EP2A70F1508C8ES - APEX II FPGA 1.14M Gates 1508-FCBGA | Intel
부품 번호: EP2A70F1508C8ES ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2A70F1508C8ES 개요
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows designers to implement custom digital circuits through configuration of internal logic blocks, embedded memory, and routing resources. APEX II sits in the hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor, and is widely used as a flexible ASIC replacement in high-performance digital designs where time-to-market and design flexibility outweigh pure unit-cost optimization.
Key differentiating features include 1,146,880 system gates, 67,200 logic elements, embedded system blocks (ESBs) implementing dual-port RAM, ROM, FIFO and CAM, and 1,060 maximum user I/O. The -8 speed grade corresponds to approximately 100 MHz internal operation in APEX II silicon. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, and LVDS through dedicated I/O banks.
The APEX II architecture combines a MultiCore interconnect fabric with embedded system blocks for memory-intensive functions. Each ESB provides up to 2,048 bits of dual-port RAM, and the embedded multipliers plus PLLs support DSP-style signal processing and clock management. The 1508-FCBGA package exposes the largest I/O count in the family, enabling high-bandwidth parallel interfaces.
Typical applications include high-speed communication ASIC prototyping, telecom line-card glue logic, industrial vision and image-processing pipelines, ASIC emulation, and high-performance data-path acceleration. The large gate count supports entire subsystems (RISC soft-cores plus peripherals) on a single device.
When designing with this part, plan power integrity carefully: a fully populated EP2A70 can exceed 2-3 A core current with transients during configuration. Use a multi-layer PCB with dedicated power planes and bulk ceramic decoupling at the FCBGA's underside balls.
This page synthesizes distributor pricing, drop-in Altera/Intel alternatives from the APEX II family, and practical design notes not found in the datasheet alone.
드롭인 대체품: EP2A70F1508C8ES — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A70F1508C8ES (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Mounting Type, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A70F1508C8
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1495 / 개
데이터시트 보기 →EP2A70F1508C7
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$645 / 개
데이터시트 보기 →EP2A70F1508C7ES
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$250 / 개
데이터시트 보기 →EP2A70F1508C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →EP2A70F1508C6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$175 / 개
데이터시트 보기 →EP2A70F1508C8ES 최대 정격 & 전기적 특성
| Family | APEX II |
| Series | EP2A |
| System Gates | 1,146,880 |
| Logic Elements | 67,200 |
| Embedded System Blocks (ESB) | Available (dual-port RAM/ROM/FIFO/CAM) |
| Maximum User I/O | 1,060 |
| Core Voltage | 1.5 V |
| Speed Grade | -8 |
| 패키지 | 1508-ball FCBGA (Fine-pitch Chip-Scale BGA) |
| Configuration Memory | SRAM (in-system programmable) |
| 동작 온도 | Commercial (0C to +85C) |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | 3 |
| RoHS 상태 | Check manufacturer page - APEX II is a mature family with mixed compliance |
EP2A70F1508C8ES 1508-ball fcbga (fine-pitch chip-scale bga) 핀 구성 가이드
EP2A70F1508C8ES(1508-ball fcbga (fine-pitch chip-scale bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A70F1508C8ES.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A70F1508C8ES 적합 용도: 6 애플리케이션s: Telecom Line-Card Glue Logic, ASIC Emulation and Prototyping, High-Speed Industrial Imaging Pipeline, DSP-Style Signal Processing Accelerator, Data-Path Acceleration in Storage Systems, Legacy Industrial Control and Test.
Telecom Line-Card Glue Logic
The EP2A70F1508C8ES's 1,146,880 system gates and 1,060 user I/O make it ideal for telecom line-card glue logic where many disparate interfaces must be bridged. With 67,200 LEs available, designers can integrate multiple interface bridges (Utopia, POS-PHY, SerDes glue) plus framing logic and a soft RISC controller on a single device. The 1508-FCBGA package supports the high pin count needed for parallel data buses plus LVDS serial links, while the -8 speed grade (~100 MHz Fmax) is sufficient for most line-card glue functions. Its SRAM-based configuration allows field upgrades when protocol revisions arrive.
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ASIC Emulation and Prototyping
With 67,200 logic elements plus embedded dual-port RAM blocks, the EP2A70F1508C8ES serves as a multi-million-gate ASIC emulator for pre-silicon validation. Designers partition an ASIC RTL design across one or more EP2A70 devices, using the abundant ESB memory to model ASIC SRAM blocks. The 1508-FCBGA exposes all 1,060 user I/O for prototype boundary-scan, and the -8 speed grade supports emulation clock rates typically limited by ASIC floorplan rather than FPGA Fmax. Quartus II legacy support includes multi-FPGA partitioning flows for larger ASIC designs.
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High-Speed Industrial Imaging Pipeline
The EP2A70F1508C8ES's high logic density and 1,060 I/O suit industrial machine-vision pipelines where multiple Camera Link or LVDS image sensors must be aggregated, processed, and forwarded over Gigabit Ethernet or fibre channel. The ESB dual-port RAMs act as line buffers between sensor FIFOs and the processing datapath, while the 67,200 LEs implement image preprocessing (white balance, Bayer demosaic, edge detection). The 1508-FCBGA package provides the routing density for wide parallel sensor buses plus LVDS high-speed serial links, all under -8 speed grade timing.
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DSP-Style Signal Processing Accelerator
The APEX II architecture's embedded system blocks and abundant logic make the EP2A70F1508C8ES a capable co-processor for DSP-style workloads such as radar baseband processing, software-defined radio channelizers, or polyphase filterbanks. Each ESB can implement 2,048 bits of dual-port RAM used as coefficient or data buffers, while the LE fabric hosts the arithmetic datapath. The -8 speed grade enables approximately 100 MHz operation, sufficient for moderate-bandwidth channelization. The 1508-FCBGA exposes sufficient LVDS pairs for high-speed data ingress from front-end ADCs.
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Data-Path Acceleration in Storage Systems
Storage system designers use the EP2A70F1508C8ES to accelerate data-path functions such as RAID XOR, encryption (AES), and Reed-Solomon encoding, where the 67,200 LEs implement datapath state machines and the ESBs hold intermediate operands. The 1508-FCBGA's 1,060 I/O expose multiple SAS/SATA host interfaces and DDR memory channels in parallel, enabling sustained multi-gigabyte-per-second throughput. The -8 speed grade sustains the clock rates needed for line-rate processing on 6 Gb/s SAS links, and the SRAM programmability allows field-upgrading codec implementations as standards evolve.
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Legacy Industrial Control and Test
The EP2A70F1508C8ES continues to serve in long-lifecycle industrial controllers and ATE platforms where the original design cannot be respun. Its 67,200 LEs handle custom test-pattern generation, fixture control, and instrument-bus bridging in legacy ATE platforms. The -8 speed grade provides deterministic timing suitable for instrumentation synchronization, while the 1508-FCBGA's high pin count to drive fixture I/O without external muxing. SRAM configurability enables field updates when test programs change.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2A70F1508C8ES — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A70F1508C8 | EP2A70F1508C7 | EP2A70F1508C7ES | EP2A70F1508C7N | EP2A70F1508C6 |
|---|---|---|---|---|---|---|
| Package | 1508-FCBGA | 1508-FCBGA - same | 1508-FCBGA - same | 1508-FCBGA - same | 1508-FCBGA - same | 1508-FCBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Speed Grade | -8 | -8 | -7 (faster) | -7 (faster) | -7 (faster) | -6 (slower) |
| Logic Elements | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 |
| System Gates | 1,146,880 | 1,146,880 | 1,146,880 | 1,146,880 | 1,146,880 | 1,146,880 |
| Maximum User I/O | 1,060 | 1,060 | 1,060 | 1,060 | 1,060 | 1,060 |
| Temperature Grade | Commercial (ES extended screening) | Commercial | Commercial | Extended screening | Commercial lead-free | Commercial |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- Highest-density APEX II device in 1508-FCBGA package (vs EP2A40F1508C8ES)
- Balanced -8 speed grade vs faster -7 (vs EP2A70F1508C7)
- ES extended-screening variant (vs EP2A70F1508C8)
설계 노트
The EP2A70F1508C8ES core can pull 2-3 A at 1.5 V under full switching activity, with large transient currents during SRAM configuration. Use a multi-layer PCB with a dedicated 1.5 V plane and place bulk ceramic capacitors (>= 100 uF total) directly under the FCBGA footprint. Decoupling: 0.1 uF X7R at every active VCCIO ball group, plus 10 uF bulk per bank. Estimated: at VIN=1.5 V, ICC=2.5 A, total core power ~3.75 W plus I/O bank power.
The 1508-FCBGA package has a typical theta-JA of approximately 8-12 C/W (exact value [DATA_NEEDED] from APEX II thermal model) when mounted on a 4-layer JEDEC test board with thermal vias. Total device power can exceed 5 W under sustained high activity, requiring either forced-air cooling or a heat spreader. Place 4 thermal vias minimum under the central die-expose region to pull heat into an inner copper plane.
FCBGA 1508 assembly with 1.0 mm or finer ball pitch demands careful PCB fabrication: microvia or stacked-via technology is required for inner-row fan-out, and ENIG or OSP surface finish is recommended for fine-pitch BGA reliability. Use 0.4 mm-diameter solder mask-defined (SMD) pads, and run X-ray inspection on assembled boards to verify joint integrity under the central balls (which are not visually inspectable).
The APEX II MultiCore interconnect benefits from uniform routing density - avoid routing long parallel tracks over many rows, which consume scarce routing tracks and degrade Fmax. For high-speed I/O (DDR, LVDS), match trace impedance to 50 dΩ single-ended or 100 dΩ differential, and keep stubs shorter than 3 mm. Place series resistors at the FPGA driver pins for SSTL/SSTL-II outputs.
Do not assume the APEX II family is still in production - it has been moved to last-time-buy by Intel. Always check the latest PCN before committing to a new design. The -8 speed grade is the baseline; faster -7 grade provides only ~10-15% Fmax improvement at higher dynamic power, so do not over-specify. Finally, ensure JTAG chain integrity: APEX II JTAG pins require external 1k pull-ups to VCCIO of the JTAG bank for reliable configuration.
규정 준수 정보
Compliance status not explicitly provided in Verified Web Data. APEX II is a mature Intel/Altera FPGA family; refer to the manufacturer PCN and material declaration for definitive compliance information. Not AEC-Q100 qualified (FPGA is not typically AEC-Q100).
