EP3C5M164C8N - Cyclone III FPGA, 5136 LEs, 164-MBGA | Altera
料号： EP3C5M164C8N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $21.06 | $21.06 |
| 10 | $19.85 | $198.50 |
| 100 | $17.95 | $1,795.00 |
| 500 | $16.2 | $8,100.00 |
| 1,000 | $14.5 | $14,500.00 |
EP3C5M164C8N 概述
A Field Programmable Gate Array (FPGA) is a type of programmable logic device that combines programmable logic fabric (lookup tables, flip-flops, routing, and embedded memory blocks) into a single semiconductor IC. FPGAs sit within the broader hierarchy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors, and are used when design requirements include parallelism, real-time signal processing, or post-manufacture reconfigurability. Cyclone III is positioned as a low-cost, low-power family in Altera's (now Intel) FPGA portfolio, optimized for high-volume cost-sensitive applications.
Key features include 5,136 vertically arranged Logic Elements, 423,936 bits of total embedded memory organized into M9K blocks, 23 18x18 hardware multipliers, two PLLs per device for clock management, and support for common I/O standards such as LVDS, LVCMOS, SSTL, and PCI. The device is available in commercial (C8, -40C to +85C) and industrial (I7/I8, -40C to +100C) temperature grades.
The Cyclone III architecture integrates logic, DSP blocks, and memory in a tile-based fabric. The 65 nm process enables low static and dynamic power, while the 18x18 multipliers support efficient DSP operations such as FIR filters and FFTs. The PLLs provide frequency synthesis, phase shifting, and clock deskewing for high-speed designs.
Typical applications include industrial control and motor drive, consumer video processing, automotive infotainment, software-defined radio front-ends, low-cost prototyping, and embedded DSP systems. The 164-MBGA package supports a compact PCB footprint while providing 106 user I/O pins for moderate-density designs.
When designing with this device, ensure the 1.2 V core supply is properly decoupled with low-ESR ceramic capacitors placed close to the power pins, and follow Altera's Cyclone III Hardware Reference Manual for configuration pin connections (MSEL[3:0], nCONFIG, nSTATUS, CONF_DONE) to select the appropriate configuration mode.
This page synthesizes distributor pricing, drop-in package alternatives within the Cyclone III family, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： EP3C5M164C8N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3C5M164C8N （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Embedded Memory, Total Memory Bits, PLLs.
快速对比工具——选择替代料号进行并排对比：
EP3C5M164C7N
✅ 直接替换✓ 有现货
$17.2 / 个
查看数据手册 →EP3C5M164I7N
✅ 直接替换✓ 有现货
$23.4 / 个
查看数据手册 →EP3C5M164C6N
✅ 直接替换📋 参考替代料（不在目录中）
EP3C5M164A7N
✅ 直接替换📋 参考替代料（不在目录中）
EP3C5M164C8N 最大额定值与电气特性
| Family | Cyclone III |
| Logic Elements (LE) | 5,136 |
| Total Memory Bits | 423,936 |
| Embedded Memory | 414 kbit (M9K blocks) |
| Embedded Multipliers (18x18) | 23 |
| PLLs | 2 |
| Maximum User I/O | 106 |
| Maximum Operating Frequency | 402 MHz |
| Core Voltage | 1.15 V to 1.25 V (nominal 1.2 V) |
| Process Technology | 65 nm |
| 封装 | 164-MBGA (Micro FineLine BGA) |
| 安装类型 | Surface Mount |
| 工作温度 | 0C to +85C (commercial C8 grade) |
| Configuration Mode | AS, AP, PS, FPP (selectable via MSEL pins) |
EP3C5M164C8N 164-mbga (micro fineline bga) 引脚配置指南
EP3C5M164C8N（164-mbga (micro fineline bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3C5M164C8N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3C5M164C8N 适用于 6 应用s: Industrial Control and Motor Drive, Consumer Video Processing, Automotive Infotainment, Software-Defined Radio (SDR) Front-End, Low-Cost FPGA Prototyping, Embedded DSP Systems.
Industrial Control and Motor Drive
The EP3C5M164C8N is well suited for industrial control and motor drive applications because its 5,136 Logic Elements, 23 18x18 multipliers, and 2 PLLs provide sufficient fabric for encoder decoding, PID loop computation, and PWM generation. The 106 user I/Os allow direct connection to multiple position sensors, Hall-effect inputs, and gate driver signals. The 65 nm low-power process keeps dynamic dissipation manageable in enclosed motor control cabinets. Typical designs use the hardware multipliers for field-oriented control (FOC) math, while the M9K memory blocks buffer ADC samples and reference tables. Compared with a microcontroller-only solution, the EP3C5M164C8N handles multiple control loops in parallel without CPU bottlenecks.
推荐
Consumer Video Processing
For consumer video applications, the EP3C5M164C8N provides the right balance of logic, multiplier count, and I/O. The 23 18x18 multipliers accelerate deinterlacing, scaling, and color-space conversion pipelines at typical 480p/576p consumer resolutions. The 106 user I/Os interface to BT.656/HDMI receivers and memory controllers, while the 423,936 bits of embedded memory buffer line-rate video. The 164-MBGA package supports compact PCB designs required by set-top box form factors. The C8 commercial speed grade is sufficient for real-time video at standard-definition rates, and the 1.2 V core keeps power dissipation in the 0.5-1 W range under typical loads.
推荐
Automotive Infotainment
The EP3C5M164C8N (C8 commercial grade) is used in non-safety automotive infotainment applications such as rear-seat entertainment, head-unit graphics, and instrument cluster display drivers. Its 5,136 LEs can implement LVDS display serialization, touch controller glue logic, and audio mixing. The 164-MBGA package supports the small PCB areas typical of dashboard-mounted modules. Designers targeting AEC-Q100 qualified environments should instead choose the EP3C5M164A7N automotive variant, which shares the same footprint and die. The Cyclone III family's low static power reduces quiescent drain when the infotainment system is in standby.
推荐
Software-Defined Radio (SDR) Front-End
The EP3C5M164C8N fits low-cost SDR front-end designs up to about 70 MHz bandwidth. Its 23 18x18 multipliers implement FFT butterfly operations efficiently, and the M9K memory blocks store FFT window coefficients and sample buffers. The two PLLs generate the multiple clock domains required by ADC interfaces and digital down-conversion chains. The 106 user I/Os interface to ADCs, DACs, and host processors. For higher bandwidth SDR (200 MHz+), a Cyclone III device with more multipliers (e.g., EP3C25/EP3C40) is recommended. The 164-MBGA package is a popular choice for SDR development boards due to its hand-reworkability.
推荐
Low-Cost FPGA Prototyping
The EP3C5M164C8N is widely used in FPGA prototyping and education kits because of its low unit cost and 164-MBGA package that balances I/O count against board complexity. The 5,136 LEs provide enough headroom for processor cores (NIOS II), custom peripherals, and verification bridges. The C8 commercial grade supports typical lab environments (0C to +85C). Quartus II Web Edition provides free development toolchain support. Compared with larger Cyclone III devices, the EP3C5 keeps total BOM cost low while still exposing the full Cyclone III architecture (M9K blocks, multipliers, PLLs) for educational purposes.
推荐
Embedded DSP Systems
For embedded DSP tasks such as audio effects processing, sensor fusion, and vibration analysis, the EP3C5M164C8N delivers 23 dedicated 18x18 multipliers running at up to 402 MHz. This provides roughly 9 GMACs of multiply-accumulate throughput - enough for 256-tap FIR filters, FFT bins up to 1,024 points, and multi-channel audio mixing at 48 kHz. The 414 kbit of embedded memory serves as coefficient and sample storage, while the two PLLs generate audio and sensor sampling clocks from a single reference. The 164-MBGA footprint supports fan-in-chip PCB modules, allowing the FPGA to be embedded alongside the host MCU.
推荐
推荐产品汇总
工程参考数据： EP3C5M164C8N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3C5M164C7N | EP3C5M164I7N | EP3C5M164C6N | EP3C5M164A7N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 164-MBGA | 164-MBGA - same | 164-MBGA - same | 164-MBGA - same | 164-MBGA - same |
| Logic Elements | 5,136 | 5,136 (identical die) | 5,136 (identical die) | 5,136 (identical die) | 5,136 (identical die) |
| Embedded Memory (bits) | 423,936 | 423,936 (identical die) | 423,936 (identical die) | 423,936 (identical die) | 423,936 (identical die) |
| Multipliers (18x18) | 23 | 23 (identical die) | 23 (identical die) | 23 (identical die) | 23 (identical die) |
| PLLs | 2 | 2 (identical die) | 2 (identical die) | 2 (identical die) | 2 (identical die) |
| Speed Grade | 8 (commercial, ~402 MHz) | 7 (commercial, ~360 MHz) | 7 (industrial, ~360 MHz) | 6 (commercial, ~340 MHz) | 7 (automotive, ~360 MHz) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Automotive (AEC-Q100) |
| Max User I/O | 106 | 106 (identical package) | 106 (identical package) | 106 (identical package) | 106 (identical package) |
关键差异点
- Highest commercial speed grade in 164-MBGA package for the EP3C5 density tier （对比 EP3C5M164C7N)
- Only EP3C5 164-MBGA variant suitable for lab-temperature commercial designs （对比 EP3C5M164I7N)
- Maximum-density I/O in the smallest Cyclone III 164-ball package （对比 EP3C5E144C8N)
设计说明
Estimated: at typical utilization (60% LEs, 50% multipliers toggling), the 1.2 V core draws approximately 200-300 mA. Place 10 uF bulk and 0.1 uF decoupling capacitors within 5 mm of each VCCINT pin pair. The VCCA (PLL analog supply) must be quiet - filter it through a ferrite bead from the same 1.2 V rail. Each VCCIO bank is independently powered and must match the I/O standard voltage of the devices it connects to (e.g., 2.5 V for LVCMOS25, 3.0 V for LVCMOS30).
The 164-MBGA package has 0.5 mm pitch with via-in-pad recommended. Use laser-drilled micro-vias on the BGA breakouts and route signals on inner layers to escape the dense ball array. Provide a continuous ground plane on the layer directly beneath the BGA and stitch the perimeter with a ground via fence every 2 mm. The exposed pads (if present) must be soldered to a thermal pad connected to ground for heat spreading.
Do not leave unused I/O pins floating - configure them as outputs driving ground (or as inputs with weak pull-up) in the Quartus II pin assignment file. Floating I/Os can cause excessive current draw and may oscillate, injecting noise into adjacent logic. Also ensure the MSEL[3:0] pins are tied to the correct logic levels via 10 kohm pull-ups or pull-downs for your chosen configuration mode (e.g., MSEL=0000 for AS standard, MSEL=0010 for AP).
Group clock inputs on dedicated clock input pins (CLK[0..n]) for best skew performance. Place the 50 ohm clock source termination as close as possible to the FPGA clock pin. For DDR/DDR2 external memory interfaces, follow the length-matching rules in the Cyclone III External Memory Interface Handbook - typically within +/- 50 ps for clocks and +/- 25 ps for data/ strobe.
合规信息
RoHS/REACH status not confirmed in the Verified Web Data - marked unknown. EP3C5M164C8N itself is commercial grade and not AEC-Q100 qualified; the EP3C5M164A7N variant provides automotive qualification if required.
