EP2AGX65DF29C4G - Arria II GX FPGA 65K LE FCBGA-780 | Intel
부품 번호: EP2AGX65DF29C4G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $252 | $25,200.00 |
| 500 | $235.5 | $117,750.00 |
| 1,000 | $219 | $219,000.00 |
EP2AGX65DF29C4G 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs), embedded block RAM, DSP slices, and programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which include CPLDs and SPLDs. Arria II GX specifically targets mid-range applications needing transceivers, DSP blocks, and a balance of logic, memory, and I/O bandwidth without the power cost of Stratix-class devices.
Key features of the EP2AGX65DF29C4G include 4.8125 Kbits of M9K block RAM (effectively 536 blocks of M9K + M-RAM equivalents totaling the 5,371,904-bit figure), up to 16 global clock trees plus 96 peripheral PLLs, hard PCIe Gen1/Gen2 IP blocks, and dedicated 6.5536 Gbps-capable transceivers. The 0.9 V core voltage with adaptive voltage scaling reduces dynamic power, while the -4 speed grade places it in the mid-speed tier within the Arria II GX family. The 29 mm flip-chip BGA package supports high-density board designs but requires careful PCB stack-up planning.
Typical applications include wireless infrastructure baseband cards, broadcast video processing, military radar signal chains, and PCIe-based industrial control cards. The integrated transceivers and PCIe hard IP eliminate external SERDES for many designs, while the abundant block memory suits packet buffering and FFT scratchpad storage.
Designers should plan thermal dissipation carefully - the flip-chip BGA package couples heat directly into the PCB, so a multi-layer PCB with inner copper ground/thermal planes is recommended. The Quartus II software suite (16.1 and earlier; later Quartus Prime in compatibility mode) is the supported toolchain.
드롭인 대체품: EP2AGX65DF29C4G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX65DF29C4G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Mounting Type, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX45DF29C4G
✅ 드롭인✓ 재고 있음
$430 / 개
데이터시트 보기 →EP2AGX65DF29C3N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2AGX65CU17C4G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$285 / 개
데이터시트 보기 →EP2AGX95DF29C4G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2AGX125EF29C6N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2AGX65DF29C4G 최대 정격 & 전기적 특성
| Family | Arria II GX |
| Logic Elements | 60,214 |
| Adaptive Logic Modules (ALMs) | 30,107 |
| Embedded Memory | 5,371,904 bits |
| Number of LABs/CLBs | 2,530 |
| User I/O Count | 364 |
| Number of Transceivers | 8 |
| Transceiver Data Rate | up to 3.75 Gbps (6.5536 Gbps with -4 grade using CPRI mode) |
| Core Voltage | 0.9 V |
| Operating Frequency | 500 MHz |
| 동작 온도 | 0C to +85C (commercial) |
| Speed Grade | -4 (mid-speed) |
| 패키지 | 780-BBGA, FCBGA (29 mm) |
| Process Node | 40 nm (Arria II generation) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead Free | Yes |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
EP2AGX65DF29C4G 780-bbga, fcbga (29 mm) 핀 구성 가이드
EP2AGX65DF29C4G(780-bbga, fcbga (29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX65DF29C4G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX65DF29C4G 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Broadcast Video Processing, Industrial PCIe Control Cards, Military Radar Signal Chains, Medical Imaging Systems, Test & Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX65DF29C4G's 60,214 logic elements and 8 transceivers at 3.75 Gbps make it well-suited for LTE and WiMAX baseband cards. The 5,371,904 bits of embedded memory provides ample packet buffering for HARQ and MIMO processing, while the hard PCIe Gen1/Gen2 IP block enables clean interface to baseband SoCs over standard backplanes.
추천
Broadcast Video Processing
With 364 user I/Os and abundant block RAM, the EP2AGX65DF29C4G handles multi-channel SDI video routing, format conversion, and color space conversion. The 0.9 V core voltage and adaptive voltage scaling reduce heat in dense video chassis, while the 3.75 Gbps transceivers support SD-SDI, HD-SDI, and 3G-SDI without external SERDES chips on most designs.
추천
Industrial PCIe Control Cards
The hard PCIe Gen1/Gen2 IP block inside the EP2AGX65DF29C4G eliminates the need for external bridge chips, reducing BOM cost and latency for industrial PCIe cards. Combined with 364 user I/Os and 5 Mbits of block RAM, the device is well-matched to motor control, factory automation, and high-speed data acquisition card designs.
추천
Military Radar Signal Chains
The 8 integrated transceivers and 60,214 LEs enable phased-array radar digital receiver designs where multiple ADC channels feed DSP processing on the FPGA. The 5 Mbit embedded memory supports FFT scratchpad storage, while the 780-ball FCBGA provides robust thermal performance for ruggedized military enclosures with conduction cooling.
추천
Medical Imaging Systems
Ultrasound and digital X-ray front-ends leverage the EP2AGX65DF29C4G's parallel I/O bandwidth and block RAM for real-time beamforming and image reconstruction. The mid-range logic capacity suits 32-128 channel ultrasound carts, while the integrated transceivers simplify connection to back-end image processing servers over gigabit serial links.
추천
Test & Measurement Instrumentation
The combination of 364 user I/Os, 8 high-speed transceivers, and 60,214 LEs makes the EP2AGX65DF29C4G ideal for protocol analyzers, BERT testers, and high-speed logic analyzers. Engineers can implement multi-standard protocol decoding in the FPGA fabric while using dedicated transceivers for 10GbE, USB 3.0, or PCIe Gen2 compliance test points.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX65DF29C4G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX45DF29C4G | EP2AGX65DF29C3N | EP2AGX95DF29C4G | EP2AGX125EF29C6N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BBGA, FCBGA (29 mm) | 780-BBGA, FCBGA (29 mm) - same | 780-BBGA, FCBGA (29 mm) - same | 780-BBGA, FCBGA (29 mm) - same | 780-BBGA, FCBGA (29 mm) - same |
| Logic Elements | 60,214 | 41,910 (-30%) | 60,214 (same) | ~95,000 (+58%) | 124,600 (+107%) |
| Embedded Memory | 5,371,904 bits | 2,457,600 bits (-54%) | 5,371,904 bits (same) | ~7 Mbits | 8,121,216 bits |
| User I/Os | 364 | 364 | 364 | 364 | 372 |
| Transceivers | 8 (up to 3.75 Gbps) | 8 | 8 | 12 | 12 |
| Speed Grade | -4 | -4 | -3 (slower) | -4 | -6 (faster) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
주요 차별점
- Balanced mid-range density with full transceiver support (vs EP2AGX45DF29C4G)
- Speed grade -4 balances Fmax and cost (vs EP2AGX125EF29C6N)
- Integrated 3.75 Gbps transceivers eliminate external SERDES (vs Cyclone IV E FPGAs)
설계 노트
Estimated: At full utilization of 60,214 LEs at 500 MHz with 0.9 V core, the EP2AGX65DF29C4G can consume 5-8 W dynamic power. The 780-ball flip-chip BGA couples heat directly into the PCB - design a 6+ layer PCB with a dedicated inner ground/thermal plane and at least 50 thermal vias under the die for adequate dissipation. Without thermal planning, junction temperatures can exceed the 125C maximum under industrial workloads.
The 29 mm FCBGA package uses a 1.0 mm ball pitch - requires laser-drilled or precision mechanical-drilled microvias for breakout. Use a 1-2-1 or 1-2-2-1 PCB stack-up with low-loss dielectric (Df < 0.005 at 1 GHz) for transceiver signal integrity. Decoupling: place 0.1 uF and 0.01 uF X7R capacitors on every VCCINT/VCCA ball group within 5 mm trace length to suppress switching transients.
Do not confuse the EP2AGX65DF29C4G (Arria II GX, 65K LEs, 8 transceivers) with the EP2AGX65CU17C4G (different die variant with different transceiver count and I/O mix in a similar package). Bitstreams are NOT portable between Arria II GX SKUs of different densities even at the same package footprint - always recompile in Quartus for the target device. Also note: the G suffix indicates Pb-free/RoHS packaging; non-G variants may not be RoHS compliant.
규정 준수 정보
RoHS compliance per Altera/Intel product page. Pb-free FCBGA packaging (G suffix). Not AEC-Q100 qualified - choose newer automotive-grade devices for automotive applications.