EP2AGX260FF35I5N - Arria II GX FPGA 244K LE, 612 IO | Intel
料号： EP2AGX260FF35I5N ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 50 | $1580 | $79,000.00 |
| 100 | $1450 | $145,000.00 |
| 250 | $1325 | $331,250.00 |
EP2AGX260FF35I5N 概述
A field-programmable gate array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnect, embedded memory, and hardened IP such as transceivers, DSP blocks, and PLLs. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs) in the design hierarchy: unlike microcontrollers they execute logic in parallel hardware, and unlike ASICs they can be reconfigured after fabrication. The Arria II GX family specifically targets designs requiring integrated transceivers, making it a popular mid-density solution for protocol bridging and high-speed serial I/O.
The EP2AGX260FF35I5N features 612 user I/Os, 8 integrated transceiver channels supporting data rates up to 6.375 Gbps, and 10260 Adaptive Logic Modules (ALMs) providing efficient 6-input LUT-based logic implementation. The 0.9 V core supply and industrial -40 C to +100 C operating range position this device for telecom, industrial imaging, and military/aerospace embedded applications where temperature tolerance is mandatory.
The device is built on a 40 nm process and supports 18x18 multipliers, 64-bit external memory interfaces (DDR3/QDRII+/RLDRAM II), and PCI Express Gen1/Gen2 hard IP blocks. The integrated transceivers support protocols including PCIe Gen1/2, Gigabit Ethernet, Serial RapidIO, and Common Public Radio Interface (CPRI), eliminating the need for external PHY devices in many designs.
Typical applications include wireless baseband processing, software-defined radio front-ends, high-speed serial protocol bridges, ASIC prototyping, and embedded military signal-processing platforms. The industrial temperature grade and 1152-ball FCBGA package make it suitable for ruggedized systems and 6U VPX backplane designs.
When designing with this FPGA, ensure proper power-rail sequencing and use the Quartus II design software (version 13.1 or earlier for legacy Arria II support) for synthesis, place-and-route, and timing closure. The FC-FBGA-1152 package requires a multilayer PCB stackup with controlled-impedance routing for transceiver channels.
This page synthesizes real-time distributor pricing, drop-in package-compatible alternatives drawn from the Arria II GX family, and design-in considerations not found in the standalone manufacturer datasheet.
直接替换替代料： EP2AGX260FF35I5N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2AGX260FF35I5N （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, Mounting Type, Transceivers.
快速对比工具——选择替代料号进行并排对比：
EP2AGX260FF35I5
✅ 直接替换✓ 有现货
$2400 / 个
查看数据手册 →EP2AGX260FF35I5G
✅ 直接替换✓ 有现货
$4700 / 个
查看数据手册 →EP2AGX260FF35I3N
✅ 直接替换✓ 有现货
$1390 / 个
查看数据手册 →EP2AGX260FF35C6N
✅ 直接替换✓ 有现货
$1320 / 个
查看数据手册 →EP2AGX260FF35C5N
✅ 直接替换✓ 有现货
$1545 / 个
查看数据手册 →EP2AGX260FF35C4N
✅ 直接替换✓ 有现货
$3125 / 个
查看数据手册 →EP2AGX260FF35I3NAA
✅ 直接替换✓ 有现货
$305 / 个
查看数据手册 →EP2AGX260FF35I5N 最大额定值与电气特性
| Family | Arria II GX |
| Logic Elements | 244,188 |
| Embedded Memory (bits) | 12,038,144 |
| Adaptive Logic Modules (ALMs) | 10260 |
| User I/O Count | 612 |
| Transceiver Channels | 8 |
| Transceiver Max Data Rate | 6.375 Gbps |
| Core Voltage | 0.9 V |
| 工作温度 | -40C to +100C (Industrial) |
| 封装 | 1152-ball FC-FBGA |
| Process Technology | 40 nm |
| 安装类型 | Surface Mount (BGA) |
| MSL 等级 | 3 (168 hours) |
| RoHS 状态 | Compliant |
EP2AGX260FF35I5N 1152-ball fc-fbga 引脚配置指南
EP2AGX260FF35I5N（1152-ball fc-fbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2AGX260FF35I5N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2AGX260FF35I5N 适用于 7 应用s: Wireless Baseband Signal Processing, Software Defined Radio (SDR) Front-End, High-Speed Serial Protocol Bridge, ASIC Prototyping Platform, Industrial Imaging and Machine Vision, Avionics and Military Embedded Systems, Video Broadcast and Studio Infrastructure.
Wireless Baseband Signal Processing
The EP2AGX260FF35I5N is well-suited for wireless baseband processing where its 244,188 logic elements and 8 transceiver channels at 6.375 Gbps deliver the parallel DSP throughput needed for LTE and WCDMA physical-layer functions. The device's hardened DSP blocks accelerate FFT and channel-coding kernels used in multi-antenna processing, while the integrated transceivers handle the CPRI link to the radio unit. Designers place this FPGA between the digital front-end and the MAC/processor, leveraging its industrial temperature grade for outdoor base-station enclosures.
推荐
Software Defined Radio (SDR) Front-End
In SDR architectures the EP2AGX260FF35I5N acts as the wideband digital downconverter and channelizer, benefiting from its 8 transceivers feeding high-speed ADC/DAC interfaces and its abundant DSP blocks for sample-rate conversion. The 12 Mbit embedded SRAM provides buffer storage for cross-channel correlation, while the 0.9 V core keeps the FPGA within thermal budgets of conduction-cooled VPX enclosures. Combined with the industrial -40 C to +100 C range, this FPGA is a common choice for tactical and shipboard SDR platforms.
推荐
High-Speed Serial Protocol Bridge
The EP2AGX260FF35I5N bridges between PCIe Gen1/2, Serial RapidIO, Gigabit Ethernet, and SATA without external PHY devices, leveraging its 8 hardened transceiver channels. Designers use this FPGA as a fan-out switch for storage controllers, protocol-converting ASICs, or radar data recorders. The 1152-ball FC-FBGA footprint supports the high pin density required to bring all 8 transceivers and 612 user I/Os off-chip while maintaining signal-integrity margins for 6.375 Gbps signalling.
推荐
ASIC Prototyping Platform
For pre-silicon validation of mid-complexity ASICs, the EP2AGX260FF35I5N offers 244,188 logic elements, multi-protocol transceivers, and abundant GPIO in a single BGA package. Engineering teams partition their ASIC RTL across the FPGA's logic fabric and use the embedded memory as emulated SRAM/DRAM. The 40 nm process provides predictable timing closure for prototyping flows, and the industrial temperature range enables hardware-in-the-loop testing in automotive and avionics scenarios.
推荐
Industrial Imaging and Machine Vision
The EP2AGX260FF35I5N's 12 Mbit embedded SRAM and high logic density enable real-time processing of multi-gigapixel camera data in industrial inspection systems. Its 8 transceivers drive CoaXPress or 10 GigE Vision camera links while the user I/Os connect to illumination controls and GPIO for trigger synchronisation. The industrial -40 C to +100 C temperature grade supports factory-floor deployments where ambient temperatures vary widely across production lines.
推荐
Avionics and Military Embedded Systems
Ruggedized avionics and military signal-processing platforms leverage the EP2AGX260FF35I5N's industrial temperature grade, 40 nm low-power process, and integrated transceivers to reduce SWaP-C. The device supports VPX and VME form-factor cards with high-density BGA packages that survive shock and vibration profiles per MIL-STD-810. Conduction-cooled card designs pair this FPGA with DDR3 memory to deliver deterministic performance for radar, EW, and SIGINT applications.
推荐
Video Broadcast and Studio Infrastructure
Broadcast video routers and studio signal processors benefit from the EP2AGX260FF35I5N's 8 transceiver channels supporting SDI and HDMI-over-Serial-Interface protocols. The FPGA's logic capacity enables real-time up/down/cross-conversion, color-space conversion, and HDR processing for 4K UHD workflows. The 612 user I/Os provide headroom for multiple parallel video streams and external audio embedding, making this device a common choice in OB-van and master-control-room equipment.
推荐
推荐产品汇总
工程参考数据： EP2AGX260FF35I5N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2AGX260FF35I5 | EP2AGX260FF35I5G | EP2AGX260FF35I3N | EP2AGX260FF35C6N | EP2AGX260FF35C5N | EP2AGX260FF35C4N | EP2AGX260FF35I3NAA |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same |
| Logic Elements | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 |
| Transceiver Channels | 8 @ up to 6.375 Gbps | 8 @ 6.375 Gbps | 8 @ 6.375 Gbps | 8 @ lower grade | 8 @ 6.375 Gbps | 8 @ 5 Gbps | 8 @ 3.75 Gbps | 8 @ lower grade |
| Embedded Memory (bits) | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 | 12,038,144 |
| User I/O | 612 | 612 | 612 | 612 | 612 | 612 | 612 | 612 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial with AA screening |
| Speed Grade | I5 | I5 (same) | I5 (same) | I3 (slower) | C6 (faster) | C5 (faster) | C4 (slowest) | I3 with AA screening |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
关键差异点
- Same 244K LE silicon across drop-in variants with different speed/temperature grades （对比 EP2AGX260FF35I3N)
- Industrial temperature range for ruggedized deployments （对比 EP2AGX260FF35C6N)
- Drop-in compatibility with all FF35 suffix Arria II GX parts （对比 EP2AGX260EF29I5G)
- RoHS-compliant lead-free assembly indicated by N suffix （对比 EP2AGX260FF35I5)
设计说明
Estimated: At full utilization with all 8 transceivers active at 6.375 Gbps, the EP2AGX260FF35I5N can dissipate up to 20 W. The 1152-ball FC-FBGA package requires a heatsink with thermal interface material, and at least 1 square inch of 2 oz copper pour on inner PCB layers. Designers should follow the Arria II GX thermal management application note for junction temperature estimation and heatsink selection. Industrial applications must keep Tj below 100 C for reliability targets.
The 1152-ball FC-FBGA package requires a high-density multilayer PCB stackup with at least 8 layers for power distribution and signal escape. Transceiver channels must use controlled-impedance routing with 100 ohm differential pairs and matched lengths within the tolerances specified in the Arria II GX device handbook. Use of low-loss PCB material such as Megtron 6 or FR408HR is recommended for channels operating above 5 Gbps. DC-blocking capacitors and reference-clock routing also follow the device handbook guidelines.
The EP2AGX260FF35I5N requires multiple supply rails (0.9 V core, 1.1 V PLL, 1.5 V/2.5 V I/O, 1.2 V transceiver) with strict power-on sequence requirements per the Arria II GX handbook. Designers must implement power-rail sequencing controllers such as the LTC2923 to prevent latch-up. Decoupling capacitors should follow the recommended LC network with high-frequency ceramics placed directly under BGA balls. Inrush current at power-on can exceed 3 A; the regulator must support transient response accordingly.
Transceiver signals at 6.375 Gbps require 100 ohm differential impedance with matched lengths within 150 mil across each channel pair. The PCB stackup must use tightly coupled stripline or coplanar waveguide with reference plane continuity to maintain return paths. Pre-emphasis and equalization are configured in the Quartus II transceiver toolkit; SI simulation with the device IBIS-AMI models is recommended before tape-out. Use of crosstalk-aware routing keeps adjacent aggressor-net coupling below 1%.
Common pitfalls when designing with the EP2AGX260FF35I5N include omitting the recommended pull-down resistors on configuration pins, which can cause configuration failures at power-up. The configuration flash memory interface must use the recommended EPCS device and programming flow in Quartus II. JTAG chain design must include the recommended series resistors on TCK/TMS/TDO/TDI to prevent signal-integrity issues. Lastly, do not apply power without proper sequencing or the device may latch up permanently.
合规信息
RoHS-compliant assembly indicated by 'N' suffix per Intel Altera ordering information. AEC-Q100 not applicable for FPGA logic device. REACH and conflict-mineral declarations should be requested directly from Intel FPGA support.