EP2A70F1508C8ES - APEX II FPGA 1.14M Gates 1508-FCBGA | Intel
料号： EP2A70F1508C8ES ⚠ 最后一次采购| 数量 | 单价 | 小计 |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2A70F1508C8ES 概述
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows designers to implement custom digital circuits through configuration of internal logic blocks, embedded memory, and routing resources. APEX II sits in the hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor, and is widely used as a flexible ASIC replacement in high-performance digital designs where time-to-market and design flexibility outweigh pure unit-cost optimization.
Key differentiating features include 1,146,880 system gates, 67,200 logic elements, embedded system blocks (ESBs) implementing dual-port RAM, ROM, FIFO and CAM, and 1,060 maximum user I/O. The -8 speed grade corresponds to approximately 100 MHz internal operation in APEX II silicon. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, and LVDS through dedicated I/O banks.
The APEX II architecture combines a MultiCore interconnect fabric with embedded system blocks for memory-intensive functions. Each ESB provides up to 2,048 bits of dual-port RAM, and the embedded multipliers plus PLLs support DSP-style signal processing and clock management. The 1508-FCBGA package exposes the largest I/O count in the family, enabling high-bandwidth parallel interfaces.
Typical applications include high-speed communication ASIC prototyping, telecom line-card glue logic, industrial vision and image-processing pipelines, ASIC emulation, and high-performance data-path acceleration. The large gate count supports entire subsystems (RISC soft-cores plus peripherals) on a single device.
When designing with this part, plan power integrity carefully: a fully populated EP2A70 can exceed 2-3 A core current with transients during configuration. Use a multi-layer PCB with dedicated power planes and bulk ceramic decoupling at the FCBGA's underside balls.
This page synthesizes distributor pricing, drop-in Altera/Intel alternatives from the APEX II family, and practical design notes not found in the datasheet alone.
直接替换替代料： EP2A70F1508C8ES ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2A70F1508C8ES （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, Mounting Type, Family.
快速对比工具——选择替代料号进行并排对比：
EP2A70F1508C8
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1495 / 个
查看数据手册 →EP2A70F1508C7
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$645 / 个
查看数据手册 →EP2A70F1508C7ES
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$250 / 个
查看数据手册 →EP2A70F1508C7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
联系询价
查看数据手册 →EP2A70F1508C6
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$175 / 个
查看数据手册 →EP2A70F1508C8ES 最大额定值与电气特性
| Family | APEX II |
| Series | EP2A |
| System Gates | 1,146,880 |
| Logic Elements | 67,200 |
| Embedded System Blocks (ESB) | Available (dual-port RAM/ROM/FIFO/CAM) |
| Maximum User I/O | 1,060 |
| Core Voltage | 1.5 V |
| Speed Grade | -8 |
| 封装 | 1508-ball FCBGA (Fine-pitch Chip-Scale BGA) |
| Configuration Memory | SRAM (in-system programmable) |
| 工作温度 | Commercial (0C to +85C) |
| 安装类型 | Surface Mount (BGA) |
| MSL 等级 | 3 |
| RoHS 状态 | Check manufacturer page - APEX II is a mature family with mixed compliance |
EP2A70F1508C8ES 1508-ball fcbga (fine-pitch chip-scale bga) 引脚配置指南
EP2A70F1508C8ES（1508-ball fcbga (fine-pitch chip-scale bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2A70F1508C8ES.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2A70F1508C8ES 适用于 6 应用s: Telecom Line-Card Glue Logic, ASIC Emulation and Prototyping, High-Speed Industrial Imaging Pipeline, DSP-Style Signal Processing Accelerator, Data-Path Acceleration in Storage Systems, Legacy Industrial Control and Test.
Telecom Line-Card Glue Logic
The EP2A70F1508C8ES's 1,146,880 system gates and 1,060 user I/O make it ideal for telecom line-card glue logic where many disparate interfaces must be bridged. With 67,200 LEs available, designers can integrate multiple interface bridges (Utopia, POS-PHY, SerDes glue) plus framing logic and a soft RISC controller on a single device. The 1508-FCBGA package supports the high pin count needed for parallel data buses plus LVDS serial links, while the -8 speed grade (~100 MHz Fmax) is sufficient for most line-card glue functions. Its SRAM-based configuration allows field upgrades when protocol revisions arrive.
推荐
ASIC Emulation and Prototyping
With 67,200 logic elements plus embedded dual-port RAM blocks, the EP2A70F1508C8ES serves as a multi-million-gate ASIC emulator for pre-silicon validation. Designers partition an ASIC RTL design across one or more EP2A70 devices, using the abundant ESB memory to model ASIC SRAM blocks. The 1508-FCBGA exposes all 1,060 user I/O for prototype boundary-scan, and the -8 speed grade supports emulation clock rates typically limited by ASIC floorplan rather than FPGA Fmax. Quartus II legacy support includes multi-FPGA partitioning flows for larger ASIC designs.
推荐
High-Speed Industrial Imaging Pipeline
The EP2A70F1508C8ES's high logic density and 1,060 I/O suit industrial machine-vision pipelines where multiple Camera Link or LVDS image sensors must be aggregated, processed, and forwarded over Gigabit Ethernet or fibre channel. The ESB dual-port RAMs act as line buffers between sensor FIFOs and the processing datapath, while the 67,200 LEs implement image preprocessing (white balance, Bayer demosaic, edge detection). The 1508-FCBGA package provides the routing density for wide parallel sensor buses plus LVDS high-speed serial links, all under -8 speed grade timing.
推荐
DSP-Style Signal Processing Accelerator
The APEX II architecture's embedded system blocks and abundant logic make the EP2A70F1508C8ES a capable co-processor for DSP-style workloads such as radar baseband processing, software-defined radio channelizers, or polyphase filterbanks. Each ESB can implement 2,048 bits of dual-port RAM used as coefficient or data buffers, while the LE fabric hosts the arithmetic datapath. The -8 speed grade enables approximately 100 MHz operation, sufficient for moderate-bandwidth channelization. The 1508-FCBGA exposes sufficient LVDS pairs for high-speed data ingress from front-end ADCs.
推荐
Data-Path Acceleration in Storage Systems
Storage system designers use the EP2A70F1508C8ES to accelerate data-path functions such as RAID XOR, encryption (AES), and Reed-Solomon encoding, where the 67,200 LEs implement datapath state machines and the ESBs hold intermediate operands. The 1508-FCBGA's 1,060 I/O expose multiple SAS/SATA host interfaces and DDR memory channels in parallel, enabling sustained multi-gigabyte-per-second throughput. The -8 speed grade sustains the clock rates needed for line-rate processing on 6 Gb/s SAS links, and the SRAM programmability allows field-upgrading codec implementations as standards evolve.
推荐
Legacy Industrial Control and Test
The EP2A70F1508C8ES continues to serve in long-lifecycle industrial controllers and ATE platforms where the original design cannot be respun. Its 67,200 LEs handle custom test-pattern generation, fixture control, and instrument-bus bridging in legacy ATE platforms. The -8 speed grade provides deterministic timing suitable for instrumentation synchronization, while the 1508-FCBGA's high pin count to drive fixture I/O without external muxing. SRAM configurability enables field updates when test programs change.
推荐
推荐产品汇总
工程参考数据： EP2A70F1508C8ES ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2A70F1508C8 | EP2A70F1508C7 | EP2A70F1508C7ES | EP2A70F1508C7N | EP2A70F1508C6 |
|---|---|---|---|---|---|---|
| Package | 1508-FCBGA | 1508-FCBGA - same | 1508-FCBGA - same | 1508-FCBGA - same | 1508-FCBGA - same | 1508-FCBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Speed Grade | -8 | -8 | -7 (faster) | -7 (faster) | -7 (faster) | -6 (slower) |
| Logic Elements | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 |
| System Gates | 1,146,880 | 1,146,880 | 1,146,880 | 1,146,880 | 1,146,880 | 1,146,880 |
| Maximum User I/O | 1,060 | 1,060 | 1,060 | 1,060 | 1,060 | 1,060 |
| Temperature Grade | Commercial (ES extended screening) | Commercial | Commercial | Extended screening | Commercial lead-free | Commercial |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
关键差异点
- Highest-density APEX II device in 1508-FCBGA package （对比 EP2A40F1508C8ES)
- Balanced -8 speed grade vs faster -7 （对比 EP2A70F1508C7)
- ES extended-screening variant （对比 EP2A70F1508C8)
设计说明
The EP2A70F1508C8ES core can pull 2-3 A at 1.5 V under full switching activity, with large transient currents during SRAM configuration. Use a multi-layer PCB with a dedicated 1.5 V plane and place bulk ceramic capacitors (>= 100 uF total) directly under the FCBGA footprint. Decoupling: 0.1 uF X7R at every active VCCIO ball group, plus 10 uF bulk per bank. Estimated: at VIN=1.5 V, ICC=2.5 A, total core power ~3.75 W plus I/O bank power.
The 1508-FCBGA package has a typical theta-JA of approximately 8-12 C/W (exact value [DATA_NEEDED] from APEX II thermal model) when mounted on a 4-layer JEDEC test board with thermal vias. Total device power can exceed 5 W under sustained high activity, requiring either forced-air cooling or a heat spreader. Place 4 thermal vias minimum under the central die-expose region to pull heat into an inner copper plane.
FCBGA 1508 assembly with 1.0 mm or finer ball pitch demands careful PCB fabrication: microvia or stacked-via technology is required for inner-row fan-out, and ENIG or OSP surface finish is recommended for fine-pitch BGA reliability. Use 0.4 mm-diameter solder mask-defined (SMD) pads, and run X-ray inspection on assembled boards to verify joint integrity under the central balls (which are not visually inspectable).
The APEX II MultiCore interconnect benefits from uniform routing density - avoid routing long parallel tracks over many rows, which consume scarce routing tracks and degrade Fmax. For high-speed I/O (DDR, LVDS), match trace impedance to 50 dΩ single-ended or 100 dΩ differential, and keep stubs shorter than 3 mm. Place series resistors at the FPGA driver pins for SSTL/SSTL-II outputs.
Do not assume the APEX II family is still in production - it has been moved to last-time-buy by Intel. Always check the latest PCN before committing to a new design. The -8 speed grade is the baseline; faster -7 grade provides only ~10-15% Fmax improvement at higher dynamic power, so do not over-specify. Finally, ensure JTAG chain integrity: APEX II JTAG pins require external 1k pull-ups to VCCIO of the JTAG bank for reliable configuration.
合规信息
Compliance status not explicitly provided in Verified Web Data. APEX II is a mature Intel/Altera FPGA family; refer to the manufacturer PCN and material declaration for definitive compliance information. Not AEC-Q100 qualified (FPGA is not typically AEC-Q100).
