EP2AGX45DF25I5G - Arria II GX 45K FPGA, 252 I/O, 572-FBGA | Intel
料号： EP2AGX45DF25I5G ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $911.7 | $911.70 |
| 10 | $820.53 | $8,205.30 |
| 100 | $729.36 | $72,936.00 |
| 250 | $675.2 | $168,800.00 |
| 500 | $638.19 | $319,095.00 |
EP2AGX45DF25I5G 概述
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory blocks, DSP slices, programmable interconnect, and a periphery of user I/O. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, and below ASICs in performance-per-watt but above them in flexibility and time-to-market. The Arria II GX family specifically integrates multi-gigabit transceivers and hard PCI Express blocks, positioning the device between pure logic fabrics (Cyclone) and high-end DSP/ transceiver families (Stratix).
Key features include dedicated 3.125 Gbps transceivers, embedded hard IP for PCI Express Gen1 (×1, ×4, ×8), 2.7 Mbits of on-chip memory, 156 embedded 18×18 multipliers, and a 500 MHz fabric performance. The -I5 speed/temperature grade delivers industrial temperature range support and a moderate speed bin suitable for cost-sensitive transceiver designs. The 0.9 V core supply supports enhanced low-power operation versus earlier 90/65 nm generations.
The architecture combines logic fabric, embedded memory, DSP blocks, and transceivers in a single die, with hard IP blocks for PCIe, memory controllers, and the CDR/PCS that back the multi-gigabit serial links. Designers use the Quartus II design suite (or later Quartus Prime) with the Arria II Device Handbook for implementation, timing closure, and transceiver configuration.
Typical applications include wireless baseband processing, broadcast and professional video equipment, radar and signal-intelligence front ends, high-speed serial protocol bridging (PCIe, Serial RapidIO, CPRI), and industrial imaging pipelines. The transceiver count and PCIe Gen1 hard IP make the part especially attractive for wireless remote radio heads and video capture cards.
When designing with the EP2AGX45DF25I5G, allocate adequate PCB layers for the FC-FBGA break-out, follow Intel's transceiver reference design for the 25 mm × 25 mm footprint, and validate signal-integrity for any SERDES link running above 1 Gbps. The -I5 grade is suitable for industrial-temperature deployments but is not automotive-grade; for automotive use, migrate to an AEC-Q100-qualified equivalent.
This page synthesizes distributor pricing, same-package drop-in alternatives, and application design notes that complement (and in places extend) the information found in the manufacturer datasheet and Arria II GX handbook.
直接替换替代料： EP2AGX45DF25I5G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2AGX45DF25I5G （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, Logic Elements, PCIe Hard IP.
快速对比工具——选择替代料号进行并排对比：
EP2AGX45DF25I5
✅ 直接替换✓ 有现货
$372 / 个
查看数据手册 →EP2AGX45DF25C5G
✅ 直接替换✓ 有现货
$118 / 个
查看数据手册 →EP2AGX45DF25I3G
✅ 直接替换✓ 有现货
$370 / 个
查看数据手册 →EP2AGX65DF25I5G
✅ 直接替换✓ 有现货
$378 / 个
查看数据手册 →EP2AGX125DF25I5G
✅ 直接替换✓ 有现货
$295 / 个
查看数据手册 →EP2AGX45DF25I5G 最大额定值与电气特性
| Family | Arria II GX |
| Logic Elements (LE) | 42,959 |
| User I/O Count | 252 |
| 封装 | 572-FBGA (FC-FBGA, 25 mm × 25 mm, 1.0 mm pitch) |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Maximum Fabric Frequency | 500 MHz |
| Transceivers | Up to 3.125 Gbps |
| Embedded Memory | 2.7 Mbits |
| Embedded 18×18 Multipliers | 156 |
| PCIe Hard IP | PCI Express Gen1 (×1, ×4, ×8) |
| Speed Grade | I5 |
| 工作温度 | -40 °C to +100 °C (industrial) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant (Pb-free) |
EP2AGX45DF25I5G 572-fbga (fc-fbga, 25 mm × 25 mm, 1.0 mm pitch) 引脚配置指南
EP2AGX45DF25I5G（572-fbga (fc-fbga, 25 mm × 25 mm, 1.0 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2AGX45DF25I5G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2AGX45DF25I5G 适用于 6 应用s: Wireless Baseband Processing, Broadcast and Professional Video Equipment, Radar and Signal-Intelligence Front Ends, PCIe Gen1 Endpoint and Bridge Cards, High-Speed Serial Protocol Bridging, Industrial Imaging and Machine Vision.
Wireless Baseband Processing
The EP2AGX45DF25I5G's 42,959 logic elements, 156 embedded 18×18 multipliers, and 2.7 Mbits of on-chip memory provide sufficient DSP fabric for LTE and WiMAX baseband channel cards, while the integrated multi-gigabit transceivers deliver CPRI/OBSAI links to remote radio heads at up to 3.125 Gbps. Placed on a baseband card with a 10-layer PCB and matched-impedance SERDES routing, the -I5 industrial temperature grade supports outdoor-mounted base stations. Unlike ASIC-based baseband solutions, the FPGA fabric enables late-binding protocol updates and multi-standard support.
推荐
Broadcast and Professional Video Equipment
The 3.125 Gbps transceivers on EP2AGX45DF25I5G handle SDI, HDMI, and DisplayPort multi-lane serialization for broadcast video routers, format converters, and production switchers. The 252 user I/Os support multiple parallel video interfaces simultaneously, and the embedded memory buffers full-HD frames without external DDR in many configurations. The industrial temperature grade enables deployment in uncooled broadcast cabinets and outside-broadcast trucks where temperature swings are common.
推荐
Radar and Signal-Intelligence Front Ends
The 156 embedded 18×18 multipliers deliver the DSP throughput needed for digital down-conversion, pulse compression, and beamforming in radar and SIGINT receivers. The transceivers digitize RF outputs directly from ADC devices at multi-gigabit sample rates, while the 42K-LE fabric implements FFT engines and adaptive filters. The industrial temperature grade supports ruggedized defense and avionics enclosures, and the 572-FBGA package enables dense PCB layouts for size-constrained platforms.
推荐
PCIe Gen1 Endpoint and Bridge Cards
The EP2AGX45DF25I5G includes hard PCI Express Gen1 IP supporting ×1, ×4, and ×8 lane configurations, enabling direct PCIe endpoint implementations without external bridge chips. This is ideal for data acquisition cards, software-defined radio cards, and protocol bridge boards that interface to host CPUs through PCIe. The transceivers provide additional SERDES for SATA, Serial RapidIO, or custom serial links alongside the PCIe interface, eliminating multiple protocol bridge ASICs.
推荐
High-Speed Serial Protocol Bridging
The multi-gigabit transceivers and PCIe Gen1 hard IP make EP2AGX45DF25I5G ideal for bridging between incompatible serial protocols, such as Serial RapidIO to PCIe, CPRI to Ethernet, or Aurora to custom backplanes. The 42K-LE fabric implements protocol adaptation logic, while the transceivers handle physical-layer serialization up to 3.125 Gbps per channel. Industrial temperature grade supports deployment in factory floors, outdoor cabinets, and industrial control systems.
推荐
Industrial Imaging and Machine Vision
The EP2AGX45DF25I5G's high user I/O count (252) accepts multiple Camera Link, CoaXPress, or LVDS camera inputs simultaneously, while the transceivers support CoaXPress and 10 GigE Vision over a single cable. The embedded memory buffers raw Bayer frames before compression, and the DSP multipliers accelerate JPEG, H.264, or custom image-processing pipelines. The industrial temperature grade and surface-mount FC-BGA package suit factory-floor vision systems with continuous operation.
推荐
推荐产品汇总
工程参考数据： EP2AGX45DF25I5G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2AGX45DF25I5 | EP2AGX45DF25C5G | EP2AGX45DF25I3G | EP2AGX65DF25I5G | EP2AGX125DF25I5G |
|---|---|---|---|---|---|---|
| Package | 572-FBGA (DF25, 25x25 mm, 1.0 mm pitch) | 572-FBGA (DF25, 25x25 mm) - same | 572-FBGA (DF25, 25x25 mm) - same | 572-FBGA (DF25, 25x25 mm) - same | 572-FBGA (DF25, 25x25 mm) - same | 572-FBGA (DF25, 25x25 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 | ~56,400 (+31%) | ~118,500 (+176%) |
| User I/Os | 252 | 252 | 252 | 252 | 252 | 252 |
| Speed Grade | I5 (industrial, -40 to +100 °C) | I5 (industrial) | C5 (commercial, 0 to +85 °C) | I3 (slower industrial) | I5 (industrial) | I5 (industrial) |
| Transceivers | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps (more channels) |
| Embedded Memory | 2.7 Mbits | 2.7 Mbits | 2.7 Mbits | 2.7 Mbits | ~4.0 Mbits | ~8.0 Mbits |
| Embedded 18×18 Multipliers | 156 | 156 | 156 | 156 | ~264 | ~488 |
| Pb-free / RoHS | Yes (G suffix) | No (leaded) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) |
关键差异点
- Industrial temperature grade with -I5 speed bin in 572-FBGA package （对比 EP2AGX45DF25C5G)
- Pin-compatible with higher-density EP2AGX65 and EP2AGX125 variants （对比 EP2AGX65DF25I5G)
- Pb-free / RoHS compliant packaging with G suffix （对比 EP2AGX45DF25I5)
设计说明
Estimated: The 572-ball FC-BGA at 1.0 mm pitch requires a high-density PCB stack-up - use at least 10 layers with microvia (laser-drilled) technology for breakout. Per Intel's Arria II GX Handbook, route all transceiver differential pairs on the top layers with matched impedance (100 Ω differential for 3.125 Gbps), and keep total SERDES trace length under 100 mm to maintain signal-integrity margin. Use a continuous ground plane under the BGA balls and stitch ground vias around the periphery.
Estimated: At maximum fabric utilization with 3.125 Gbps transceivers active, the EP2AGX45DF25I5G core power draw typically reaches 5-8 W. Provide separate 0.9 V core, 1.2 V transceiver, 2.5 V auxiliary, and 3.3 V I/O rails with high-frequency decoupling (10 nF + 100 nF + 10 µF combinations) placed as close as possible to each supply ball. Use at least 4 decoupling capacitors per supply pin group per Intel's pin connection guidelines.
Do not assume any I/O bank can operate at any voltage - the Arria II GX has separate banks for LVDS, LVCMOS, and SERDES with strict VCCIO compatibility. Verify pin assignments with the Quartus pin planner before layout. Also note that the -I5 industrial temperature grade is NOT automotive-qualified; do not deploy in automotive applications without an AEC-Q100-qualified variant.
Estimated: At 7 W total power dissipation, the FC-BGA package requires thermal management. With theta_JA typically around 12-15 °C/W for the 25×25 mm FC-BGA, junction temperature rises approximately 84-105 °C above ambient without forced airflow. Implement a heatsink or thermal pad with at least 2 cfm airflow for industrial-temperature deployments where ambient may reach +85 °C.
For 3.125 Gbps SERDES channels, follow Intel's transceiver layout guidelines strictly: maintain 100 Ω differential impedance, length-match P/N within 0.5 mm, keep AC-coupling capacitors close to the transmitter side, and provide a continuous reference ground plane. Series-of-emphasis and pre-emphasis settings should be tuned per channel using the Transceiver Toolkit in Quartus II.
合规信息
RoHS compliance indicated by 'G' suffix in MPN. Not AEC-Q100 qualified; the -I5 industrial grade is suitable for non-automotive industrial applications. Halogen-free status not explicitly stated in provided data.
