EP2A25F672I-7 - APEX II FPGA 900K Gates 672-BGA | Intel
部品番号: EP2A25F672I-7 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP2A25F672I-7 概要
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to configure digital logic blocks and interconnects after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices -> CPLDs -> FPGAs -> semiconductor ICs. Unlike fixed-function ASICs, FPGAs offer hardware re-programmability, making them ideal for prototyping, low-volume production, and applications with evolving standards. APEX II devices specifically combine Look-Up Table (LUT)-based logic with embedded memory blocks and a high-speed interconnect fabric.
Key features of the EP2A25F672I-7 include 24,320 logic cells, approximately 900K system gates, embedded system blocks (ESBs) for memory and specialized functions, multi-voltage I/O support, and high-speed LVDS capabilities. The -7 speed grade indicates a particular performance bin within the APEX II family. The FC-FBGA (Flip Chip Fine-pitch Ball Grid Array) package provides high pin density and excellent thermal performance for high-gate-count designs.
Technically, the APEX II architecture combines four-input LUTs, embedded memory, and a MultiTrack interconnect structure for predictable timing closure. The device supports IEEE 1149.1 JTAG boundary-scan testing and in-system programmability through configuration schemes including passive serial, active serial, and JTAG-based configuration. The industrial temperature grade (-40C to +85C) makes it suitable for non-automotive rugged environments.
Typical applications include telecommunications infrastructure, high-speed data acquisition systems, digital signal processing (DSP), network packet processing, and complex glue logic replacement. The high gate count makes this device particularly suitable for protocol bridging and bus interface implementations in industrial and communications equipment.
When designing with this device, ensure proper decoupling with multiple low-ESR capacitors near each power pin, and follow Altera's APEX II hardware reference manual for impedance-controlled routing of high-speed signals. The -7 speed grade provides a specific timing margin; consult the datasheet's speed-grade tables when targeting critical paths.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes that are not readily available in the manufacturer datasheet alone.
ドロップイン代替品: EP2A25F672I-7 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2A25F672I-7 （同一形状・フットプリント） — 相違点: Package, Process Technology, Speed Grade, Operating Temperature, Embedded Memory.
クイック比較ツール — 並列比較する代替部品を選択:
EP2A25F672C7
✅ ドロップイン✓ 在庫あり
$118 / 個
データシートを見る →EP2A25F672C8
✅ ドロップイン✓ 在庫あり
$951.18 / 個
データシートを見る →EP2A25F672C9
✅ ドロップイン✓ 在庫あり
$700 / 個
データシートを見る →EP2A25F672C9N
✅ ドロップイン✓ 在庫あり
$195 / 個
データシートを見る →EP2A25F672C8N
✅ ドロップイン✓ 在庫あり
$205 / 個
データシートを見る →EP2A25F672I-7 最大定格＆電気的特性
| Family | APEX II |
| Manufacturer | Intel (formerly Altera) |
| Device Type | FPGA (Field-Programmable Gate Array) |
| System Gates | 900K (approximately) |
| Logic Cells / Elements | 24,320 |
| Maximum Operating Frequency | 500 MHz |
| Process Technology | 0.15 um |
| Core Voltage | 1.5 V |
| パッケージ | 672-pin FC-FBGA |
| 実装タイプ | Surface Mount (Flip-Chip BGA) |
| Speed Grade | -7 |
| 動作温度 | -40C to +85C (Industrial) |
| Temperature Grade | Industrial (I) |
| Configuration Method | JTAG, Passive Serial, Active Serial |
| JTAG Support | IEEE 1149.1 Boundary Scan |
| Embedded Memory | ESBs (Embedded System Blocks) |
EP2A25F672I-7 672-pin fc-fbga ピン配置ガイド
EP2A25F672I-7 (672-pin fc-fbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2A25F672I-7.
詳細は データシート をご参照ください。
主な用途
EP2A25F672I-7 の用途: 6 件s: Telecommunications Infrastructure, High-Speed Data Acquisition Systems, Digital Signal Processing (DSP) Implementation, Network Packet Processing, Complex Glue Logic Replacement, Industrial Control and Automation.
Telecommunications Infrastructure
The EP2A25F672I-7's 900K system gates and 24,320 logic elements suit telecom line-card and switch fabric applications where programmable protocol bridging is required. With 500 MHz maximum operating frequency and a MultiTrack interconnect fabric, the device can implement custom packet-processing pipelines, framer/mapper functions, and backplane glue logic between ASICs. The 672-pin FC-FBGA package supports high I/O count needed for parallel SFI/XFI interfaces. Industrial -40C to +85C temperature range meets central-office environmental requirements. Designers should use the Altera APEX II hardware reference manual for impedance-controlled routing of LVDS signals.
おすすめ
High-Speed Data Acquisition Systems
The EP2A25F672I-7 is well suited for high-speed data acquisition front-ends where its 24,320 logic elements and embedded system blocks (ESBs) can implement parallel processing, sample buffering, and custom trigger logic. The 500 MHz maximum frequency allows real-time digital signal processing at multi-hundred MSPS sample rates. The 672-pin FC-FBGA package delivers the I/O bandwidth required for parallel LVDS ADC interfaces. Industrial temperature grade supports laboratory and field instrumentation. Decoupling must follow Altera's APEX II reference design with low-ESR ceramic capacitors at every power pin.
おすすめ
Digital Signal Processing (DSP) Implementation
With 24,320 logic elements and high-speed MultiTrack interconnect, the EP2A25F672I-7 supports parallel DSP architectures including FIR filters, FFT engines, and custom correlators. The 500 MHz internal frequency enables multi-hundred MHz sample-rate DSP pipelines. Embedded System Blocks (ESBs) provide dedicated memory for coefficient storage and sample buffering. The 672-pin FC-FBGA package offers the I/O bandwidth required to feed parallel data into the DSP fabric. Industrial temperature rating supports defense and industrial DSP applications.
おすすめ
Network Packet Processing
The EP2A25F672I-7's high gate count suits network packet classification, deep-packet inspection, and custom routing engine implementations. 24,320 logic elements can implement parallel lookup tables, TCAM emulators, and protocol decoders. The 500 MHz maximum frequency enables line-rate processing on multiple gigabit Ethernet ports. The 672-pin FC-FBGA package supports the parallel bus interfaces needed between PHY and switch fabric. Industrial temperature range suits carrier-grade network equipment. Designers should consult Altera's APEX II application notes for traffic manager reference designs.
おすすめ
Complex Glue Logic Replacement
The EP2A25F672I-7 replaces large amounts of discrete glue logic, bus arbitrators, and custom interface bridges on legacy system boards. 24,320 logic elements and embedded memory blocks consolidate what would otherwise require dozens of 74-series logic devices into a single programmable IC. The 672-pin FC-FBGA package provides the I/O count needed for wide parallel bus interfaces. Industrial -40C to +85C operation supports industrial controller applications. JTAG-based configuration simplifies in-system firmware updates via boundary-scan chains.
おすすめ
Industrial Control and Automation
The EP2A25F672I-7 is suitable for industrial PLCs, motor controllers, and factory automation subsystems requiring programmable logic for custom protocols. With 24,320 logic elements and embedded system blocks, the device can implement custom fieldbus interfaces (Profibus, CANopen, EtherCAT glue logic) alongside motion control loops. The industrial -40C to +85C temperature grade meets factory floor environmental requirements. The 672-pin FC-FBGA package supports multiple parallel sensor interfaces. The device's JTAG support enables in-field firmware updates via standard boundary-scan tools.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2A25F672I-7 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2A25F672C7 | EP2A25F672C8 | EP2A25F672C9 | EP2A25F672C9N | EP2A25F672C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 672-pin FC-FBGA | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) |
| System Gates | 900K | 900K (same) | 900K (same) | 900K (same) | 900K (same) | 900K (same) |
| Logic Elements | 24,320 | 24,320 (same) | 24,320 (same) | 24,320 (same) | 24,320 (same) | 24,320 (same) |
| Speed Grade | -7 | -7 (same) | -8 (slower) | -9 (slowest) | -9 (slowest) | -8 (slower) |
| Temperature Grade | Industrial -40C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Process Technology | 0.15 um | 0.15 um (same) | 0.15 um (same) | 0.15 um (same) | 0.15 um (same) | 0.15 um (same) |
| Core Voltage | 1.5 V | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- Industrial temperature grade for harsh environments （vs EP2A25F672C7)
- -7 speed grade for highest performance （vs EP2A25F672C9)
- 900K gates / 24,320 logic elements for high-density designs （vs EP2A15F672I8)
設計ノート
The EP2A25F672I-7 requires multiple supply rails (VCCINT core typically 1.5V, VCCIO I/O banks at 1.5V/1.8V/2.5V/3.3V depending on bank configuration, and VCCP for charge pump). Decoupling must follow Altera's APEX II hardware reference: place 0.1uF X7R ceramic capacitors within 0.25 inch of every power pin, plus bulk decoupling (10uF-100uF tantalum or polymer) at each supply entry point. Estimated worst-case quiescent current for a fully utilized EP2A25 device can exceed 1A on VCCINT; verify with the device datasheet PowerPlay early-power estimator during design.
The 672-pin FC-FBGA package requires careful PCB layout: microvia or via-in-pad technology is recommended for the BGA breakout, with the top layer dedicated to fanout. Maintain 50-ohm controlled impedance on high-speed LVDS traces and follow Altera's APEX II reference design for layer stackup (typically 8-12 layers with dedicated ground and power planes). Signal integrity simulations should be run on critical interfaces (clock, LVDS, external memory bus) before committing to fabrication.
Do not confuse the APEX II EP2A25 with the APEX 20KE EP20K400 or EP20K600 families - they share package codes but are NOT pin-compatible due to different die, I/O banking, and configuration schemes. When migrating, a board redesign may be required. Also verify the configuration scheme (Passive Serial vs Active Serial vs JTAG) matches your design; mixing schemes requires different external configuration memory (EPCS or EPC) devices. Confirm speed-grade timing margins against your critical paths using the Quartus II TimeQuest timing analyzer.
コンプライアンス情報
RoHS/REACH status not explicitly listed in available distributor data. APEX II family is industrial-grade only and not AEC-Q100 qualified for automotive applications. Verify compliance with the manufacturer before use in regulated markets.
