EP2S15F484C3N - Stratix II FPGA 15K LEs 342 I/O 484FBGA | Intel
料号： EP2S15F484C3N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $224.63 | $224.63 |
| 10 | $215 | $2,150.00 |
| 50 | $195 | $9,750.00 |
| 100 | $180 | $18,000.00 |
| 500 | $155 | $77,500.00 |
EP2S15F484C3N 概述
A field programmable gate array (FPGA) is a semiconductor device whose logic fabric, interconnect, and I/O cells are configured after manufacture via a configuration bitstream, allowing the same silicon to implement almost any digital function from glue logic to fully featured processors. Within the broader taxonomy, the EP2S15 sits as an FPGA under programmable logic, which sits under digital logic ICs, which sit under integrated circuits. Stratix II was Intel's second-generation high-end FPGA, succeeding Stratix I with a refined 90 nm logic architecture and adaptive look-up tables (ALUTs) that improved performance per LE relative to its predecessor.
Key features include 15,600 logic elements, 419,328 RAM bits organized into TriMatrix memory blocks, dedicated DSP blocks for high-speed multiply-accumulate operations, up to 12 PLLs for clock management, and support for external memory interfaces including DDR, DDR2, SDRAM, QDR, and RLDRAM. The device exposes 342 user I/Os across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X signaling. Configurable logic capacity is complemented by 15600 equivalent LEs, an internal configuration scheme, JTAG boundary scan, and active serial/parallel configuration modes.
Typical applications include telecom line cards, high-speed serial protocol bridging (SPI 4.2, SFI, UTOPIA), DSP co-processing for radar and imaging, broadcast video processing, and PCI/PCI-X bus expansion. The combination of embedded multipliers and TriMatrix memory also suits software-defined radio front-end datapaths and ASIC prototyping.
When designing with the EP2S15F484C3N, pay attention to power integrity on the 484-ball BGA - the Stratix II datasheet recommends a multi-layer PCB with dedicated power and ground planes and at least six PCB layers for signal integrity at DDR2 rates. Decoupling must follow Intel's reference decoupling network. Configuration scheme selection (AS, PS, JTAG, or Fast Passive Parallel) must be planned early because it affects pin allocation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： EP2S15F484C3N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2S15F484C3N （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Family, Adaptive Logic Modules (ALMs), Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
EP2S15F484C3
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$118 / 个
查看数据手册 →EP2S15F484C5N
✅ 直接替换✓ 有现货
$144.8 / 个
查看数据手册 →EP2S15F484C4N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$185 / 个
查看数据手册 →EP2S15F484I4N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
联系询价
查看数据手册 →EP2S25F484C3N
✅ 直接替换📋 参考替代料（不在目录中）
EP2S15F484C3N 最大额定值与电气特性
| Family | Stratix II |
| Logic Elements | 15,600 |
| Embedded Memory (bits) | 419,328 |
| Embedded Memory (Kb) | 306 Kb |
| User I/O Pins | 342 |
| 封装 | 484-ball FBGA (FineLine BGA) |
| Speed Grade | C3 |
| 工作温度 | Commercial / industrial (per C3 ordering code) |
| Configuration Modes | Active Serial, Passive Serial, Fast Passive Parallel, JTAG |
| PLLs | Up to 12 |
| External Memory Support | DDR, DDR2, SDRAM, QDR, RLDRAM |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI/PCI-X |
| RoHS 状态 | Compliant (FBGA package) |
EP2S15F484C3N 484-ball fbga (fineline bga) 引脚配置指南
EP2S15F484C3N（484-ball fbga (fineline bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2S15F484C3N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2S15F484C3N 适用于 6 应用s: Telecom Line Card Processing, DSP Co-Processing for Radar and Imaging, Software-Defined Radio Front-End, Broadcast Video Processing, ASIC Prototyping and Emulation, Industrial Motor Control and Servo Drive.
Telecom Line Card Processing
The EP2S15F484C3N fits telecom line card datapaths because its 15,600 logic elements, dedicated DSP blocks, and 419 Kbits of TriMatrix memory handle UTOPIA/SPI-4.2 bridging plus per-channel framing without external co-processors. The 342 user I/Os in the 484-ball FBGA expose enough LVDS pairs for chip-to-chip interconnect to network processors and framer ASICs, while up to 12 PLLs synthesize the multiple clock domains typical of SONET/SDH or Ethernet backhaul designs. Its C3 speed grade comfortably meets the 155-622 MHz fabric clock envelope. Compared with ASIC alternatives, the EP2S15 shortens time-to-prototype and supports late-stage feature changes from the field.
推荐
DSP Co-Processing for Radar and Imaging
The EP2S15F484C3N is well suited as a DSP co-processor in radar baseband and medical imaging pipelines thanks to its dedicated hardware multiplier blocks and 419 Kbits of TriMatrix memory for sample buffering. The C3 speed grade sustains 200+ MHz FFT throughput when mapped onto the DSP blocks, while the 342 I/Os in the 484FBGA accept high-rate LVDS ADC/DAC data lanes. Designers route the host processor (DSP or PowerPC) into the FPGA via a parallel bus, and the FPGA handles filtering, windowing, and FFT pre-processing. The Stratix II fabric's adaptive LUTs improve logic density per multiplier, leaving headroom for control-plane state machines alongside the datapath.
推荐
Software-Defined Radio Front-End
In software-defined radio (SDR) front-ends, the EP2S15F484C3N's combination of 15,600 LEs, dedicated DSP blocks, and 342 LVDS-capable I/Os in the 484FBGA package lets engineers implement wideband digital down-conversion, channelization, and baseband processing in a single device. The 419 Kbits of TriMatrix memory holds FFT windows and coefficient tables without external SRAM, while up to 12 PLLs derive the multi-rate clocks needed for ADC sampling, decimation, and baseband DSP. Compared with a discrete DSP cluster, the FPGA solution consolidates the SDR baseband into one IC, reducing BOM and board area for tactical and commercial radio designs.
推荐
Broadcast Video Processing
The EP2S15F484C3N is used in broadcast video frame stores, format converters, and SDI cross-point switches. Its 15,600 logic elements handle real-time de-interlacing, scaling, and chroma keying at SD and HD rates, while the 419 Kbits of TriMatrix memory buffer multiple video lines in on-chip RAM to avoid external SRAM. The 342 user I/Os accept multiple SDI streams via deserializer ASICs and drive HDMI/DVI encoders, with the 484FBGA offering sufficient pin count for headroom on multi-channel boards. Its C3 speed grade meets 148.5 MHz HD-SDI pixel clock requirements, and the JTAG configuration simplifies field firmware updates.
推荐
ASIC Prototyping and Emulation
Engineers use the EP2S15F484C3N as a building block in multi-FPGA ASIC prototyping because it offers 15,600 logic elements (roughly equivalent to 300K ASIC gates) in a 484-ball FBGA that can be stacked across a prototyping board. Multiple EP2S15 devices are interconnected via LVDS pins to emulate large ASICs, while the 419 Kbits of TriMatrix memory per device holds register and FIFO states. The C3 commercial speed grade gives timing margins for pre-silicon validation at sub-100 MHz, and the JTAG configuration mode speeds up bitstream iteration during bring-up. Compared with ASIC emulation boxes, this approach is cost-effective for IP block validation.
推荐
Industrial Motor Control and Servo Drive
The EP2S15F484C3N fits industrial multi-axis servo drives where its 15,600 LEs implement field-oriented control (FOC) loops, encoder interfaces, and safety logic for several axes in one device. The 342 user I/Os in the 484FBGA accept quadrature encoder inputs from many motors and drive power-stage gate signals via isolated interfaces, while dedicated DSP blocks execute the Park/Clarke transforms at 20 kHz loop rates. The 419 Kbits of TriMatrix memory holds reference waveforms and PID state, and up to 12 PLLs generate the multiple PWM carrier frequencies. Industrial temperature variants (C3 with industrial test flow) make it acceptable for factory-floor deployment.
推荐
推荐产品汇总
工程参考数据： EP2S15F484C3N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2S15F484C3 | EP2S15F484C5N | EP2S15F484C4N | EP2S15F484I4N | EP2S25F484C3N |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (FineLine BGA) | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 15,600 | 15,600 | 15,600 | 15,600 | 15,600 | 25,000 (+60%) |
| User I/Os | 342 | 342 | 342 | 342 | 342 | 342 |
| Speed Grade | C3 | C3 | C5 (slower) | C4 | C4 | C3 |
| Temperature Grade | Commercial (per C3 ordering code) | Commercial | Commercial | Commercial | Industrial | Commercial |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
关键差异点
- Mid-density sweet spot of Stratix II family （对比 EP2S25F484C3N)
- Faster speed grade than C5 alternative （对比 EP2S15F484C5N)
- Industrial-temperature option with same die （对比 EP2S15F484I4N)
设计说明
The 484-ball FBGA package demands a multi-layer PCB with dedicated power and ground planes. Intel's Stratix II hardware reference design recommends at least six PCB layers (signal, GND, VCC, signal, GND, signal) to maintain DDR2 signal integrity. Estimated: with 0.8 mm ball pitch, use 0.4 mm via-in-pad microvias on top layers and 8 mil traces between balls to route 4-6 signals out of the BGA escape region.
Estimate: at 100 MHz fabric clock and typical utilization, the EP2S15F484C3N draws roughly 1.5-2.5 W core plus I/O power. Use Intel's PowerPlay early power estimator in Quartus II before tape-out, and provision a switching regulator with at least 25% margin. Decoupling follows the Stratix II reference decoupling network: bulk capacitors on each VCC pin group plus 0.1 uF and 0.01 uF ceramics at every quad of VCC pins.
Configuration mode (MSEL pins) must be set before power-up and is not hot-swappable. Designers frequently overlook that the Fast Passive Parallel mode requires a parallel flash and additional address/data pins; plan these out before committing the PCB. Also, the JTAG TCK pin requires a 1 kohm pull-down or pull-up per the Stratix II handbook to avoid floating configuration at power-up.
合规信息
RoHS-compliant per Altera/Intel datasheet declaration. Halogen-free status not specified in the verified web data. AEC-Q100 not applicable (FPGA). Part is in NRND status per distributor listings as of 2026-09-09.