EP2AGX65DF29C4G - Arria II GX FPGA 65K LE FCBGA-780 | Intel
料号： EP2AGX65DF29C4G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $252 | $25,200.00 |
| 500 | $235.5 | $117,750.00 |
| 1,000 | $219 | $219,000.00 |
EP2AGX65DF29C4G 概述
An FPGA (Field-Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs), embedded block RAM, DSP slices, and programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which include CPLDs and SPLDs. Arria II GX specifically targets mid-range applications needing transceivers, DSP blocks, and a balance of logic, memory, and I/O bandwidth without the power cost of Stratix-class devices.
Key features of the EP2AGX65DF29C4G include 4.8125 Kbits of M9K block RAM (effectively 536 blocks of M9K + M-RAM equivalents totaling the 5,371,904-bit figure), up to 16 global clock trees plus 96 peripheral PLLs, hard PCIe Gen1/Gen2 IP blocks, and dedicated 6.5536 Gbps-capable transceivers. The 0.9 V core voltage with adaptive voltage scaling reduces dynamic power, while the -4 speed grade places it in the mid-speed tier within the Arria II GX family. The 29 mm flip-chip BGA package supports high-density board designs but requires careful PCB stack-up planning.
Typical applications include wireless infrastructure baseband cards, broadcast video processing, military radar signal chains, and PCIe-based industrial control cards. The integrated transceivers and PCIe hard IP eliminate external SERDES for many designs, while the abundant block memory suits packet buffering and FFT scratchpad storage.
Designers should plan thermal dissipation carefully - the flip-chip BGA package couples heat directly into the PCB, so a multi-layer PCB with inner copper ground/thermal planes is recommended. The Quartus II software suite (16.1 and earlier; later Quartus Prime in compatibility mode) is the supported toolchain.
直接替换替代料： EP2AGX65DF29C4G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2AGX65DF29C4G （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, Mounting Type, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
EP2AGX45DF29C4G
✅ 直接替换✓ 有现货
$430 / 个
查看数据手册 →EP2AGX65DF29C3N
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →EP2AGX65CU17C4G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$285 / 个
查看数据手册 →EP2AGX95DF29C4G
✅ 直接替换📋 参考替代料（不在目录中）
EP2AGX125EF29C6N
✅ 直接替换📋 参考替代料（不在目录中）
EP2AGX65DF29C4G 最大额定值与电气特性
| Family | Arria II GX |
| Logic Elements | 60,214 |
| Adaptive Logic Modules (ALMs) | 30,107 |
| Embedded Memory | 5,371,904 bits |
| Number of LABs/CLBs | 2,530 |
| User I/O Count | 364 |
| Number of Transceivers | 8 |
| Transceiver Data Rate | up to 3.75 Gbps (6.5536 Gbps with -4 grade using CPRI mode) |
| Core Voltage | 0.9 V |
| Operating Frequency | 500 MHz |
| 工作温度 | 0C to +85C (commercial) |
| Speed Grade | -4 (mid-speed) |
| 封装 | 780-BBGA, FCBGA (29 mm) |
| Process Node | 40 nm (Arria II generation) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Lead Free | Yes |
| MSL 等级 | 3 (per JEDEC J-STD-020) |
EP2AGX65DF29C4G 780-bbga, fcbga (29 mm) 引脚配置指南
EP2AGX65DF29C4G（780-bbga, fcbga (29 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2AGX65DF29C4G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2AGX65DF29C4G 适用于 6 应用s: Wireless Baseband Processing, Broadcast Video Processing, Industrial PCIe Control Cards, Military Radar Signal Chains, Medical Imaging Systems, Test & Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX65DF29C4G's 60,214 logic elements and 8 transceivers at 3.75 Gbps make it well-suited for LTE and WiMAX baseband cards. The 5,371,904 bits of embedded memory provides ample packet buffering for HARQ and MIMO processing, while the hard PCIe Gen1/Gen2 IP block enables clean interface to baseband SoCs over standard backplanes.
推荐
Broadcast Video Processing
With 364 user I/Os and abundant block RAM, the EP2AGX65DF29C4G handles multi-channel SDI video routing, format conversion, and color space conversion. The 0.9 V core voltage and adaptive voltage scaling reduce heat in dense video chassis, while the 3.75 Gbps transceivers support SD-SDI, HD-SDI, and 3G-SDI without external SERDES chips on most designs.
推荐
Industrial PCIe Control Cards
The hard PCIe Gen1/Gen2 IP block inside the EP2AGX65DF29C4G eliminates the need for external bridge chips, reducing BOM cost and latency for industrial PCIe cards. Combined with 364 user I/Os and 5 Mbits of block RAM, the device is well-matched to motor control, factory automation, and high-speed data acquisition card designs.
推荐
Military Radar Signal Chains
The 8 integrated transceivers and 60,214 LEs enable phased-array radar digital receiver designs where multiple ADC channels feed DSP processing on the FPGA. The 5 Mbit embedded memory supports FFT scratchpad storage, while the 780-ball FCBGA provides robust thermal performance for ruggedized military enclosures with conduction cooling.
推荐
Medical Imaging Systems
Ultrasound and digital X-ray front-ends leverage the EP2AGX65DF29C4G's parallel I/O bandwidth and block RAM for real-time beamforming and image reconstruction. The mid-range logic capacity suits 32-128 channel ultrasound carts, while the integrated transceivers simplify connection to back-end image processing servers over gigabit serial links.
推荐
Test & Measurement Instrumentation
The combination of 364 user I/Os, 8 high-speed transceivers, and 60,214 LEs makes the EP2AGX65DF29C4G ideal for protocol analyzers, BERT testers, and high-speed logic analyzers. Engineers can implement multi-standard protocol decoding in the FPGA fabric while using dedicated transceivers for 10GbE, USB 3.0, or PCIe Gen2 compliance test points.
推荐
推荐产品汇总
工程参考数据： EP2AGX65DF29C4G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2AGX45DF29C4G | EP2AGX65DF29C3N | EP2AGX95DF29C4G | EP2AGX125EF29C6N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BBGA, FCBGA (29 mm) | 780-BBGA, FCBGA (29 mm) - same | 780-BBGA, FCBGA (29 mm) - same | 780-BBGA, FCBGA (29 mm) - same | 780-BBGA, FCBGA (29 mm) - same |
| Logic Elements | 60,214 | 41,910 (-30%) | 60,214 (same) | ~95,000 (+58%) | 124,600 (+107%) |
| Embedded Memory | 5,371,904 bits | 2,457,600 bits (-54%) | 5,371,904 bits (same) | ~7 Mbits | 8,121,216 bits |
| User I/Os | 364 | 364 | 364 | 364 | 372 |
| Transceivers | 8 (up to 3.75 Gbps) | 8 | 8 | 12 | 12 |
| Speed Grade | -4 | -4 | -3 (slower) | -4 | -6 (faster) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
关键差异点
- Balanced mid-range density with full transceiver support （对比 EP2AGX45DF29C4G)
- Speed grade -4 balances Fmax and cost （对比 EP2AGX125EF29C6N)
- Integrated 3.75 Gbps transceivers eliminate external SERDES （对比 Cyclone IV E FPGAs)
设计说明
Estimated: At full utilization of 60,214 LEs at 500 MHz with 0.9 V core, the EP2AGX65DF29C4G can consume 5-8 W dynamic power. The 780-ball flip-chip BGA couples heat directly into the PCB - design a 6+ layer PCB with a dedicated inner ground/thermal plane and at least 50 thermal vias under the die for adequate dissipation. Without thermal planning, junction temperatures can exceed the 125C maximum under industrial workloads.
The 29 mm FCBGA package uses a 1.0 mm ball pitch - requires laser-drilled or precision mechanical-drilled microvias for breakout. Use a 1-2-1 or 1-2-2-1 PCB stack-up with low-loss dielectric (Df < 0.005 at 1 GHz) for transceiver signal integrity. Decoupling: place 0.1 uF and 0.01 uF X7R capacitors on every VCCINT/VCCA ball group within 5 mm trace length to suppress switching transients.
Do not confuse the EP2AGX65DF29C4G (Arria II GX, 65K LEs, 8 transceivers) with the EP2AGX65CU17C4G (different die variant with different transceiver count and I/O mix in a similar package). Bitstreams are NOT portable between Arria II GX SKUs of different densities even at the same package footprint - always recompile in Quartus for the target device. Also note: the G suffix indicates Pb-free/RoHS packaging; non-G variants may not be RoHS compliant.
合规信息
RoHS compliance per Altera/Intel product page. Pb-free FCBGA packaging (G suffix). Not AEC-Q100 qualified - choose newer automotive-grade devices for automotive applications.