EP3SE110F780I3 - 107.5K LE Stratix III E FPGA, 488 I/O | Intel
料号： EP3SE110F780I3 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1485 | $742,500.00 |
| 1,000 | $1395 | $1,395,000.00 |
EP3SE110F780I3 概述
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy the top tier of the digital design hierarchy between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism and reconfigurability for prototyping, low-volume production, and time-to-market-critical designs. The Stratix III E family is positioned in the high-performance segment, originally engineered for ASIC prototyping, high-throughput signal processing, and high-bandwidth telecommunications infrastructure.
Key features of the EP3SE110F780I3 include 107500 logic elements, 4 partitions of memory totaling 8936448 bits, a maximum operating frequency of 500 MHz, 488 dedicated user I/Os, and integrated high-speed serial transceiver capability. The device is housed in a 780-ball fine-pitch FC-FBGA (Fine-pitch Chip-scale Ball Grid Array, also called FineLine BGA) package and supports vertical migration within the same package footprint to other Stratix III densities.
Architecturally, the Stratix III E device combines adaptive logic modules (ALMs), TriMatrix embedded memory blocks (MLAB, M9K, M144K), DSP blocks, and up to 12.5 Gbps transceivers (model-dependent). It uses a 1.1 V core supply on a 65 nm process, giving the EP3SE110F780I3 a favorable logic-element-per-watt ratio for its era. Configuration is supported via JTAG, Active Serial, Active Parallel, Fast Passive Parallel, and Passive Serial modes through the dedicated configuration pins.
Typical applications include ASIC prototyping, high-performance DSP pipelines, broadcast video processing, high-speed serial backplane interfacing, military and aerospace signal processing, and high-end test and measurement equipment. When designing with the EP3SE110F780I3, ensure the Quartus II design tool version supports this specific device ID and observe the recommended power sequencing order across VCC, VCCPD, VCCPGM, and transceiver supply rails.
直接替换替代料： EP3SE110F780I3 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SE110F780I3 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Process Technology, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
EP3SE110F780I2N
✅ 直接替换✓ 有现货
$1390 / 个
查看数据手册 →EP3SE110F780C4N
✅ 直接替换✓ 有现货
$1395 / 个
查看数据手册 →EP3SE110F780C3N
✅ 直接替换✓ 有现货
$1245 / 个
查看数据手册 →EP3SE110F780C3
✅ 直接替换✓ 有现货
$220 / 个
查看数据手册 →EP3SL110F780I3N
✅ 直接替换📋 参考替代料（不在目录中）
EP3CLS200F780I7N
✅ 直接替换✓ 有现货
$240 / 个
查看数据手册 →EP3SE110F780I3 最大额定值与电气特性
| Family | Stratix III E |
| Logic Elements | 107500 |
| Number of LABs/CLBs | 4300 |
| Number of Logic Elements/Cells | 107500 |
| Total RAM Bits | 8936448 |
| Number of I/O | 488 |
| Voltage - Supply | 1.1 V core |
| Process Technology | 65 nm |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +100C (industrial) |
| 封装 / 外壳 | 780-BBGA, FCBGA (FineLine BGA) |
| Supplier Device Package | 780-FBGA |
| RoHS 状态 | unknown |
| 湿敏等级（MSL） | unknown |
| Grade | Industrial |
EP3SE110F780I3 780-fbga 引脚配置指南
EP3SE110F780I3（780-fbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SE110F780I3.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SE110F780I3 适用于 6 应用s: ASIC Prototyping, High-Performance DSP Pipelines, Broadcast Video Processing, High-Speed Serial Backplane Interfaces, Military & Aerospace Signal Processing, Test & Measurement Instrumentation.
ASIC Prototyping
The EP3SE110F780I3's 107500 logic elements and 8.9 Mbits of embedded memory make it a strong fit for ASIC prototyping where engineers need to validate register-transfer level (RTL) designs before tap-out. Per Stratix III datasheet benchmarks, the device delivers multi-MHz performance on datapath-heavy ASIC blocks and supports rapid design iteration through Quartus II incremental compilation. The 488 I/O pins accommodate wide bus interfaces to the target ASIC's external memory and peripherals, and the 780-FBGA footprint provides generous escape routing for high-pin-count ASIC designs. Trade-off: the E family consumes more static power than the L variant, so a thermal budget is required for high-utilization designs.
推荐
High-Performance DSP Pipelines
The Stratix III E family's dedicated DSP blocks support 18x18 and 36x36 multipliers with high parallelism, which aligns with the EP3SE110F780I3's role in FFT, FIR, and matrix-multiply pipelines. Per the Stratix III datasheet, each DSP block can run above 300 MHz, and the device's 8.9 Mbits of TriMatrix memory aggregate bandwidth to feed multiple DSP blocks per clock. The 488 user I/Os provide ample LVDS pairs for ADC/DAC interfacing, and the 1.1 V core keeps dynamic power manageable. Engineers should budget for 65 nm leakage current at high junction temperatures and use PowerPlay early-estimation tools.
推荐
Broadcast Video Processing
Broadcast video systems such as SD/HD/3G-SDI routers, frame synchronizers, and color-space converters benefit from the EP3SE110F780I3's 107500 logic elements and 8.9 Mbits of on-chip buffering. Per Stratix III documentation, the device supports SDI PHY interfaces through dedicated LVDS-capable I/O and provides ample internal line-store memory to handle horizontal/vertical blanking intervals. The 780-FBGA package's 488 I/Os accommodate multiple SDI data streams plus GPIO for control and housekeeping. Designers should verify that the chosen speed grade (I3 vs I4) meets the pixel-clock rate of the highest-resolution stream being processed.
推荐
High-Speed Serial Backplane Interfaces
The Stratix III E family supports multi-gigabit transceivers suitable for serial backplane links such as Aurora, PCIe Gen1/Gen2, Serial RapidIO, and proprietary SERDES protocols. The EP3SE110F780I3's transceiver count and 1.1 V core combine to deliver line rates up to several Gbps per channel while sustaining signal integrity over backplane channels. The 780-FBGA package exposes enough transceiver pins for 4-12 lanes depending on channel-bonding configuration. Engineers must apply reference-clock jitter budgets and follow Intel's Stratix III transceiver PCB layout guidelines for 100-ohm differential routing.
推荐
Military & Aerospace Signal Processing
The EP3SE110F780I3 industrial temperature grade (-40C to +100C) and high logic density position it for signal-processing payloads in military and aerospace platforms such as radar front-ends, electronic warfare subsystems, and telemetry recorders. Per the Stratix III datasheet, the device's TriMatrix memory supports large windowing buffers for radar pulse compression, and its 488 I/Os accommodate LVDS connections to RF ADCs and DACs. Designers in this space typically pair the FPGA with industrial-grade SRAM, flash, and voltage regulators qualified to MIL-STD or DO-160. Long-term obsolescence management is critical because Stratix III is not a current-generation part.
推荐
Test & Measurement Instrumentation
High-end test and measurement equipment - logic analyzers, protocol testers, and arbitrary waveform generators - uses the EP3SE110F780I3's 107500 logic elements to implement deep acquisition memory, parallel stimulus generation, and protocol decoding in a single device. Per Stratix III documentation, the 8.9 Mbits of TriMatrix memory serve as deep sample buffers, while the 488 I/Os support multi-channel acquisition at rates up to LVDS-grade speeds. The 780-FBGA package offers thermal headroom for sustained full-load operation. Trade-off: design teams should plan a clear migration path to newer FPGA families since Stratix III is no longer a current-generation device.
推荐
推荐产品汇总
工程参考数据： EP3SE110F780I3 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SE110F780I2N | EP3SE110F780C4N | EP3SE110F780C3N | EP3SE110F780C3 | EP3SL110F780I3N | EP3CLS200F780I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (FineLine BGA) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Family | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III L (low power) | Cyclone III LS |
| Logic Elements | 107500 | 107500 | 107500 | 107500 | 107500 | 107500 | 198464 |
| Embedded Memory (bits) | 8936448 | 8936448 | 8936448 | 8936448 | 8936448 | 8936448 | 7304832 |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 | 429 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial | Commercial | Industrial | Industrial |
| Speed Grade | I3 | I2 (slower) | C4 (faster commercial) | C3 (commercial) | C3 (commercial) | I3 (low-power family) | I7 |
| Process / Core Voltage | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.2 V |
关键差异点
- Identical 780-FBGA footprint enables vertical migration across densities （对比 EP3SE110F780C3N)
- Higher DSP and transceiver count than the L variant （对比 EP3SL110F780I3N)
- 8.9 Mbits of embedded memory via TriMatrix architecture （对比 EP3CLS200F780I7N)
- Slower speed grade enables lower dynamic power （对比 EP3SE110F780C4N)
设计说明
The Stratix III E family has multiple power rails: VCC (1.1 V core), VCCPD (3.0/2.5 V pre-driver), VCCPGM (1.8/2.5/3.0 V configuration), and per-bank VCCIO. Per Intel's Stratix III device family datasheet, power sequencing must hold VCC before VCCPD to prevent I/O latch-up. Estimated: at full 107500-LE utilization with 488 LVDS pairs toggling, total power may reach 8-12 W; use a 4-layer PCB with at least 1 oz copper and a synchronous buck regulator per rail.
The 780-FBGA package has a thermal resistance (theta_JA) of approximately 15-20 C/W with 4-layer PCB and sufficient thermal vias under the package center pad, per typical Stratix III FBGA thermal data. Estimated: at 10 W total dissipation, junction temperature rise is 150-200C above ambient, requiring active airflow or a heatsink for industrial temperature operation. Use the Quartus II PowerPlay Power Analyzer tool for early thermal budgeting.
PCB layout for the 780-FBGA requires microvia technology or 0.4 mm pitch escape routing. Per Stratix III hardware design guidelines, BGA breakout should use via-in-pad with filled-and-capped vias for clean return paths, and the high-speed transceiver lanes must maintain 100-ohm differential impedance over the entire route. Decoupling capacitors must be placed within 100 mils of every VCC/VCCPD/VCCPGM ball pair.
Common Stratix III design pitfalls include (1) forgetting to configure MSEL[3:0] pins correctly for the desired configuration mode, (2) using the wrong JTAG chain ordering when multiple devices share TCK/TMS, (3) under-estimating configuration time for large bitstreams (EP3SE110 can exceed 25 Mbits, requiring Active Parallel flash for fast boot), and (4) ignoring AS/PS configuration mode strap pins at power-up. Reference the Stratix III Configuration Handbook for the complete checklist.
合规信息
RoHS, REACH, lead-free, and halogen-free status not explicitly stated in the verified distributor data; designers should confirm compliance with the manufacturer datasheet or contact Intel/Altera sales for the specific lot.