EP3SE110F1152C2NES - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152
料号： EP3SE110F1152C2NES ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1450 | $725,000.00 |
| 1,000 | $1320 | $1,320,000.00 |
EP3SE110F1152C2NES 概述
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that implements arbitrary digital logic through a configurable array of logic elements, embedded memory blocks, DSP blocks, and programmable interconnect. Within the broader taxonomy, the EP3SE110 sits inside: FPGA -> Programmable Logic -> Logic IC -> Integrated Circuit -> Semiconductor. The Stratix III family succeeded Stratix II in Altera's high-end portfolio and is widely deployed in telecommunications, military/aerospace, and test equipment where deterministic performance and abundant parallel arithmetic matter more than low static power.
Key features highlighted in distributor listings include 107,500 logic elements, 744 user I/Os, 65 nm process technology, 1.1 V core supply, 600 MHz maximum frequency, and the flip-chip BGA-1152 thermal package. The device integrates dedicated DSP blocks for fixed- and floating-point operations, embedded M9K memory blocks, and high-speed transceivers (the exact transceiver count varies by speed grade and is not detailed in the provided web data). The enhanced (E) variant increases logic and memory resources versus the base Stratix III.
Architecturally, Stratix III E devices use Altera's adaptive logic module (ALM) with 8-input fracturable look-up tables, providing higher effective density than 4-input LUT predecessors. The 1.1 V core supply combined with programmable power technology allows unused regions to be powered down, reducing dynamic consumption in partially utilized designs. The flip-chip BGA package improves thermal dissipation for high-utilization workloads.
Typical applications include high-end telecommunications line cards, ASIC prototyping platforms, military and aerospace signal processing, video broadcast equipment, high-performance computing accelerators, and industrial test and measurement instrumentation. With 744 user I/Os, the device supports wide external memory buses (DDR2/DDR3) and multiple high-speed parallel interfaces simultaneously.
When designing with this part, plan the PCB for the FC-FBGA-1152 footprint with controlled-impedance routing, matched-length high-speed pairs, and a multi-layer stack-up with continuous power/ground planes. Ensure the Quartus II toolchain (or compatible Altera/Intel FPGA software) is available for bitstream generation, as legacy Stratix III support is gated to specific Quartus versions.
This page synthesizes distributor availability, drop-in alternative MPNs, and practical design notes not found in the manufacturer datasheet, giving engineers an authoritative starting point for sourcing and second-sourcing the EP3SE110F1152C2NES.
直接替换替代料： EP3SE110F1152C2NES ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SE110F1152C2NES （相同外形与封装尺寸） ——差异在于 Package, Family, Speed Grade, Operating Temperature, Process Technology.
快速对比工具——选择替代料号进行并排对比：
EP3SE110F1152C2N
✅ 直接替换✓ 有现货
$1925 / 个
查看数据手册 →EP3SE110F1152C2
✅ 直接替换✓ 有现货
$4100 / 个
查看数据手册 →EP3CLS200F780C8ES
✅ 直接替换✓ 有现货
$215 / 个
查看数据手册 →EP3SE110F1152C2NES 最大额定值与电气特性
| Family | Stratix III Enhanced (EP3SE110) |
| Manufacturer | Altera (Intel) |
| Process Technology | 65 nm |
| Logic Elements | 107,500 |
| User I/O Pins | 744 |
| Core Voltage | 1.1 V |
| Maximum Operating Frequency | 600 MHz |
| 封装 | FC-FBGA-1152 (Flip-Chip) |
| 安装类型 | Surface Mount |
| Speed Grade | C2 |
| 存储器类型 | Embedded M9K blocks |
| DSP Blocks | Yes (variable-precision DSP) |
| Configuration | SRAM-based, volatile |
| Programming Interface | JTAG / Passive Serial / Fast Passive Parallel |
| Toolchain | Quartus II (Stratix III support) |
| RoHS 状态 | Non-Compliant (per Kynix listing) |
EP3SE110F1152C2NES fc-fbga-1152 (flip-chip) 引脚配置指南
EP3SE110F1152C2NES（fc-fbga-1152 (flip-chip) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SE110F1152C2NES.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SE110F1152C2NES 适用于 7 应用s: Telecommunications Line Cards, ASIC Prototyping Platforms, Military and Aerospace Signal Processing, Video Broadcast and Imaging, High-Performance Computing Accelerators, Industrial Test and Measurement, Medical Imaging Systems.
Telecommunications Line Cards
The EP3SE110F1152C2NES fits high-end telecommunications line cards because its 107,500 logic elements and 744 user I/Os can absorb multi-gigabit SERDES-side glue, packet classification, and queuing logic in a single device. The 1.1 V core and 65 nm process deliver the deterministic timing required for telecom backplane interfaces. The 600 MHz fabric supports wire-speed packet processing, while embedded M9K memory blocks handle buffer descriptors and lookup tables. Compared with discrete ASIC + companion FPGA solutions, the EP3SE110 consolidates the design into one part and reduces BOM cost.
推荐
ASIC Prototyping Platforms
With 107,500 logic elements, the EP3SE110F1152C2NES is well-suited for ASIC prototyping where multi-million-gate ASICs are partitioned across multiple FPGAs. The 744 user I/O pins enable high-pin-count chip-to-chip interconnect, which is essential when prototyping designs that consume 70-80% of one device. The 600 MHz internal frequency supports real-time operation at near-ASIC clock rates. Quartus II integration with synthesis flows from Synopsys/Cadence eases RTL bring-up. For prototype-to-production hand-off, the design can be re-targeted to a Stratix V or Stratix 10 hard-copy variant.
推荐
Military and Aerospace Signal Processing
The EP3SE110F1152C2NES suits defense signal-processing boards running radar, electronic-warfare, or secure-comm workloads because of its abundant DSP blocks and 107,500 LEs, which accelerate FFTs, channelizers, and encryption pipelines. The -I/-M temperature grades (not detailed in the web data) extend operation into harsh environments. With 744 user I/Os, the device interfaces to wide-bandwidth ADCs/DACs and legacy defense buses simultaneously. The flip-chip BGA package improves thermal dissipation in sealed conduction-cooled chassis. Long lifecycle and FPGA-based reconfigurability suit long military deployment cycles.
推荐
Video Broadcast and Imaging
The EP3SE110F1152C2NES serves video broadcast head-ends where uncompressed SDI/HD-SDI/3G-SDI streams need real-time processing, format conversion, and effects overlay. Its 744 user I/Os accept multi-channel video inputs and outputs while the 107,500 LEs provide real-time scaling, color-space conversion, and frame-buffer logic. Embedded DSP blocks accelerate motion-adaptive deinterlacing and noise reduction. The 600 MHz fabric supports 1080p60 line-rate processing. Compared with ASSP video processors, the EP3SE110 trades higher unit cost for unmatched flexibility in proprietary broadcast formats.
推荐
High-Performance Computing Accelerators
The EP3SE110F1152C2NES fits HPC accelerator cards where custom algorithms (genomics, finance, machine learning inference) benefit from massive FPGA parallelism. The 107,500 LEs plus dedicated DSP blocks provide tens to hundreds of parallel multiply-accumulate units, accelerating workloads by 10-100x over CPU baselines. The PCIe-side bandwidth served by 744 user I/Os supports DMA into host memory at near-line-rate. OpenCL and high-level synthesis tools let software engineers target the device without low-level RTL. Power consumption per operation is favorable compared with GPUs for integer-heavy workloads.
推荐
Industrial Test and Measurement
The EP3SE110F1152C2NES supports high-end test equipment such as protocol analyzers, ATE loaders, and waveform generators where deterministic timing and large parallel I/O count matter. Its 744 user I/Os drive multiple instrument-grade DACs/ADCs while the 107,500 LEs implement pattern generation, sequencing, and DSP post-processing. The 1.1 V core reduces heat in compact instrument chassis where the FC-FBGA-1152 package provides good thermal coupling to the chassis spreader. Embedded memory and DSP blocks accelerate FFT-based measurements and digital-signal conditioning.
推荐
Medical Imaging Systems
The EP3SE110F1152C2NES accelerates medical imaging front-ends in modalities such as ultrasound, CT, and MRI where real-time beamforming, image reconstruction, and filtering must run at line rate. The 107,500 LEs plus DSP blocks deliver the parallel arithmetic needed for back-projection, FIR filtering, and pixel-domain corrections. The 744 user I/Os aggregate multi-channel ADC data from transducer arrays. The 1.1 V core keeps power dissipation manageable in fan-less medical enclosures. FPGA-based reconfigurability supports evolving imaging algorithms without hardware redesign.
推荐
推荐产品汇总
工程参考数据： EP3SE110F1152C2NES ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SE110F1152C2N | EP3SE110F1152C2 | EP3CLS200F780C8ES |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | FC-FBGA-1152 | FC-FBGA-1152 (same) | FC-FBGA-1152 (same) | FBGA-780 (NOT pin-compatible) |
| Logic Elements | 107,500 | 107,500 | 107,500 | 200,000 (Cyclone III) |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.2 V (Cyclone III) |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm |
| Lifecycle Status | NRND | NRND | NRND | NRND |
关键差异点
- Same-die drop-in with identical package （对比 EP3SE110F1152C2N)
- Stratix III Enhanced feature set （对比 EP3CLS200F780C8ES)
- 744 user I/O for high-pin-count designs （对比 EP3SE110F1152C2)
设计说明
Estimated: at typical utilization of 60-70% logic and 600 MHz operation, the FC-FBGA-1152 package of the EP3SE110F1152C2NES may dissipate 8-12 W of power, depending on toggle rates and block usage. The flip-chip BGA provides a low thermal resistance to the PCB. Use a 12-layer or 14-layer stack-up with at least 4 inner ground planes stitched with thermal vias under the BGA thermal balls. A heatsink is recommended for high-utilization designs in sealed enclosures. Verify junction temperature with Quartus II PowerPlay early in the design cycle.
The FC-FBGA-1152 package requires 1.0 mm pitch BGA fan-out with microvia or via-in-pad technology. Use 0.5 oz copper on outer layers with 1 oz copper on inner layers for controlled-impedance routing. Match high-speed pairs (transceivers and external memory) within 5 mils length tolerance. Provide a complete reference ground plane under the BGA to control return paths. Multi-layer stack-up with continuous power and ground planes is mandatory for the 1.1 V core supply, which has tight noise tolerance.
Estimated: signal-integrity margins are critical for 600 MHz operation across 744 user I/Os. Use IBIS-AMI models from Altera to simulate the high-speed I/O and memory interfaces before tape-out. Place external memory (DDR2/DDR3) within 1 inch of the FPGA to keep address/command traces short. Series-damping resistors on critical clock and high-speed pairs help reduce reflections. Use Fly-by topology for DDR3 memory to meet timing. Quartus II's TimeQuest timing analyzer should be used to close timing across all corners (fast/slow, hot/cold).
Avoid these pitfalls when designing with the EP3SE110F1152C2NES: (1) Do not skip the configuration device - the EP3SE110 is volatile and needs an external EPCS or EPCQ flash at every power-up. (2) Do not exceed the maximum allowed VCCIO per bank or mix incompatible I/O standards in the same bank. (3) Do not forget power-up sequencing: 1.1 V core must ramp before VCCAUX and VCCIO or the device may latch up. (4) Do not omit decoupling - use 0.1 uF MLCCs plus bulk capacitors within 100 mils of each power pin. (5) Do not load the bitstream over JTAG on production boards without security considerations.
合规信息
RoHS Non-Compliant per Kynix distributor listing. Reach, lead-free, halogen-free, and conflict-mineral compliance not confirmed in available data. AEC-Q100 not applicable (FPGA, not automotive qualified per datasheet).
