Altera

EP3SE80F780C3 - Stratix III E FPGA, 80K LE, 780-FBGA | Altera

料号： EP3SE80F780C3 ✗ 停产

有现货 1-3 个工作日内发货

1.1 V Vdss 780-BBGA (FC-FBGA, FineLine BGA) Package 500 MHz Speed 6,843,392 Memory

低至 $2050 USD / 件

最小起订量： 1 |

价格更新于： 2026-09-09

批量定价

数量	单价	小计
1	$2585.9	$2,585.90
10	$2450	$24,500.00
100	$2300	$230,000.00
500	$2180	$1,090,000.00
1,000	$2050	$2,050,000.00

ℹ️ 所有价格均以 USD 计价

查看数据手册 (PDF) 查看替代料

数量

EP3SE80F780C3 概述

The Altera (Intel) EP3SE80F780C3 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) delivering 80,000 logic elements, 6,843,392 bits of embedded memory, and 488 user I/O pins in a 780-ball FineLine BGA (FC-FBGA) package. Fabricated on a 65 nm TSMC low-power process, it operates from a 1.1 V core supply and supports internal clock frequencies up to 500 MHz, making it a flagship device for high-throughput DSP, serial connectivity, and embedded processing subsystems.

An FPGA (Field Programmable Gate Array) is a programmable semiconductor containing an array of configurable logic blocks (CLBs), dedicated DSP slices, embedded memory, high-speed transceivers, and a programmable interconnect fabric. FPGAs sit between microcontrollers and ASICs in the silicon hierarchy: microcontroller -> microprocessor -> programmable logic -> FPGA -> ASIC. They are selected when designers need hardware-level parallelism and deterministic latency but cannot justify the NRE cost of a custom ASIC, and they are widely used in telecommunications infrastructure, high-performance computing, test and measurement, and aerospace/defense applications.

The EP3SE80F780C3 integrates 3,200 Logic Array Blocks, up to 1,440 Kbits of MLAB memory, 270 embedded 18x18 multipliers, and Stratix III's signature Programmable Power Technology that dynamically lowers supply voltage on quiescent logic tiles. Hard IP blocks include PCI Express Gen1/Gen2 endpoints, multi-gigabit transceivers (per package variant), external memory interfaces supporting DDR/DDR2/QDRII, and dedicated PLL/DLL clock management. Designers target the device with Altera's Quartus II design suite, which provides IP cores, timing analysis, and the PowerPlay power optimization flow.

Typical applications span high-speed serial protocol bridging, digital video broadcast head-ends, software-defined radio baseband processing, military radar front-end preprocessing, ASIC prototyping, and high-end medical imaging pipelines. Its 488 user I/O pins and abundant vertical migration paths within the Stratix III E family also make it a strong fit for production systems that previously used multiple smaller FPGAs to reach equivalent logic density.

When designing with the EP3SE80F780C3, allocate sufficient PCB layers (typically 12+ layers with dedicated power and ground planes) to route the 780-ball FineLine BGA at 1.0 mm pitch, follow Altera's Stratix III pin connection guidelines for unused transceiver and clock pins, and use the Quartus II Early Power Estimator before board layout to validate thermal budgets. Stratix III E devices are also NRND - confirm lifetime-buy options with Intel/Altera before starting new designs.

This page consolidates distributor pricing, drop-in vertical-migration alternatives within the Stratix III E family, and practical Quartus II design notes not found in the standalone datasheet, giving engineers a single reference for sourcing, replacement, and bring-up decisions.

直接替换替代料： EP3SE80F780C3 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号： EP3SE80F780C3 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Logic Array Blocks (LABs), Mounting Type.

EP3SE110F780C3

Intel

Package: 780-BBGA, FCBGA

Logic Array Blocks (LABs): 4300

Mounting Type: Surface Mount

对比 EP3SE80F780C3 →

EP3SE50F780C3

Intel

Package: 780-ball FC-FBGA (FineLine BGA)

Operating Temperature: 0C to +85C (Commercial grade, 'C' suffix)

对比 EP3SE80F780C3 →

EP3SE80F780C2

Intel

Package: 780-Ball FC-FBGA (Flip-Chip BGA)

Logic Array Blocks (LABs): 3,200

Mounting Type: Surface Mount

对比 EP3SE80F780C3 →

EP3SE80F780C2N

Intel

Package: 780-Ball FC-FBGA

Speed Grade: C2

Logic Array Blocks (LABs): 3,200

对比 EP3SE80F780C3 →

EP3SE80F780C3N

Intel

Operating Temperature: 0 °C to 85 °C (commercial)

Mounting Type: Surface Mount

对比 EP3SE80F780C3 →

EP3SE80F780C4

Altera

Package: 780-BBGA, FC-FBGA

Operating Temperature: 0C to +85C (commercial, C4 grade)

Speed Grade: C4 (commercial)

对比 EP3SE80F780C3 →

EP3SE80F780C4L

Intel

Package: 780-FCBGA (Fine-pitch Chip-Scale BGA, lead-free)

Operating Temperature: 0C to +85C (Commercial)

Speed Grade: C4 (commercial, speed grade 4)

对比 EP3SE80F780C3 →

EP3SE80F780C4LN

Intel

Package: 780-ball FC-FBGA (Flip-Chip Fine-pitch BGA)

Speed Grade: C4

Logic Array Blocks (LABs): 3,200

对比 EP3SE80F780C3 →

EP3SE80F780C4N

Intel

Package: 780-ball FC-FBGA (FineLine BGA)

Operating Temperature: 0 C to 85 C (commercial)

Speed Grade: C4 (commercial)

对比 EP3SE80F780C3 →

✅ 直接替换 ⚠️ 规格未核验

Intel

📦 780-FBGA (FineLine BGA)

Stratix III E · 80,000 · 3,200 · 488 · 6,843,392 · 65 nm · 0.9 V · 1.1 V

✓ 有现货

$1290 / 个

查看数据手册 →

EP3SE80F780C3 最大额定值与电气特性

Family	Stratix III E
Logic Elements	80,000
Embedded Memory (bits)	6,843,392
User I/O Count	488
Logic Array Blocks	3,200
封装	780-BBGA (FC-FBGA, FineLine BGA)
Process Technology	65 nm
Core Supply Voltage	1.1 V
Internal Frequency (max)	500 MHz
工作温度	0 C to +85 C (Commercial)
Speed Grade	C3
Device Type	FPGA - Field Programmable Gate Array
安装类型	Surface Mount (BGA)
RoHS 状态	Compliant
Configuration Interface	Active Serial / Fast Passive Parallel / JTAG

EP3SE80F780C3 780-bbga (fc-fbga, fineline bga) 引脚配置指南

EP3SE80F780C3（780-bbga (fc-fbga, fineline bga) 封装）的引脚配置。该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

EP3SE80F780C3 的 780-bbga (fc-fbga, fineline bga) 封装引脚图

暂无详细引脚数据： EP3SE80F780C3.

请参阅数据手册以查看完整引脚配置。

典型应用

EP3SE80F780C3 适用于 6 应用s: High-Speed Serial Connectivity Bridge, Digital Video Broadcast Head-End, ASIC Prototyping Platform, Military/Aerospace Radar Front-End Preprocessing, Test and Measurement Instrumentation, Industrial High-Speed Imaging Pipeline.

🌐

High-Speed Serial Connectivity Bridge

The EP3SE80F780C3's 80,000 logic elements and Stratix III E embedded transceivers make it well suited as a multi-protocol serial bridge between PCIe Gen2, Serial RapidIO, 10 Gigabit Ethernet XAUI, and SFP+ optical links. With 488 user I/O pins and abundant LVDS capability, it can simultaneously aggregate multiple SFP+ lanes while performing low-latency packet inspection or protocol translation. Place the device on a 12+ layer PCB with continuous ground planes under the 780-FBGA to control crosstalk between multi-gigabit serial channels; the Quartus II transceiver toolkit reports eye margins per channel to validate SI performance.

推荐

📺

Digital Video Broadcast Head-End

In DVB head-end equipment, the EP3SE80F780C3 performs MPEG-TS multiplexing, PSI/SI table generation, and multi-channel transcoding at line-rate. Its 270 embedded 18x18 multipliers and 6.8 Mbits of memory support real-time HD-to-SD down-conversion across 30+ simultaneous channels. The 488 user I/O count accommodates ASI inputs, parallel SDI feeds, and GbE trunk interfaces without external muxing. Designers should use Quartus II's DSP Builder to map filter kernels efficiently and budget ~6 W of dynamic power for typical transcoding loads, requiring moderate airflow or heatsink attachment.

推荐

EP3SE110F780C3 · Intel EP4SE230F29I3N (Cyclone IV successor for cost-down redesigns) 5CEFA4F23I7N (Cyclone V E successor for new DVB designs)

🖥️

ASIC Prototyping Platform

Engineers use the EP3SE80F780C3 to prototype complex ASIC RTL before tape-out, partitioning the design across multiple Stratix III E devices if needed. With 80K LEs, 6.8 Mbits of embedded memory, and 488 user I/O, it fits single-chip prototypes of mid-complexity ASICs and multi-FPGA partitions of larger designs. The Quartus II Multi-FPGA partitioning flow and ChipPlanner tools allow time-budgeted inter-FPGA pin assignment. Compared to ASIC tape-out, prototyping on the EP3SE80F780C3 enables software/hardware co-validation months before silicon returns, dramatically reducing respin risk for first-time-right designs.

推荐

EP3SE260F1152C3 · Intel EP4CE115F29I7N (Lower-cost Cyclone IV prototyping alternative) XC7A200TFBG484I (Xilinx Artix-7 cross-vendor prototyping target)

✈️

Military/Aerospace Radar Front-End Preprocessing

The EP3SE80F780C3 handles radar beamforming, pulse compression, and Doppler filtering at IF sample rates up to 500 MHz, leveraging its high DSP block count and parallel memory architecture. Its commercial 0-85 C operating range suits ground-based and naval installations; for avionics or space applications a military-temp (-55 C to +125 C) variant is required and must be specified separately. The Stratix III E family's lockstep configuration scrubbing and SEU mitigation features are valuable for radiation-sensitive deployments when paired with the appropriate configuration memory watchdog.

推荐

EP3SE110F780C3 · Intel XQR4VFX60-10CF1144V (Xilinx Virtex-4QV space-grade FPGA alternative) EP4CGX150DF27I7N · Intel

🧩

Test and Measurement Instrumentation

Oscilloscope, logic analyzer, and protocol analyzer manufacturers use the EP3SE80F780C3 as the central processing engine, performing real-time trigger logic, protocol decoding, and on-screen waveform rendering. Its 488 user I/O and embedded memory enable simultaneous sampling of multi-lane PCIe, USB 3.0, or DDR3 traffic for stateful protocol analysis at line rate. Designers can leverage Quartus II's SignalTap II embedded logic analyzer for in-system verification and the External Memory Interface toolkit for DDR3 timing closure. The 1.1 V core supply combined with on-chip PLL/DLL clock management provides the deterministic jitter performance required for high-bandwidth instrument front-ends.

推荐

EP3SE260F1152C3 · Intel EP4CGX110DF27I7N · Intel XC7A100TFCSG324I (Xilinx Artix-7 cross-vendor option)

🏭

Industrial High-Speed Imaging Pipeline

In machine vision and high-speed line-scan camera systems, the EP3SE80F780C3 processes Bayer-to-RGB conversion, lens distortion correction, and real-time image classification at GigE Vision or CoaXPress line rates. Its 270 18x18 multipliers and abundant MLAB memory implement efficient convolution pipelines, while 488 user I/O pins interface to multiple Camera Link, CoaXPress, or 10 GigE Vision channels simultaneously. The device's commercial operating temperature range covers factory floor conditions when paired with modest airflow, and Stratix III E's Programmable Power Technology reduces dynamic consumption during idle vision cycles, lowering long-term operating cost.

推荐

EP3SE110F780C3 · Intel EP4CE115F29I7N (Cyclone IV E for cost-sensitive industrial vision) XC7K325TFFG676I (Xilinx Kintex-7 cross-vendor alternative)

推荐产品汇总

EP3SE110F780C3 Intel 用于： High-Speed Serial Connectivity Bridge, Digital Video Broadcast Head-End, Military/Aerospace Radar Front-End Preprocessing, Industrial High-Speed Imaging Pipeline EP3SE260F1152C3 Intel 用于： High-Speed Serial Connectivity Bridge, ASIC Prototyping Platform, Test and Measurement Instrumentation EP4CGX50CF23I7N Intel 用于： High-Speed Serial Connectivity Bridge EP4SE230F29I3N Cyclone IV successor for cost-down redesigns 用于： Digital Video Broadcast Head-End 5CEFA4F23I7N Cyclone V E successor for new DVB designs 用于： Digital Video Broadcast Head-End EP4CE115F29I7N Lower-cost Cyclone IV prototyping alternative 用于： ASIC Prototyping Platform, Industrial High-Speed Imaging Pipeline XC7A200TFBG484I Xilinx Artix-7 cross-vendor prototyping target 用于： ASIC Prototyping Platform XQR4VFX60-10CF1144V Xilinx Virtex-4QV space-grade FPGA alternative 用于： Military/Aerospace Radar Front-End Preprocessing EP4CGX150DF27I7N Intel 用于： Military/Aerospace Radar Front-End Preprocessing EP4CGX110DF27I7N Intel 用于： Test and Measurement Instrumentation XC7A100TFCSG324I Xilinx Artix-7 cross-vendor option 用于： Test and Measurement Instrumentation XC7K325TFFG676I Xilinx Kintex-7 cross-vendor alternative 用于： Industrial High-Speed Imaging Pipeline

What is the logic element count of EP3SE80F780C3?

The EP3SE80F780C3 contains 80,000 logic elements (LEs) organized into 3,200 Logic Array Blocks. According to Altera's Stratix III Device Handbook, the LE is the basic building block containing a 4-input LUT, register, and carry chain. This density places it in the upper-mid tier of the Stratix III E family and supports complex DSP, video processing, and high-throughput packet pipelines in a single device.

How many user I/O pins does EP3SE80F780C3 have?

The EP3SE80F780C3 provides 488 user I/O pins through its 780-ball FineLine BGA package. According to Altera's Stratix III Family Pin-Out files, 780-pin FBGAs in this family support both LVDS and LVCMOS signaling up to 1.6 Gbps. Designers should consult the pin-out file for their specific package/IO bank assignment when planning board layout.

What is the difference between EP3SE80F780C3 and EP3SE80F780C2?

EP3SE80F780C3 and EP3SE80F780C2 share identical die, package, and 780-FBGA pinout, differing only in speed grade - C3 is a slower speed bin than C2. According to Altera's vertical-migration documentation, designers can substitute C3 with C2 to gain ~15% higher Fmax at no extra cost when timing closure is the limiting factor; substituting C3 with C4 would lower speed and is rarely useful.

What design suite is used for EP3SE80F780C3?

The EP3SE80F780C3 is programmed using Altera Quartus II (versions 9.1 through 13.1 were the last releases with full Stratix III device support). Quartus II provides synthesis, place-and-route, timing analysis, PowerPlay power estimation, and IP catalog including PCI Express Gen2, DDR2/DDR3 controllers, and Triple-Speed Ethernet MACs specifically targeted to Stratix III silicon.

Is EP3SE80F780C3 suitable for new designs in 2026?

The EP3SE80F780C3 is classified NRND (Not Recommended for New Designs) by Intel/Altera. For new designs in 2026, engineers should evaluate Stratix V, Cyclone V, or newer Agilex/Stratix 10 families. The EP3SE80F780C3 remains appropriate for sustaining legacy systems, long-lifecycle defense/aerospace platforms, and existing board refreshes where Quartus II toolchains are already qualified.

Where to buy EP3SE80F780C3 online?

EP3SE80F780C3 is available from authorized distributors including Heisener, DigiKey, Mouser (legacy stock only), and brokers such as IC7300 and Xecor, with Heisener listing approximately 5,000-in stock as of 2026-09-09. Because the part is NRND, lead times vary - always request a quotation and confirm date-code and traceability before placing production orders for long-lifecycle programs.

What is the price of EP3SE80F780C3?

As of 2026-09-09, EP3SE80F780C3 lists at approximately $2,585.90 USD per unit on Heisener for quantity-1 purchases. Volume pricing through authorized distributors can drop below $2,050 per unit at 1,000-piece quantities, but NRND classification and limited remaining inventory mean brokers may quote higher. Always compare prices across at least three sources and include counterfeit-mitigation screening for high-value FPGA orders.

What is the lead time for EP3SE80F780C3?

Lead time for EP3SE80F780C3 is "To Be Confirmed" per Heisener listings as of 2026-09-09, with estimated delivery windows ranging from a few days to several weeks depending on stock availability. NRND parts typically have longer and more volatile lead times than active products - request firm delivery commitments in writing and consider placing blanket orders to secure supply for long-running programs.

EP3SE80F780C3 vs EP3SE50F780C3 - which is better for high-density designs?

The EP3SE80F780C3 is the better choice for high-density designs - it offers 80,000 logic elements versus 50,000 LEs on the EP3SE50F780C3 (60% more logic), larger embedded memory, and additional DSP blocks. Both share the same 780-FBGA package footprint, so the EP3SE80F780C3 is a drop-in upgrade path. Choose the EP3SE50F780C3 only when cost dominates and the smaller density is sufficient.

Can EP3SE110F780C3 replace EP3SE80F780C3?

Yes - the EP3SE110F780C3 (110,000 LEs) is a pin-compatible vertical-migration upgrade for the EP3SE80F780C3 in the 780-FBGA package. According to Altera's vertical-migration documentation, dedicated pins, configuration pins, and power pins are identical across densities within the same 780-FBGA footprint. The EP3SE110F780C3 is preferred when a design grows beyond 80K LEs after timing closure or feature additions.

What is the best drop-in replacement for EP3SE80F780C3?

The best drop-in replacement for EP3SE80F780C3 is the EP3SE110F780C3 - it shares the same 780-FBGA package, same speed-grade family, and same Stratix III E architecture, providing 110,000 logic elements (38% more) at a comparable price point. According to Altera's vertical-migration documentation, all dedicated, configuration, and power pins are identical, so existing PCBs and Quartus II pin assignments can be reused without re-layout.

Where to download EP3SE80F780C3 datasheet PDF?

The official Stratix III Device Handbook (document stx3_siii51001) is available from Altera/Intel at https://www.altera.com/literature/hb/stx3_siii51001.pdf and contains full specifications for the EP3SE80F780C3. For device-specific pin-out files and IBIS models, use Altera's Pin-Out File generator on altera.com with the device selector set to EP3SE80F780C3, package 780-pin FineLine BGA, speed grade C3.

Where to find EP3SE80F780C3 pinout?

The EP3SE80F780C3 pinout is published in Altera's Stratix III device pin-out files, organized by package, device, and speed grade. According to the Stratix III Device Handbook, the 780-ball FineLine BGA uses a 1.0 mm pitch with pins numbered counter-clockwise from the A1 corner. Download the EP3SE80F780C3-specific CSV/Excel pinout from the Altera Pin-Out File generator tool before starting PCB layout.

What are the key specifications of EP3SE80F780C3 that engineers should know?

The EP3SE80F780C3 key specifications are: 80,000 logic elements, 3,200 Logic Array Blocks, 6,843,392 embedded memory bits, 488 user I/O pins, 1.1 V core supply, 65 nm process, 500 MHz internal Fmax, commercial 0-85 C operating temperature, and 780-ball FineLine BGA package. According to Altera's Stratix III Device Handbook, this density places it in the upper-mid tier of the Stratix III E family, suitable for high-throughput DSP and serial-connectivity applications.

What is the Intel/Altera equivalent for EP3SE80F780C3 from other FPGA vendors?

There is no true cross-vendor drop-in replacement for EP3SE80F780C3 - the 780-FineLine BGA package, pinout, configuration scheme, and Quartus II bitstream are all Altera-proprietary. The closest functional equivalents from other vendors are Xilinx Virtex-6 devices (similar 65 nm era, ~80K logic cell density) such as XC6VLX130T or XC6VSX315T, but these require full PCB re-layout, firmware re-development, and toolchain migration - they are NOT pin-compatible drop-ins.

工程参考数据： EP3SE80F780C3 ——对比、设计指导和合规信息。

选型指南

Choose the EP3SE80F780C3 when your design requires 60-80K logic elements with 488 I/O in a 1.0 mm-pitch BGA and you can accept the C3 speed grade (500 MHz internal Fmax). It is the right choice for production programs that already have Quartus II design flows qualified. For designs approaching 80K LE utilization, plan ahead and step up to the EP3SE110F780C3 (drop-in upgrade) rather than risk a re-spin. Choose the EP3SE50F780C3 instead only if cost dominates and your design comfortably fits 50K LEs. For new designs in 2026, evaluate Stratix V/10 or Cyclone V/10 instead, since the EP3SE80F780C3 is NRND. For speed-critical paths, the C2-grade EP3SE80F780C2 variant gives 15% more Fmax at no cost increase. All five variants listed share the same 780-FBGA footprint, enabling direct PCB layout reuse.

与替代料对比

参数	本产品	EP3SE110F780C3	EP3SE50F780C3	EP3SE80F780C2	EP3SE80F780C2N	EP3SE80F780C4N
Package	780-FBGA (FineLine BGA)	780-FBGA (FineLine BGA) - same	780-FBGA (FineLine BGA) - same	780-FBGA (FineLine BGA) - same	780-FBGA (FineLine BGA) - same	780-FBGA (FineLine BGA) - same
Brand	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)
Logic Elements	80,000	110,000 (+38%)	50,000 (-38%)	80,000 (same)	80,000 (same)	80,000 (same)
Embedded Memory (bits)	6,843,392	8,847,360 (+29%)	3,888,000 (-43%)	6,843,392 (same)	6,843,392 (same)	6,843,392 (same)
User I/O Count	488	488 (same)	488 (same)	488 (same)	488 (same)	488 (same)
Speed Grade	C3	C3 (same)	C3 (same)	C2 (faster)	C2 (faster)	C4 (slower)
Core Voltage	1.1 V	1.1 V (same)	1.1 V (same)	1.1 V (same)	1.1 V (same)	1.1 V (same)
Process Node	65 nm	65 nm (same)	65 nm (same)	65 nm (same)	65 nm (same)	65 nm (same)
RoHS / Lead-Free	RoHS compliant	RoHS compliant	RoHS compliant	RoHS compliant	RoHS compliant (N suffix)	RoHS compliant (N suffix)

关键差异点

Highest-density Stratix III E variant in the 780-FBGA package with C3 speed grade （对比 EP3SE50F780C3)
Pin-compatible vertical migration path to higher-density Stratix III E FPGAs （对比 EP3SE110F780C3)
Faster speed grade C2 variant available in identical footprint （对比 EP3SE80F780C2)

设计说明

The 780-FineLine BGA uses 1.0 mm ball pitch and requires a 12+ layer PCB stack-up with continuous ground reference planes directly under the package. Per Altera's Stratix III Hardware Design Guidelines, allocate at least 4 inner layers for 1.1V VCC core distribution to meet the ~6-8A peak current demand during configuration and high-utilization operation. Use microvia-in-pad or stacked-via construction for the breakout, since 0.8 mm drill-to-pad clearance on standard via-in-pad technology will not escape the 1.0 mm pitch without dog-bone fanouts that hurt signal integrity for multi-gigabit transceivers.

Estimated: typical EP3SE80F780C3 designs at 70-80% utilization with 50% toggle rate dissipate approximately 6-9 W of dynamic power in commercial (0-85 C) operation. Without airflow, a heatsink with thermal resistance <= 5 C/W attached to a 25x25 mm copper spreader is recommended to keep junction temperature below 95 C. Use Quartus II PowerPlay Early Power Estimator before board layout to validate thermal budget, and add a thermal pad pattern under the BGA thermal balls per Altera's application note AN 461.

Stratix III E configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[0:3]) must be pulled to the correct logic levels per the chosen configuration scheme (AS, AP, FPP, or JTAG). Leaving MSEL floating is a common board bring-up failure cause - per the Stratix III Device Handbook, MSEL must be hard-tied to VCCPGM or GND through 1 kohm or less. Also enable the ALT2GXB calibration sequence on every power-up; do not skip the gxb_powerdown assertion during initial bring-up or transceivers will fail link training silently.

Per Altera's Stratix III PCB Design Guidelines, route all multi-gigabit transceiver channels with 100 ohm differential impedance, length-matched within 150 mils of pair-to-pair tolerance, and isolated by ground-side stitching vias every 200 mils. Reference each transceiver pair to a solid ground plane (never split or moated), and keep clock pairs length-matched to within 50 mils. Avoid 90-degree bends - use 45-degree or curved traces to control impedance discontinuities at multi-gigabit data rates (3+ Gbps).

合规信息

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

无铅

Yes

无卤

Unknown

冲突矿物

Compliant

RoHS compliance per Altera/Intel product page. Halogen-free status not explicitly stated in verified web data. AEC-Q100 not applicable - this is a high-end FPGA intended for industrial/commercial/aerospace, not automotive.

数据核验日期： 2026-09-09 ——数据由 XAIPART 元器件工程团队核验和整理

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