EP3C5M164C8N - Cyclone III FPGA, 5136 LEs, 164-MBGA | Altera
부품 번호: EP3C5M164C8N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $21.06 | $21.06 |
| 10 | $19.85 | $198.50 |
| 100 | $17.95 | $1,795.00 |
| 500 | $16.2 | $8,100.00 |
| 1,000 | $14.5 | $14,500.00 |
EP3C5M164C8N 개요
A Field Programmable Gate Array (FPGA) is a type of programmable logic device that combines programmable logic fabric (lookup tables, flip-flops, routing, and embedded memory blocks) into a single semiconductor IC. FPGAs sit within the broader hierarchy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors, and are used when design requirements include parallelism, real-time signal processing, or post-manufacture reconfigurability. Cyclone III is positioned as a low-cost, low-power family in Altera's (now Intel) FPGA portfolio, optimized for high-volume cost-sensitive applications.
Key features include 5,136 vertically arranged Logic Elements, 423,936 bits of total embedded memory organized into M9K blocks, 23 18x18 hardware multipliers, two PLLs per device for clock management, and support for common I/O standards such as LVDS, LVCMOS, SSTL, and PCI. The device is available in commercial (C8, -40C to +85C) and industrial (I7/I8, -40C to +100C) temperature grades.
The Cyclone III architecture integrates logic, DSP blocks, and memory in a tile-based fabric. The 65 nm process enables low static and dynamic power, while the 18x18 multipliers support efficient DSP operations such as FIR filters and FFTs. The PLLs provide frequency synthesis, phase shifting, and clock deskewing for high-speed designs.
Typical applications include industrial control and motor drive, consumer video processing, automotive infotainment, software-defined radio front-ends, low-cost prototyping, and embedded DSP systems. The 164-MBGA package supports a compact PCB footprint while providing 106 user I/O pins for moderate-density designs.
When designing with this device, ensure the 1.2 V core supply is properly decoupled with low-ESR ceramic capacitors placed close to the power pins, and follow Altera's Cyclone III Hardware Reference Manual for configuration pin connections (MSEL[3:0], nCONFIG, nSTATUS, CONF_DONE) to select the appropriate configuration mode.
This page synthesizes distributor pricing, drop-in package alternatives within the Cyclone III family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: EP3C5M164C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C5M164C8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Embedded Memory, Total Memory Bits, PLLs.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C5M164C7N
✅ 드롭인✓ 재고 있음
$17.2 / 개
데이터시트 보기 →EP3C5M164I7N
✅ 드롭인✓ 재고 있음
$23.4 / 개
데이터시트 보기 →EP3C5M164C6N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3C5M164A7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3C5M164C8N 최대 정격 & 전기적 특성
| Family | Cyclone III |
| Logic Elements (LE) | 5,136 |
| Total Memory Bits | 423,936 |
| Embedded Memory | 414 kbit (M9K blocks) |
| Embedded Multipliers (18x18) | 23 |
| PLLs | 2 |
| Maximum User I/O | 106 |
| Maximum Operating Frequency | 402 MHz |
| Core Voltage | 1.15 V to 1.25 V (nominal 1.2 V) |
| Process Technology | 65 nm |
| 패키지 | 164-MBGA (Micro FineLine BGA) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (commercial C8 grade) |
| Configuration Mode | AS, AP, PS, FPP (selectable via MSEL pins) |
EP3C5M164C8N 164-mbga (micro fineline bga) 핀 구성 가이드
EP3C5M164C8N(164-mbga (micro fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3C5M164C8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3C5M164C8N 적합 용도: 6 애플리케이션s: Industrial Control and Motor Drive, Consumer Video Processing, Automotive Infotainment, Software-Defined Radio (SDR) Front-End, Low-Cost FPGA Prototyping, Embedded DSP Systems.
Industrial Control and Motor Drive
The EP3C5M164C8N is well suited for industrial control and motor drive applications because its 5,136 Logic Elements, 23 18x18 multipliers, and 2 PLLs provide sufficient fabric for encoder decoding, PID loop computation, and PWM generation. The 106 user I/Os allow direct connection to multiple position sensors, Hall-effect inputs, and gate driver signals. The 65 nm low-power process keeps dynamic dissipation manageable in enclosed motor control cabinets. Typical designs use the hardware multipliers for field-oriented control (FOC) math, while the M9K memory blocks buffer ADC samples and reference tables. Compared with a microcontroller-only solution, the EP3C5M164C8N handles multiple control loops in parallel without CPU bottlenecks.
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Consumer Video Processing
For consumer video applications, the EP3C5M164C8N provides the right balance of logic, multiplier count, and I/O. The 23 18x18 multipliers accelerate deinterlacing, scaling, and color-space conversion pipelines at typical 480p/576p consumer resolutions. The 106 user I/Os interface to BT.656/HDMI receivers and memory controllers, while the 423,936 bits of embedded memory buffer line-rate video. The 164-MBGA package supports compact PCB designs required by set-top box form factors. The C8 commercial speed grade is sufficient for real-time video at standard-definition rates, and the 1.2 V core keeps power dissipation in the 0.5-1 W range under typical loads.
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Automotive Infotainment
The EP3C5M164C8N (C8 commercial grade) is used in non-safety automotive infotainment applications such as rear-seat entertainment, head-unit graphics, and instrument cluster display drivers. Its 5,136 LEs can implement LVDS display serialization, touch controller glue logic, and audio mixing. The 164-MBGA package supports the small PCB areas typical of dashboard-mounted modules. Designers targeting AEC-Q100 qualified environments should instead choose the EP3C5M164A7N automotive variant, which shares the same footprint and die. The Cyclone III family's low static power reduces quiescent drain when the infotainment system is in standby.
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Software-Defined Radio (SDR) Front-End
The EP3C5M164C8N fits low-cost SDR front-end designs up to about 70 MHz bandwidth. Its 23 18x18 multipliers implement FFT butterfly operations efficiently, and the M9K memory blocks store FFT window coefficients and sample buffers. The two PLLs generate the multiple clock domains required by ADC interfaces and digital down-conversion chains. The 106 user I/Os interface to ADCs, DACs, and host processors. For higher bandwidth SDR (200 MHz+), a Cyclone III device with more multipliers (e.g., EP3C25/EP3C40) is recommended. The 164-MBGA package is a popular choice for SDR development boards due to its hand-reworkability.
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Low-Cost FPGA Prototyping
The EP3C5M164C8N is widely used in FPGA prototyping and education kits because of its low unit cost and 164-MBGA package that balances I/O count against board complexity. The 5,136 LEs provide enough headroom for processor cores (NIOS II), custom peripherals, and verification bridges. The C8 commercial grade supports typical lab environments (0C to +85C). Quartus II Web Edition provides free development toolchain support. Compared with larger Cyclone III devices, the EP3C5 keeps total BOM cost low while still exposing the full Cyclone III architecture (M9K blocks, multipliers, PLLs) for educational purposes.
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Embedded DSP Systems
For embedded DSP tasks such as audio effects processing, sensor fusion, and vibration analysis, the EP3C5M164C8N delivers 23 dedicated 18x18 multipliers running at up to 402 MHz. This provides roughly 9 GMACs of multiply-accumulate throughput - enough for 256-tap FIR filters, FFT bins up to 1,024 points, and multi-channel audio mixing at 48 kHz. The 414 kbit of embedded memory serves as coefficient and sample storage, while the two PLLs generate audio and sensor sampling clocks from a single reference. The 164-MBGA footprint supports fan-in-chip PCB modules, allowing the FPGA to be embedded alongside the host MCU.
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추천 제품 요약
엔지니어링 참조 데이터: EP3C5M164C8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C5M164C7N | EP3C5M164I7N | EP3C5M164C6N | EP3C5M164A7N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 164-MBGA | 164-MBGA - same | 164-MBGA - same | 164-MBGA - same | 164-MBGA - same |
| Logic Elements | 5,136 | 5,136 (identical die) | 5,136 (identical die) | 5,136 (identical die) | 5,136 (identical die) |
| Embedded Memory (bits) | 423,936 | 423,936 (identical die) | 423,936 (identical die) | 423,936 (identical die) | 423,936 (identical die) |
| Multipliers (18x18) | 23 | 23 (identical die) | 23 (identical die) | 23 (identical die) | 23 (identical die) |
| PLLs | 2 | 2 (identical die) | 2 (identical die) | 2 (identical die) | 2 (identical die) |
| Speed Grade | 8 (commercial, ~402 MHz) | 7 (commercial, ~360 MHz) | 7 (industrial, ~360 MHz) | 6 (commercial, ~340 MHz) | 7 (automotive, ~360 MHz) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Automotive (AEC-Q100) |
| Max User I/O | 106 | 106 (identical package) | 106 (identical package) | 106 (identical package) | 106 (identical package) |
주요 차별점
- Highest commercial speed grade in 164-MBGA package for the EP3C5 density tier (vs EP3C5M164C7N)
- Only EP3C5 164-MBGA variant suitable for lab-temperature commercial designs (vs EP3C5M164I7N)
- Maximum-density I/O in the smallest Cyclone III 164-ball package (vs EP3C5E144C8N)
설계 노트
Estimated: at typical utilization (60% LEs, 50% multipliers toggling), the 1.2 V core draws approximately 200-300 mA. Place 10 uF bulk and 0.1 uF decoupling capacitors within 5 mm of each VCCINT pin pair. The VCCA (PLL analog supply) must be quiet - filter it through a ferrite bead from the same 1.2 V rail. Each VCCIO bank is independently powered and must match the I/O standard voltage of the devices it connects to (e.g., 2.5 V for LVCMOS25, 3.0 V for LVCMOS30).
The 164-MBGA package has 0.5 mm pitch with via-in-pad recommended. Use laser-drilled micro-vias on the BGA breakouts and route signals on inner layers to escape the dense ball array. Provide a continuous ground plane on the layer directly beneath the BGA and stitch the perimeter with a ground via fence every 2 mm. The exposed pads (if present) must be soldered to a thermal pad connected to ground for heat spreading.
Do not leave unused I/O pins floating - configure them as outputs driving ground (or as inputs with weak pull-up) in the Quartus II pin assignment file. Floating I/Os can cause excessive current draw and may oscillate, injecting noise into adjacent logic. Also ensure the MSEL[3:0] pins are tied to the correct logic levels via 10 kohm pull-ups or pull-downs for your chosen configuration mode (e.g., MSEL=0000 for AS standard, MSEL=0010 for AP).
Group clock inputs on dedicated clock input pins (CLK[0..n]) for best skew performance. Place the 50 ohm clock source termination as close as possible to the FPGA clock pin. For DDR/DDR2 external memory interfaces, follow the length-matching rules in the Cyclone III External Memory Interface Handbook - typically within +/- 50 ps for clocks and +/- 25 ps for data/ strobe.
규정 준수 정보
RoHS/REACH status not confirmed in the Verified Web Data - marked unknown. EP3C5M164C8N itself is commercial grade and not AEC-Q100 qualified; the EP3C5M164A7N variant provides automotive qualification if required.
