EP2SGX60EFI1152 vs EP2SGX60EF1152I3N 对比

详细并排对比 EP2SGX60EFI1152 出自 Intel 和 EP2SGX60EF1152I3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP2SGX60EFI1152 EP2SGX60EFI1152 - Stratix II GX FPGA | Intel

EP2SGX60EFI1152 - Stratix II GX FPGA | Intel

EP2SGX60EFI1152 Obsolete

规格对比

参数 EP2SGX60EFI1152 EP2SGX60EF1152I3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete Obsolete
库存状态 有库存 有库存
单价(USD) $0.00 $1,195.00
Manufacturer Intel —
Product Type Field Programmable Gate Array (FPGA) —
Family Stratix II GX Stratix II GX
Configuration Type Enhanced Configuration (EPC) device —
Logic Elements 60,440 —
Configuration-related Memory 2,544,192 bits —
User I/O 534 —
LAB Count 3,022 LABs —
封装 1,152-ball FineLine BGA —
安装类型 Surface Mount Surface Mount (BGA)
工作温度 [DATA_NEEDED: operating temperature range] —
Speed Grade [DATA_NEEDED: speed grade] —
电源电压 [DATA_NEEDED: supply voltage] —
Transceiver Count [DATA_NEEDED: transceiver count] —
Package Dimensions [DATA_NEEDED: package dimensions] —
RoHS 状态 unknown Compliant
REACH Status unknown —
AEC-Q100 Qualification unknown —
Lead-free Status unknown —
Halogen-free Status unknown —
Device Type — Field-Programmable Gate Array (FPGA)
Logic Elements (LEs) — 60,440
Configurable Logic Blocks (CLBs) — 60,440
Embedded Memory Bits — 2,544,192 bits
Internal Frequency (max) — 717 MHz
Process Technology — 90 nm
Core Voltage — 1.2 V
Package Type — 1152-ball FC-FBGA
Package Size — 35 x 35 mm (1 mm ball pitch)
Number of Terminals — 1152
Terminal Form — Ball
Temperature Grade — Industrial (-40C to +100C junction)
Lead-Free — Yes
MSL 等级 — [DATA_NEEDED: MSL level]

数据手册与资源

浏览全部产品 创建 BOM 获取报价