FBGA package supports the parallel bus interfaces needed between PHY and switch fabric. Industrial temperature range suits carrier-grade network equipment. Designers should consult Altera's APEX II application notes for traffic manager reference designs.
推荐
Complex Glue Logic Replacement
The EP2A25F672I-7 replaces large amounts of discrete glue logic, bus arbitrators, and custom interface bridges on legacy system boards. 24,320 logic elements and embedded memory blocks consolidate what would otherwise require dozens of 74-series logic devices into a single programmable IC. The 672-pin FC-FBGA package provides the I/O count needed for wide parallel bus interfaces. Industrial -40C to +85C operation supports industrial controller applications. JTAG-based configuration simplifies in-system firmware updates via boundary-scan chains.
推荐
Industrial Control and Automation
The EP2A25F672I-7 is suitable for industrial PLCs, motor controllers, and factory automation subsystems requiring programmable logic for custom protocols. With 24,320 logic elements and embedded system blocks, the device can implement custom fieldbus interfaces (Profibus, CANopen, EtherCAT glue logic) alongside motion control loops. The industrial -40C to +85C temperature grade meets factory floor environmental requirements. The 672-pin FC-FBGA package supports multiple parallel sensor interfaces. The device's JTAG support enables in-field firmware updates via standard boundary-scan tools.
推荐
推荐产品汇总
工程参考数据： EP2A25F672I-7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2A25F672C7 | EP2A25F672C8 | EP2A25F672C9 | EP2A25F672C9N | EP2A25F672C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 672-pin FC-FBGA | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) |
| System Gates | 900K | 900K (same) | 900K (same) | 900K (same) | 900K (same) | 900K (same) |
| Logic Elements | 24,320 | 24,320 (same) | 24,320 (same) | 24,320 (same) | 24,320 (same) | 24,320 (same) |
| Speed Grade | -7 | -7 (same) | -8 (slower) | -9 (slowest) | -9 (slowest) | -8 (slower) |
| Temperature Grade | Industrial -40C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Process Technology | 0.15 um | 0.15 um (same) | 0.15 um (same) | 0.15 um (same) | 0.15 um (same) | 0.15 um (same) |
| Core Voltage | 1.5 V | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Industrial temperature grade for harsh environments （对比 EP2A25F672C7)
- -7 speed grade for highest performance （对比 EP2A25F672C9)
- 900K gates / 24,320 logic elements for high-density designs （对比 EP2A15F672I8)
设计说明
The EP2A25F672I-7 requires multiple supply rails (VCCINT core typically 1.5V, VCCIO I/O banks at 1.5V/1.8V/2.5V/3.3V depending on bank configuration, and VCCP for charge pump). Decoupling must follow Altera's APEX II hardware reference: place 0.1uF X7R ceramic capacitors within 0.25 inch of every power pin, plus bulk decoupling (10uF-100uF tantalum or polymer) at each supply entry point. Estimated worst-case quiescent current for a fully utilized EP2A25 device can exceed 1A on VCCINT; verify with the device datasheet PowerPlay early-power estimator during design.
The 672-pin FC-FBGA package requires careful PCB layout: microvia or via-in-pad technology is recommended for the BGA breakout, with the top layer dedicated to fanout. Maintain 50-ohm controlled impedance on high-speed LVDS traces and follow Altera's APEX II reference design for layer stackup (typically 8-12 layers with dedicated ground and power planes). Signal integrity simulations should be run on critical interfaces (clock, LVDS, external memory bus) before committing to fabrication.
Do not confuse the APEX II EP2A25 with the APEX 20KE EP20K400 or EP20K600 families - they share package codes but are NOT pin-compatible due to different die, I/O banking, and configuration schemes. When migrating, a board redesign may be required. Also verify the configuration scheme (Passive Serial vs Active Serial vs JTAG) matches your design; mixing schemes requires different external configuration memory (EPCS or EPC) devices. Confirm speed-grade timing margins against your critical paths using the Quartus II TimeQuest timing analyzer.
合规信息
RoHS/REACH status not explicitly listed in available distributor data. APEX II family is industrial-grade only and not AEC-Q100 qualified for automotive applications. Verify compliance with the manufacturer before use in regulated markets.
