EP2AGZ350FF35I4N - 350K LE Arria II GZ FPGA, 1152-BGA | Intel
料号： EP2AGZ350FF35I4N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2450 | $245,000.00 |
| 500 | $2200 | $1,100,000.00 |
| 1,000 | $1995 | $1,995,000.00 |
EP2AGZ350FF35I4N 概述
An FPGA (Field-Programmable Gate Array) is a reconfigurable logic device containing programmable logic blocks, interconnect, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and fixed-function ASICs, offering hardware-level parallelism with the flexibility of post-silicon reconfiguration. The Arria II GZ family specifically targets transceiver-rich applications with up to 16 embedded transceivers per device and is fabricated at a 0.9V core voltage for power efficiency at high toggle rates.
Key features include 13,940 Logic Array Blocks (LABs), embedded 18x18 multipliers for DSP, dedicated memory interface circuitry supporting DDR3, and up to 16 high-speed transceivers operating up to 6.375 Gbps. The I4 speed grade and industrial temperature rating (-40C to +100C die junction) make this part suitable for harsh-environment embedded applications. The FC-FBGA-1152 package is a 35 mm x 35 mm flip-chip BGA optimized for high signal-integrity performance on multi-layer PCBs.
Architecturally, the Arria II GZ uses a logic-rich fabric paired with 8-input adaptive logic modules (ALMs), enabling efficient implementation of wide functions, register-rich pipelines, and arithmetic-intensive datapaths. Hard IP blocks for PCIe Gen2, memory controllers, and multi-gigabit transceivers offload common I/O functions from soft logic, freeing fabric resources for application logic. The 40nm process provides a favorable balance of static power, dynamic performance, and cost per logic element.
Typical applications include high-performance DSP for radar and medical imaging, 40G/100G wireline data path processing, broadcast video infrastructure, ASIC prototyping, and high-throughput data acquisition. The combination of 21 Mbits of embedded memory and 720 embedded multipliers (18x18) supports large FFTs, channelizers, and baseband processing blocks.
When designing with the EP2AGZ350FF35I4N, ensure the PCB uses a 1.0 mm BGA pitch and matched-impedance routing for transceiver lanes. The Quartus II design software (13.1 or later) is required for synthesis, place-and-route, and timing closure. Thermal management must consider a 35 x 35 mm BGA footprint with the exposed-die flip-chip construction.
This page synthesizes distributor pricing, drop-in package-matched alternatives, and practical board-design notes not found in the manufacturer datasheet, supporting both component selection and supply-chain decisions.
直接替换替代料： EP2AGZ350FF35I4N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2AGZ350FF35I4N （相同外形与封装尺寸） ——差异在于 Package, RoHS Status, Mounting Type, Logic Elements, Speed Grade.
快速对比工具——选择替代料号进行并排对比：
EP2AGZ350FF35I4G
✅ 直接替换✓ 有现货
$5824.66 / 个
查看数据手册 →EP2AGZ350FF35I3N
✅ 直接替换✓ 有现货
$3598.1 / 个
查看数据手册 →EP2AGZ350FF35C4N
✅ 直接替换✓ 有现货
$2150 / 个
查看数据手册 →EP2AGZ350FF35C3N
✅ 直接替换✓ 有现货
$2250 / 个
查看数据手册 →EP2AGZ300FF35I4N
✅ 直接替换✓ 有现货
$1925 / 个
查看数据手册 →EP2AGZ350FF35I3G
✅ 直接替换✓ 有现货
$1850 / 个
查看数据手册 →EP2AGZ350FF35I4N 最大额定值与电气特性
| Family | Arria II GZ |
| Logic Elements (LE) | 348,500 |
| Embedded Memory | 21,270,528 bits (21.27 Mbit) |
| Logic Array Blocks (LABs) | 13,940 |
| User I/O Pins | 554 |
| Maximum User I/O | 554 |
| 封装 | 1152-ball FC-FBGA (35 mm x 35 mm) |
| Process Technology | 40 nm CMOS |
| Core Voltage | 0.9 V |
| Speed Grade | I4 (industrial) |
| 工作温度 | -40C to +100C (industrial) |
| Embedded 18x18 Multipliers | 720 |
| Transceivers | Up to 16 high-speed transceivers (per family) |
| Maximum Transceiver Data Rate | 6.375 Gbps |
| RoHS 状态 | Compliant (LEAD FREE per datasheet) |
| 安装类型 | Surface Mount (BGA) |
EP2AGZ350FF35I4N 1152-ball fc-fbga (35 mm x 35 mm) 引脚配置指南
EP2AGZ350FF35I4N（1152-ball fc-fbga (35 mm x 35 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2AGZ350FF35I4N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2AGZ350FF35I4N 适用于 6 应用s: High-Performance DSP for Radar and Medical Imaging, 40G/100G Wireline Data Path Processing, ASIC Prototyping and Emulation, Broadcast Video Infrastructure, High-Throughput Data Acquisition Systems, Military and Aerospace Signal Processing.
High-Performance DSP for Radar and Medical Imaging
The EP2AGZ350FF35I4N is well-matched to radar signal processing and medical imaging systems because its 720 embedded 18x18 multipliers and 21.27 Mbit of block memory support large-scale FFTs, pulse compression, and beamforming. The Arria II GZ fabric delivers the Fmax needed for cascaded FIR filters and channelizers while the 6.375 Gbps transceivers carry digitized RF data to/from ADCs and DACs. The industrial temperature range (-40C to +100C) supports field-deployed radar and outdoor imaging systems. Compared with smaller FPGAs, the Z350's 348,500 logic elements let engineers implement multi-channel beamformers on a single chip rather than partitioning across multiple devices, reducing board area and BOM cost.
推荐
40G/100G Wireline Data Path Processing
The EP2AGZ350FF35I4N's 16 multi-gigabit transceivers at 6.375 Gbps aggregate up to 102 Gbps of serial bandwidth, making the part suitable for 40G/100G Ethernet framer, OTN mapper, and packet-processor designs. The 348,500 logic elements host classification, policing, and queuing pipelines, while the 21.27 Mbit of embedded memory stores packet headers and lookup tables. The FF35 1152-ball BGA provides the signal integrity and ground-bounce immunity required for 10+ Gbps channels. Designers pair the Z350 with external OTN framer PHYs and use the FPGA's hard PCIe Gen2 IP for CPU connectivity in line-card applications.
推荐
ASIC Prototyping and Emulation
The EP2AGZ350FF35I4N is a popular vehicle for ASIC prototyping because its 348,500 logic elements can map ASICs in the 5M-15M gate range when paired with multi-FPGA partitioning tools. The 21.27 Mbit of embedded memory serves as cache and register file substitutes for soft ASIC blocks, and the 554 user I/O pins expose enough package pins to break out complex ASIC interfaces. The Quartus II software supports incremental compilation and LogicLock regions, both of which are critical to prototype debug productivity. Multiple Z350 boards can be ganged to prototype larger ASICs, with the FF35 35 x 35 mm BGA simplifying daughtercard layout.
推荐
Broadcast Video Infrastructure
The EP2AGZ350FF35I4N supports broadcast video processing pipelines including SD/HD/3G-SDI multiplexing, video format conversion, and frame-buffer management. The 6.375 Gbps transceivers accept SDI, HDMI, and DisplayPort sources, while the abundant 21.27 Mbit of memory buffers multiple video frames at full HD resolution. The 720 embedded 18x18 multipliers accelerate color-space conversion, scaling, and motion-adaptive deinterlacing. The industrial temperature grade makes the Z350 a fit for outdoor broadcast equipment and mobile production units. The FF35 BGA footprint is compatible with high-speed video PHY companion chips.
推荐
High-Throughput Data Acquisition Systems
The EP2AGZ350FF35I4N fits high-channel-count data acquisition systems in scientific instrumentation, sonar, and high-energy physics. The 554 user I/O pins accept parallel LVDS data from many simultaneous ADC channels, and the 720 multipliers perform real-time digital down-conversion (DDC) and channelization. The 21.27 Mbit of memory stores pre-trigger capture buffers, while the 6.375 Gbps transceivers stream post-processed data to host servers via PCIe Gen2 or serial RapidIO. The industrial temperature range supports deployment in outdoor instrumentation enclosures. Compared with smaller FPGAs, the Z350 reduces multi-device synchronization complexity by hosting all channels on one fabric.
推荐
Military and Aerospace Signal Processing
The EP2AGZ350FF35I4N's industrial temperature range (-40C to +100C) and high logic density make it a candidate for military and aerospace signal processing subsystems including electronic warfare (EW), software-defined radio (SDR), and satellite communication payloads. The 720 embedded multipliers support digital channelization and pulse deinterleaving, while the 16 transceivers handle multi-band RF data ingest. The FF35 1152-ball BGA's mechanical robustness suits vibration-intensive airborne platforms. Designers typically pair the Z350 with companion ADCs/DACs and use the Quartus II incremental compilation flow for incremental DO-254/ED-80 certification artifacts.
推荐
推荐产品汇总
工程参考数据： EP2AGZ350FF35I4N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2AGZ350FF35I4G | EP2AGZ350FF35I3N | EP2AGZ350FF35C4N | EP2AGZ350FF35C3N | EP2AGZ300FF35I4N | EP2AGZ350FF35I3G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (35x35mm) | 1152-ball FC-FBGA (35x35mm) - same | 1152-ball FC-FBGA (35x35mm) - same | 1152-ball FC-FBGA (35x35mm) - same | 1152-ball FC-FBGA (35x35mm) - same | 1152-ball FC-FBGA (35x35mm) - same | 1152-ball FC-FBGA (35x35mm) - same |
| Logic Elements | 348,500 | 348,500 | 348,500 | 348,500 | 348,500 | 298,000 | 348,500 |
| Embedded Memory (bits) | 21,270,528 | 21,270,528 | 21,270,528 | 21,270,528 | 21,270,528 | ~17,800,000 | 21,270,528 |
| User I/O | 554 | 554 | 554 | 554 | 554 | 554 | 554 |
| Speed Grade | I4 (industrial) | I4 (industrial) | I3 (industrial) | C4 (commercial) | C3 (commercial) | I4 (industrial) | I3 (industrial) |
| Temperature Range | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Process / Core Voltage | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V |
关键差异点
- Highest-density Arria II GZ variant in the FF35 package （对比 EP2AGZ300FF35I4N)
- Faster I4 speed grade at industrial temperature （对比 EP2AGZ350FF35I3N)
- Industrial temperature with same package footprint （对比 EP2AGZ350FF35C4N)
设计说明
The EP2AGZ350FF35I4N uses a 1152-ball FC-FBGA at 1.0 mm ball pitch on a 35 x 35 mm body. PCB design must use microvia (HDI) stackup with 4-6 routing layers under the BGA, with matched-impedance 100-ohm differential routing for transceiver channels. Use Intel's Arria II GZ board design guidelines for via-in-pad, decoupling (100 nF + 10 uF per power pin), and length-matching tolerances.
The flip-chip BGA exposes the die to a heat spreader via the lid. Designers should attach a heatsink with thermal interface material (TIM) for high-utilization designs. The industrial temperature grade applies to the die junction (-40C to +100C); system-level airflow and heatsink sizing must keep junction temperature within the datasheet limit, otherwise timing degradation or device damage will result.
Common pitfalls include: (1) underestimating transceiver PCB routing losses - use IBIS-AMI simulation and follow Intel's transceiver layout guide; (2) ignoring configuration scheme selection - the Arria II GZ supports JTAG, Active Serial (AS), and Passive Serial (PS) with different bitstream sizes; (3) using the wrong Quartus II version - version 13.1 or later is required for the Arria II GZ device support; (4) not planning I/O bank voltage compatibility - the Z350 has multiple I/O banks that must each be powered to the correct voltage for the I/O standard used.
合规信息
LEAD FREE per Ampheo product page; RoHS and REACH compliant per Intel/Altera product declaration. AEC-Q100 not applicable - FPGAs are not qualified to AEC-Q100 automotive grade; use designated automotive-grade parts for AEC-Q100 applications.
