EP2AGX45DF25I5G - Arria II GX 45K FPGA, 252 I/O, 572-FBGA | Intel
부품 번호: EP2AGX45DF25I5G ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $911.7 | $911.70 |
| 10 | $820.53 | $8,205.30 |
| 100 | $729.36 | $72,936.00 |
| 250 | $675.2 | $168,800.00 |
| 500 | $638.19 | $319,095.00 |
EP2AGX45DF25I5G 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory blocks, DSP slices, programmable interconnect, and a periphery of user I/O. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, and below ASICs in performance-per-watt but above them in flexibility and time-to-market. The Arria II GX family specifically integrates multi-gigabit transceivers and hard PCI Express blocks, positioning the device between pure logic fabrics (Cyclone) and high-end DSP/ transceiver families (Stratix).
Key features include dedicated 3.125 Gbps transceivers, embedded hard IP for PCI Express Gen1 (×1, ×4, ×8), 2.7 Mbits of on-chip memory, 156 embedded 18×18 multipliers, and a 500 MHz fabric performance. The -I5 speed/temperature grade delivers industrial temperature range support and a moderate speed bin suitable for cost-sensitive transceiver designs. The 0.9 V core supply supports enhanced low-power operation versus earlier 90/65 nm generations.
The architecture combines logic fabric, embedded memory, DSP blocks, and transceivers in a single die, with hard IP blocks for PCIe, memory controllers, and the CDR/PCS that back the multi-gigabit serial links. Designers use the Quartus II design suite (or later Quartus Prime) with the Arria II Device Handbook for implementation, timing closure, and transceiver configuration.
Typical applications include wireless baseband processing, broadcast and professional video equipment, radar and signal-intelligence front ends, high-speed serial protocol bridging (PCIe, Serial RapidIO, CPRI), and industrial imaging pipelines. The transceiver count and PCIe Gen1 hard IP make the part especially attractive for wireless remote radio heads and video capture cards.
When designing with the EP2AGX45DF25I5G, allocate adequate PCB layers for the FC-FBGA break-out, follow Intel's transceiver reference design for the 25 mm × 25 mm footprint, and validate signal-integrity for any SERDES link running above 1 Gbps. The -I5 grade is suitable for industrial-temperature deployments but is not automotive-grade; for automotive use, migrate to an AEC-Q100-qualified equivalent.
This page synthesizes distributor pricing, same-package drop-in alternatives, and application design notes that complement (and in places extend) the information found in the manufacturer datasheet and Arria II GX handbook.
드롭인 대체품: EP2AGX45DF25I5G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX45DF25I5G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Logic Elements, PCIe Hard IP.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX45DF25I5
✅ 드롭인✓ 재고 있음
$372 / 개
데이터시트 보기 →EP2AGX45DF25C5G
✅ 드롭인✓ 재고 있음
$118 / 개
데이터시트 보기 →EP2AGX45DF25I3G
✅ 드롭인✓ 재고 있음
$370 / 개
데이터시트 보기 →EP2AGX65DF25I5G
✅ 드롭인✓ 재고 있음
$378 / 개
데이터시트 보기 →EP2AGX125DF25I5G
✅ 드롭인✓ 재고 있음
$295 / 개
데이터시트 보기 →EP2AGX45DF25I5G 최대 정격 & 전기적 특성
| Family | Arria II GX |
| Logic Elements (LE) | 42,959 |
| User I/O Count | 252 |
| 패키지 | 572-FBGA (FC-FBGA, 25 mm × 25 mm, 1.0 mm pitch) |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Maximum Fabric Frequency | 500 MHz |
| Transceivers | Up to 3.125 Gbps |
| Embedded Memory | 2.7 Mbits |
| Embedded 18×18 Multipliers | 156 |
| PCIe Hard IP | PCI Express Gen1 (×1, ×4, ×8) |
| Speed Grade | I5 |
| 동작 온도 | -40 °C to +100 °C (industrial) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (Pb-free) |
EP2AGX45DF25I5G 572-fbga (fc-fbga, 25 mm × 25 mm, 1.0 mm pitch) 핀 구성 가이드
EP2AGX45DF25I5G(572-fbga (fc-fbga, 25 mm × 25 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX45DF25I5G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX45DF25I5G 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Broadcast and Professional Video Equipment, Radar and Signal-Intelligence Front Ends, PCIe Gen1 Endpoint and Bridge Cards, High-Speed Serial Protocol Bridging, Industrial Imaging and Machine Vision.
Wireless Baseband Processing
The EP2AGX45DF25I5G's 42,959 logic elements, 156 embedded 18×18 multipliers, and 2.7 Mbits of on-chip memory provide sufficient DSP fabric for LTE and WiMAX baseband channel cards, while the integrated multi-gigabit transceivers deliver CPRI/OBSAI links to remote radio heads at up to 3.125 Gbps. Placed on a baseband card with a 10-layer PCB and matched-impedance SERDES routing, the -I5 industrial temperature grade supports outdoor-mounted base stations. Unlike ASIC-based baseband solutions, the FPGA fabric enables late-binding protocol updates and multi-standard support.
추천
Broadcast and Professional Video Equipment
The 3.125 Gbps transceivers on EP2AGX45DF25I5G handle SDI, HDMI, and DisplayPort multi-lane serialization for broadcast video routers, format converters, and production switchers. The 252 user I/Os support multiple parallel video interfaces simultaneously, and the embedded memory buffers full-HD frames without external DDR in many configurations. The industrial temperature grade enables deployment in uncooled broadcast cabinets and outside-broadcast trucks where temperature swings are common.
추천
Radar and Signal-Intelligence Front Ends
The 156 embedded 18×18 multipliers deliver the DSP throughput needed for digital down-conversion, pulse compression, and beamforming in radar and SIGINT receivers. The transceivers digitize RF outputs directly from ADC devices at multi-gigabit sample rates, while the 42K-LE fabric implements FFT engines and adaptive filters. The industrial temperature grade supports ruggedized defense and avionics enclosures, and the 572-FBGA package enables dense PCB layouts for size-constrained platforms.
추천
PCIe Gen1 Endpoint and Bridge Cards
The EP2AGX45DF25I5G includes hard PCI Express Gen1 IP supporting ×1, ×4, and ×8 lane configurations, enabling direct PCIe endpoint implementations without external bridge chips. This is ideal for data acquisition cards, software-defined radio cards, and protocol bridge boards that interface to host CPUs through PCIe. The transceivers provide additional SERDES for SATA, Serial RapidIO, or custom serial links alongside the PCIe interface, eliminating multiple protocol bridge ASICs.
추천
High-Speed Serial Protocol Bridging
The multi-gigabit transceivers and PCIe Gen1 hard IP make EP2AGX45DF25I5G ideal for bridging between incompatible serial protocols, such as Serial RapidIO to PCIe, CPRI to Ethernet, or Aurora to custom backplanes. The 42K-LE fabric implements protocol adaptation logic, while the transceivers handle physical-layer serialization up to 3.125 Gbps per channel. Industrial temperature grade supports deployment in factory floors, outdoor cabinets, and industrial control systems.
추천
Industrial Imaging and Machine Vision
The EP2AGX45DF25I5G's high user I/O count (252) accepts multiple Camera Link, CoaXPress, or LVDS camera inputs simultaneously, while the transceivers support CoaXPress and 10 GigE Vision over a single cable. The embedded memory buffers raw Bayer frames before compression, and the DSP multipliers accelerate JPEG, H.264, or custom image-processing pipelines. The industrial temperature grade and surface-mount FC-BGA package suit factory-floor vision systems with continuous operation.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX45DF25I5G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX45DF25I5 | EP2AGX45DF25C5G | EP2AGX45DF25I3G | EP2AGX65DF25I5G | EP2AGX125DF25I5G |
|---|---|---|---|---|---|---|
| Package | 572-FBGA (DF25, 25x25 mm, 1.0 mm pitch) | 572-FBGA (DF25, 25x25 mm) - same | 572-FBGA (DF25, 25x25 mm) - same | 572-FBGA (DF25, 25x25 mm) - same | 572-FBGA (DF25, 25x25 mm) - same | 572-FBGA (DF25, 25x25 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 | ~56,400 (+31%) | ~118,500 (+176%) |
| User I/Os | 252 | 252 | 252 | 252 | 252 | 252 |
| Speed Grade | I5 (industrial, -40 to +100 °C) | I5 (industrial) | C5 (commercial, 0 to +85 °C) | I3 (slower industrial) | I5 (industrial) | I5 (industrial) |
| Transceivers | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps (more channels) |
| Embedded Memory | 2.7 Mbits | 2.7 Mbits | 2.7 Mbits | 2.7 Mbits | ~4.0 Mbits | ~8.0 Mbits |
| Embedded 18×18 Multipliers | 156 | 156 | 156 | 156 | ~264 | ~488 |
| Pb-free / RoHS | Yes (G suffix) | No (leaded) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) |
주요 차별점
- Industrial temperature grade with -I5 speed bin in 572-FBGA package (vs EP2AGX45DF25C5G)
- Pin-compatible with higher-density EP2AGX65 and EP2AGX125 variants (vs EP2AGX65DF25I5G)
- Pb-free / RoHS compliant packaging with G suffix (vs EP2AGX45DF25I5)
설계 노트
Estimated: The 572-ball FC-BGA at 1.0 mm pitch requires a high-density PCB stack-up - use at least 10 layers with microvia (laser-drilled) technology for breakout. Per Intel's Arria II GX Handbook, route all transceiver differential pairs on the top layers with matched impedance (100 Ω differential for 3.125 Gbps), and keep total SERDES trace length under 100 mm to maintain signal-integrity margin. Use a continuous ground plane under the BGA balls and stitch ground vias around the periphery.
Estimated: At maximum fabric utilization with 3.125 Gbps transceivers active, the EP2AGX45DF25I5G core power draw typically reaches 5-8 W. Provide separate 0.9 V core, 1.2 V transceiver, 2.5 V auxiliary, and 3.3 V I/O rails with high-frequency decoupling (10 nF + 100 nF + 10 µF combinations) placed as close as possible to each supply ball. Use at least 4 decoupling capacitors per supply pin group per Intel's pin connection guidelines.
Do not assume any I/O bank can operate at any voltage - the Arria II GX has separate banks for LVDS, LVCMOS, and SERDES with strict VCCIO compatibility. Verify pin assignments with the Quartus pin planner before layout. Also note that the -I5 industrial temperature grade is NOT automotive-qualified; do not deploy in automotive applications without an AEC-Q100-qualified variant.
Estimated: At 7 W total power dissipation, the FC-BGA package requires thermal management. With theta_JA typically around 12-15 °C/W for the 25×25 mm FC-BGA, junction temperature rises approximately 84-105 °C above ambient without forced airflow. Implement a heatsink or thermal pad with at least 2 cfm airflow for industrial-temperature deployments where ambient may reach +85 °C.
For 3.125 Gbps SERDES channels, follow Intel's transceiver layout guidelines strictly: maintain 100 Ω differential impedance, length-match P/N within 0.5 mm, keep AC-coupling capacitors close to the transmitter side, and provide a continuous reference ground plane. Series-of-emphasis and pre-emphasis settings should be tuned per channel using the Transceiver Toolkit in Quartus II.
규정 준수 정보
RoHS compliance indicated by 'G' suffix in MPN. Not AEC-Q100 qualified; the -I5 industrial grade is suitable for non-automotive industrial applications. Halogen-free status not explicitly stated in provided data.
