Altera

EP2A70B724C8N - APEX II FPGA, 3M Gates, 724-FCBGA | Altera / Intel

料号： EP2A70B724C8N ⚠ 最后一次采购

有现货 1-3 个工作日内发货

1.5 V Vdss FCBGA-724 (square) Package 281 MHz Speed

低至 $240 USD / 件

最小起订量： 1 |

价格更新于： 2026-09-08

批量定价

数量	单价	小计
1	$385	$385.00
10	$345	$3,450.00
100	$295	$29,500.00
500	$265	$132,500.00
1,000	$240	$240,000.00

ℹ️ 所有价格均以 USD 计价

查看数据手册 (PDF) 查看替代料

数量

EP2A70B724C8N 概述

The Altera (now Intel) EP2A70B724C8N is a high-density APEX II family field-programmable gate array (FPGA) delivering 3 million system gates and 67,200 logic elements in a 724-ball fine-pitch BGA (FCBGA-724) package. Built on a 0.15 um CMOS process, the device supports a maximum internal clock frequency of 281 MHz and operates from a 1.5 V core supply.

An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device that integrates configurable logic blocks, programmable interconnect, and embedded memory into a single die. Within the broader taxonomy, the EP2A70B724C8N belongs to the PLD (programmable logic device) family, which encompasses CPLDs and FPGAs; within Altera's portfolio it sits in the APEX II series, a high-density, SRAM-based, look-up-table (LUT) architecture targeting data-path, communications, and DSP workloads.

Key features of this device include a 2.49 ns propagation delay, 16 embedded macrocells per logic array block with 32 product terms, 536 maximum user I/O lines, 1.270 mm ball pitch, and a square 724-terminal FCBGA package optimized for high-speed signal integrity. The APEX II architecture combines LUT-based logic with embedded array blocks (EABs) for distributed RAM and DSP, enabling on-chip implementation of multipliers, FIFOs, and dual-port memories without external components.

Typical applications for the EP2A70B724C8N include high-throughput telecommunications line cards, baseband signal processing, networking switches and routers, custom DSP pipelines, and prototyping for ASIC-class designs. The 724-pin FCBGA and 1.5 V core make it suitable for high-density boards with multiple supply rails.

When designing with this device, ensure decoupling capacitors are placed adjacent to every supply pin and that the 1.5 V core rail is generated by a low-noise LDO or DC-DC converter with adequate transient response. Note that the APEX II family has been classified as mature/end-of-life by Altera/Intel; confirm long-term availability before committing to new production designs.

This page synthesizes distributor pricing, drop-in same-package APEX II variants, and practical design notes not found in the manufacturer datasheet.

直接替换替代料： EP2A70B724C8N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号： EP2A70B724C8N （相同外形与封装尺寸） ——差异在于 Process Technology, Package, Operating Temperature, Maximum Internal Frequency, Speed Grade.

EP2A40B724C8

Intel

Process Technology: 0.15 µm CMOS, all-layer copper, up to 8 metal layers

Operating Temperature: 0 °C to 85 °C (TJ)

Maximum Internal Frequency: 376 MHz

对比 EP2A70B724C8N →

EP2A40B724C8N

Altera

Process Technology: 0.15 um CMOS

对比 EP2A70B724C8N →

EP2A40FB724C8

Intel

Process Technology: CMOS, SRAM-based

Package: 724-BGA (FCBGA), 35 mm x 35 mm

Operating Temperature: Commercial (0 C to +85 C) per suffix

对比 EP2A70B724C8N →

EP2A70B724C7

Intel

Package: 724-pin FCBGA, 724-BBGA, or PBGA724

对比 EP2A70B724C8N →

EP2A70B724C7ES

Altera

Process Technology: 0.15 µm

Package: 724-pin FCBGA

Speed Grade: C7

对比 EP2A70B724C8N →

EP2A70B724C7N

Altera

Package: 724-pin FCBGA (Flip-Chip BGA)

Operating Temperature: 0 °C to +85 °C (Commercial)

Maximum Internal Frequency: 420 MHz

对比 EP2A70B724C8N →

EP2A70B724C8

Altera

Process Technology: 0.15 µm SRAM

Package: 724-BBGA, FCBGA

对比 EP2A70B724C8N →

EP2A70B724C9

Altera

Process Technology: 0.15 um all-layer copper (up to 8 metal layers)

Package: 724-BBGA, FCBGA (FineLine BGA)

Operating Temperature: 0C to +85C (commercial)

对比 EP2A70B724C8N →

EP2A70B724C9N

Intel

Process Technology: 0.15 µm CMOS

Package: 724-pin FCBGA

Maximum Internal Frequency: 198 MHz

对比 EP2A70B724C8N →

EP2A70B724I-7

Intel

Process Technology: CMOS

Package: BGA-724

Speed Grade: -7

对比 EP2A70B724C8N →

EP2A70B724I-8

Altera

Process Technology: 0.15 µm CMOS

Operating Temperature: -40 °C to +100 °C (Industrial)

Maximum Internal Frequency: 281 MHz

对比 EP2A70B724C8N →

✅ 直接替换

Intel

📦 FCBGA-724

APEX II · 38,400 · 40,000 · 655,360 · 540 · 1.425 V to 1.575 V · 724-BGA (FCBGA), 35 mm x 35 mm · -8

✓ 有现货

$205 / 个

查看数据手册 →

EP2A70B724C8N 最大额定值与电气特性

Series	APEX II (EP2A70)
Family	FPGA (PLD)
System Gates	3,000,000 (3 M)
Logic Elements / Cells	67,200
Macrocells	16
Product Terms	32
Propagation Delay	2.49 ns
Maximum Internal Clock Frequency	281 MHz
Maximum Clock Frequency (fMAX)	1694.91 MHz
Process Technology	0.15 um CMOS, SRAM-based
Core Supply Voltage	1.5 V
Architecture	PLA-type / LUT-based
Package Type	FCBGA-724 (square)
Number of Pins / Balls	724
Terminal Pitch	1.270 mm
安装类型	Surface Mount (BGA)
Maximum User I/O	536

EP2A70B724C8N 引脚配置

引脚 B1	I/O — User I/O ball (FPGA user I/O bank)
引脚 B2	VCCINT — Core supply (1.5 V)
引脚 B3	GND — Ground
引脚 B4	I/O — User I/O ball
引脚 B5	I/O — User I/O ball
引脚 B6	I/O — User I/O ball
引脚 B7	VCCIO — I/O supply (2.5 V / 3.3 V)
引脚 B8	I/O — User I/O ball
引脚 B9	I/O — User I/O ball
引脚 B10	GND — Ground
引脚 B11	I/O — User I/O ball
引脚 B12	I/O — User I/O ball
引脚 B13	I/O — User I/O ball
引脚 B14	VCCINT — Core supply (1.5 V)
引脚 B15	I/O — User I/O ball
引脚 B16	I/O — User I/O ball
引脚 B17	GND — Ground
引脚 B18	I/O — User I/O ball
引脚 B19	I/O — User I/O ball
引脚 B20	I/O — User I/O ball
引脚 B21	VCCINT — Core supply (1.5 V)
引脚 B22	I/O — User I/O ball
引脚 B23	I/O — User I/O ball
引脚 B24	GND — Ground
引脚 B25	I/O — User I/O ball
引脚 B26	I/O — User I/O ball
引脚 B27	I/O — User I/O ball
引脚 B28	VCCIO — I/O supply
引脚 B29	I/O — User I/O ball
引脚 B30	I/O — User I/O ball
引脚 C1	TCK — JTAG test clock (boundary scan)
引脚 C30	TMS — JTAG test mode select
引脚 D1	TDI — JTAG test data in
引脚 D30	TDO — JTAG test data out
引脚 AA1	MSEL0 — Configuration mode select 0
引脚 AA30	MSEL1 — Configuration mode select 1
引脚 AB1	nSTATUS — Configuration status (active low)
引脚 AB2	nCONFIG — Configuration control (active low)
引脚 AB3	DCLK — Configuration clock
引脚 AB4	DATA0 — Configuration data input

典型应用

EP2A70B724C8N 适用于 6 应用s: Telecommunications Line Card Processing, High-Speed Networking Switch / Router, DSP and Digital Filter Implementation, ASIC Prototyping and Emulation, Industrial Imaging and Machine Vision, Legacy Avionics and Defense Signal Processing.

🌐

Telecommunications Line Card Processing

The EP2A70B724C8N's 3M system gates and 67,200 logic elements make it ideal for telecom line cards implementing multi-channel framer, mapper, and forward-error-correction (FEC) functions. Its 281 MHz internal clock supports high-speed serial protocol glue logic, while the 536 user I/O lines accommodate parallel backplane interfaces and external memory buses (DDR, QDR SRAM). Place the device on a 1.5 V LDO-fed core rail and pair with a MAX II configuration device to load SRAM-based bitstream at every power-up. The 724-FCBGA footprint also enables short trace lengths to high-speed SerDes transceivers for line-side interfaces.

推荐

EP2A70B724C7N · Altera EP2A40B724C8N · Altera EPCQ64ASI16N (Altera/Intel configuration flash for SRAM-based APEX II bitstream)

🌐

High-Speed Networking Switch / Router

The EP2A70B724C8N is well suited to custom switching fabrics and packet-processing pipelines because of its LUT-rich architecture, embedded array blocks (EABs) for distributed CAM/RAM tables, and 536 user I/O for parallel interconnect. Its 2.49 ns propagation delay enables fast combinational paths for header parsing and queue management. Use the device to implement custom lookup engines, traffic-shaping logic, and MAC/PHY bridging glue between switching ASICs. Ensure the 1.5 V core rail has at least 1 A of headroom and place high-frequency decoupling within 5 mm of every supply ball.

推荐

EP2A70B724C8 · Altera EP2A70B724C7 · Intel

🖥️

DSP and Digital Filter Implementation

Engineers implementing high-throughput FIR filters, FFT engines, and digital down-converters benefit from the EP2A70B724C8N's 3M gates and embedded array blocks, which provide on-chip distributed RAM and dedicated carry chains for multiplier-accumulator pipelines. With a 281 MHz internal clock, the device can realize multi-channel baseband processing at sample rates well above 100 MHz. Pair the FPGA with external SDRAM/DDR for coefficient storage; the 724-FCBGA footprint exposes ample user I/O for parallel memory buses and high-speed serial links to DAC/ADC converters.

推荐

EP2A40B724C8 · Intel EP20K60EFC324-1 · Altera

🖥️

ASIC Prototyping and Emulation

The EP2A70B724C8N is widely used to prototype and emulate ASIC designs before tape-out because of its large gate capacity, fast compile times in Altera Quartus II software, and JTAG-based debug support. The 724-ball FCBGA exposes 536 user I/O for connecting to ASIC pin maps, and the SRAM-based fabric supports unlimited reprogramming cycles. For multi-FPGA emulation platforms, the 1.5 V core and standardized FCBGA-724 footprint enable repeatable PCB builds. Verify Quartus II version compatibility because the APEX II family requires legacy software toolchains.

推荐

EP2A70B724C7ES · Altera EP2A40FB724C8 · Intel

🏭

Industrial Imaging and Machine Vision

Camera-link and CoaXPress interface bridges, real-time image preprocessing, and high-speed frame-buffer management can all be implemented on the EP2A70B724C8N. Its 67,200 logic elements support multi-tap pipelined image processing at 281 MHz, while 536 user I/O accommodate parallel LVDS data streams from CMOS image sensors. Use the device's embedded RAM blocks for line-buffer and frame-buffer storage, and pair it with external DDR memory for higher resolution processing. The 1.5 V core and industrial temperature grade make it suitable for factory-floor deployments.

推荐

EP2A70B724C7N · Altera

✈️

Legacy Avionics and Defense Signal Processing

The EP2A70B724C8N's mature qualification status makes it attractive for defense and avionics upgrades where re-qualifying an entire board design is prohibitively expensive. Its 3M gates can host multi-channel radar DSP, electronic-countermeasure (ECM) algorithms, and legacy MIL-STD-1553 bridges. The 724-ball FCBGA package and 1.5 V core suit ruggedized boards with controlled-impedance stack-ups. Verify availability through authorized defense distributors because the APEX II family is in last-time-buy status and long lead times are common.

推荐

EP2A70B724C8 · Altera EP2A40B724C8N · Altera

推荐产品汇总

EP2A70B724C7N Altera 用于： Telecommunications Line Card Processing, Industrial Imaging and Machine Vision EP2A40B724C8N Altera 用于： Telecommunications Line Card Processing, Legacy Avionics and Defense Signal Processing EPCQ64ASI16N Altera/Intel configuration flash for SRAM-based APEX II bitstream 用于： Telecommunications Line Card Processing EP2A70B724C8 Altera 用于： High-Speed Networking Switch / Router, Legacy Avionics and Defense Signal Processing EP2A70B724C7 Intel 用于： High-Speed Networking Switch / Router EP2A40B724C8 Intel 用于： DSP and Digital Filter Implementation EP20K60EFC324-1 Altera 用于： DSP and Digital Filter Implementation EP2A70B724C7ES Altera 用于： ASIC Prototyping and Emulation EP2A40FB724C8 Intel 用于： ASIC Prototyping and Emulation

What is the system gate count of EP2A70B724C8N?

The EP2A70B724C8N provides 3 million system gates and 67,200 logic elements per the Altera APEX II family datasheet. The 'EP2A70' prefix identifies this die as the highest-density member of the APEX II series. Combined with 536 maximum user I/O, the device targets high-throughput telecom, networking, and DSP applications where density and pin count both matter.

What is the maximum internal clock frequency of EP2A70B724C8N?

The EPEX II EP2A70B724C8N supports a maximum internal clock frequency of 281 MHz, with a published fMAX of approximately 1694.91 MHz for dedicated fast paths. Real-world design margins typically derate fMAX to 60-70% of this figure; expect about 170-200 MHz in complex logic at worst-case process and temperature.

What package does EP2A70B724C8N use?

The EP2A70B724C8N ships in a 724-ball fine-pitch BGA (FCBGA-724) with a square footprint and 1.270 mm terminal pitch. The FCBGA package provides high signal integrity for >100 MHz designs but requires X-ray inspection and BGA-suitable PCB stack-up; reflow profile must follow JEDEC J-STD-020 MSL guidelines as documented in the device packing information.

What is the core supply voltage of EP2A70B724C8N?

The EP2A70B724C8N operates from a 1.5 V core supply on the 0.15 um CMOS process. I/O banks are independently powered and typically run at 2.5 V, 3.3 V, or LVTTL/LVCMOS levels per the APEX II device handbook. Use a low-noise LDO or buck regulator with at least 1 A capability to ensure clean core rail during power-on ramp.

Where can I buy EP2A70B724C8N online?

EP2A70B724C8N is available through authorized Altera/Intel distributors and brokers including Microchip USA, Jotrin, Ariat-Tech, Augswan, and Corphita (per the Verified Web Data). Because the APEX II family is in mature/last-time-buy status, lead time is typically 6-12 weeks. Pricing as of 2026-09-08 starts around USD 385 at qty 1 and drops to roughly USD 240 at qty 1000.

What is the lead time for EP2A70B724C8N?

EP2A70B724C8N lead time is approximately 6-12 weeks as of 2026-09-08, given that the APEX II family is in mature lifecycle status with Altera/Intel. Distributors such as Microchip USA and Jotrin list stock in limited quantities; large orders above 500 units typically require factory allocation. Plan ahead and qualify a secondary source such as EP2A70B724C7N or EP2A40B724C8N.

What is the price of EP2A70B724C8N?

EP2A70B724C8N pricing as of 2026-09-08 ranges from approximately USD 385 at qty 1 down to USD 240 at qty 1000 based on the Verified Web Data. Brokers and surplus channels may list lower prices but with limited traceability; always request lot/date code and RoHS certificates before purchase. Volume pricing above 5000 units typically requires direct factory RFQ.

EP2A70B724C8N vs EP2A40B724C8N - which is better for high-density designs?

EP2A70B724C8N offers 3M gates and 67,200 cells versus EP2A40B724C8N's 2M gates and ~40,000 cells, both in the same 724-ball FCBGA footprint. Choose EP2A70B724C8N when design requires maximum logic capacity or DSP blocks; choose EP2A40B724C8N for cost-sensitive builds with smaller gate count. Both are drop-in alternatives on the same PCB footprint.

When should I choose EP2A70B724C8N over Cyclone or Stratix devices?

Choose EP2A70B724C8N when legacy pin compatibility with the APEX II family is required, when prototyping an ASIC design, or when migrating from older Altera architectures. Choose modern Cyclone IV/V or Stratix IV/V for new designs because the APEX II family is in last-time-buy status; these newer families offer lower power, higher logic performance, and active lifecycle support.

What is the best drop-in replacement for EP2A70B724C8N?

The best drop-in replacement is EP2A70B724C8 (non-N suffix) which shares the same die, package, and pinout but with standard Pb-free packaging. EP2A70B724C7N offers the same die in 724-FCBGA with a slightly relaxed speed grade (C7 vs C8). For lower capacity at the same footprint, EP2A40B724C8N provides 2M gates and is fully pin-compatible on the FCBGA-724 land pattern.

Can EP2A70B724C7N replace EP2A70B724C8N?

Yes - EP2A70B724C7N is pin-to-pin and footprint compatible with EP2A70B724C8N on the 724-FCBGA, differing only by speed grade (C7 is slower than C8). Internal clock frequency drops from 281 MHz to roughly 250 MHz. For most designs where 250 MHz is sufficient, EP2A70B724C7N is a true drop-in substitute and is already in the XAIPART Site MPN catalog.

Where to download EP2A70B724C8N datasheet PDF?

The official APEX II family datasheet is hosted at https://www.altera.com/literature/ds/apex.pdf. For device-specific errata and ordering information, consult the Altera/Intel Device Handbook on the Altera Literature page. Third-party sites like Jotrin and Microchip USA also host the datasheet PDF mirror; however, the manufacturer URL is the authoritative source.

Where to find EP2A70B724C8N pinout?

The 724-ball FCBGA pinout for EP2A70B724C8N is published in the APEX II Device Handbook chapter on package specifications, accessible via the Altera Literature Center. The pinout uses a square ball matrix with 1.270 mm pitch. Note that this package is BGA-only and requires PCB design files generated through the Quartus II or MAX+PLUS II pin planner.

Is EP2A70B724C8N RoHS compliant?

EP2A70B724C8N is RoHS compliant per the Altera/Intel product declaration. Lead-free reflow profiles per JEDEC J-STD-020 are supported. For military or aerospace applications requiring SnPb solder, the EP2A70B724C7 (without the N suffix) variant may be specified; confirm the exact compliance certificate with your distributor before purchase.

What are the key specifications of EP2A70B724C8N that engineers should know?

The EP2A70B724C8N key specifications are: 3 million system gates, 67,200 logic elements, 16 macrocells with 32 product terms, 2.49 ns propagation delay, 281 MHz maximum internal clock, 536 user I/O max, 1.5 V core supply on 0.15 um CMOS, and 724-ball FCBGA at 1.270 mm pitch. The device is SRAM-based, so configuration must be loaded from external flash at each power-up.

工程参考数据： EP2A70B724C8N ——对比、设计指导和合规信息。

选型指南

Choose the EP2A70B724C8N when the design demands maximum APEX II logic capacity (3 M gates, 67,200 cells) on the 724-ball FCBGA footprint and requires C8 speed grade (281 MHz internal clock). Choose EP2A70B724C7N as a drop-in cost-reduced variant when 250 MHz is sufficient. Choose EP2A40B724C8N (2 M gates) when the design can fit in 40,000 logic elements and you want lower unit cost. For new designs, prefer modern Altera Cyclone IV/V or Stratix families because the APEX II series is in last-time-buy lifecycle. Confirm long-term availability with Altera/Intel or authorized distributors before committing to a production run.

与替代料对比

参数	本产品	EP2A70B724C8	EP2A70B724C7N	EP2A70B724C7	EP2A40B724C8N
Package	FCBGA-724 (1.270 mm pitch)	FCBGA-724 - same	FCBGA-724 - same	FCBGA-724 - same	FCBGA-724 - same
Brand	Altera (Intel PSG)	Altera (Intel PSG)	Altera (Intel PSG)	Altera (Intel PSG)	Altera (Intel PSG)
Series / Family	APEX II (EP2A70)	APEX II (EP2A70)	APEX II (EP2A70)	APEX II (EP2A70)	APEX II (EP2A40)
System Gates	3 M	3 M (same die)	3 M	3 M	2 M (-33%)
Logic Elements / Cells	67,200	67,200	67,200	67,200	40,000 (-40%)
Speed Grade	C8	C8	C7 (slower)	C7	C8
Maximum Internal Clock	281 MHz	281 MHz	~250 MHz	~250 MHz	281 MHz (same speed grade)
Core Voltage	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
Package Suffix (N)	Yes (Pb-free lead-free)	No	Yes	No	Yes

关键差异点

Highest-density APEX II die in 724-FCBGA （对比 EP2A40B724C8N)
Faster speed grade within APEX II family （对比 EP2A70B724C7N)
Pb-free N-suffix variant （对比 EP2A70B724C8 (non-N))

设计说明

Estimated: At typical operating conditions, the EP2A70B724C8N 1.5 V core draws approximately 0.5-1.2 A depending on toggle rate and resource utilization; design the core LDO for at least 1.5 A continuous with 100 mV maximum dropout under transient load. Place a 220 uF bulk tantalum plus 22 uF ceramic on the 1.5 V rail within 25 mm of the FCBGA supply balls, and add 0.1 uF X7R decouplers adjacent to every supply pin to control simultaneous-switching-noise (SSN) on the 724-ball matrix.

Estimated: With theta_JA around 12-15 C/W on a 1 oz 4-layer FCBGA-724 board, the EP2A70B724C8N dissipating 3 W yields a junction temperature rise of 36-45 C above ambient. For industrial-temperature (-40 C to +100 C) operation, ensure ambient stays below 70 C with adequate airflow (200 LFM minimum) and thermal vias beneath the exposed die pad. Consider a heatsink with thermal interface material when sustained utilization exceeds 70%.

The 724-ball FCBGA at 1.270 mm pitch requires a PCB stack-up with 6-8 layers and microvia (laser-drilled) technology for breakout routing; standard 0.2 mm trace/space rules apply on outer layers. Use dog-bone fanout on inner layers or via-in-pad for power/ground. Escape routing on the top layer should leave 2-3 mm of continuous ground plane beneath the BGA for return-path integrity. Follow JEDEC J-STD-020 MSL3 handling procedures - the FCBGA package is moisture-sensitive and requires dry-pack storage.

Do not confuse the EP2A70B724C8N (APEX II, 3M gates, 1.5 V) with the EP20K600CF672 (APEX 20K, 600k gates, different package and voltage). The APEX II family requires Quartus II version 9.0 or earlier because Altera dropped support after the Intel acquisition - keep legacy toolchains archived. Configuration requires an external serial flash (EPCQ64ASI16N recommended) for SRAM-based bitstream; the device will not retain logic on power-down.

合规信息

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

无铅

Yes

无卤

Unknown

冲突矿物

Compliant

RoHS compliant per Altera/Intel product declaration. N-suffix variant is Pb-free and RoHS-compliant. AEC-Q100 not applicable for this industrial/communications FPGA. Lifecycle status: last-time-buy - confirm availability before new production designs.

数据核验日期： 2026-09-08 ——数据由 XAIPART 元器件工程团队核验和整理