EP3SE110F780C3 - Stratix III E FPGA 107.5K LE 780-FCBGA | Intel
料号： EP3SE110F780C3 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $320 | $320.00 |
| 10 | $295 | $2,950.00 |
| 100 | $268 | $26,800.00 |
| 500 | $245 | $122,500.00 |
| 1,000 | $220 | $220,000.00 |
EP3SE110F780C3 概述
An FPGA is a programmable logic device that lets designers implement custom digital circuits using configurable logic blocks, programmable interconnect, embedded memory blocks, DSP blocks, and high-speed transceivers. The Stratix III E family specifically optimizes the logic-to-memory-to-DSP ratio for memory-intensive and parallel-processing designs, making it well suited for ASIC prototyping, custom compute engines, and high-throughput image or video processing.
Key features include 107,500 logic elements, 4,300 LABs, 488 user I/Os, 8,936,448 embedded memory bits, and an integrated high-speed transceiver layer supporting multi-gigabit serial interfaces. The 780-ball FCBGA package exposes wide parallel banks and dedicated high-speed serial channels, enabling designs that require both broadband I/O and bulk storage on-chip. The commercial speed grade designation "C3" identifies a specific timing bin within the Stratix III E family, balancing cost against Fmax across the supported temperature range.
Stratix III E devices use a 65 nm TSMC process node with an architecture that combines adaptive logic modules (ALMs), TriMatrix embedded memory blocks, and DSP blocks. This combination enables efficient implementation of pipelined datapaths, large FIFOs, and high-throughput DSP filtering, with the transceiver and I/O circuitry supporting industry-standard serial protocols commonly used in communications, broadcast video, and test equipment.
Typical applications include high-end ASIC prototyping, high-speed image and video processing, telecommunications line cards, radar and signal-intelligence front ends, and test and measurement instrumentation. The combination of high logic density and substantial embedded memory makes it suitable for systems that require real-time buffering and parallel compute such as multi-channel baseband processing and software-defined radio front ends.
When designing with this device, ensure Quartus II software support for the C3 speed grade is used during synthesis and place-and-route to achieve published timing closure. Verify power budget and thermal solution against application note AN 471 by Intel, and provide a sufficient decoupling network across the FCBGA supply balls to meet simultaneous switching noise requirements.
This page synthesizes distributor pricing, drop-in alternatives, application guidance and design considerations not consolidated in the manufacturer datasheet, supporting faster part selection and supply-chain evaluation for engineering teams.
直接替换替代料： EP3SE110F780C3 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SE110F780C3 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Family, Embedded Memory, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EP3SE110F780C2
✅ 直接替换✓ 有现货
$4350 / 个
查看数据手册 →EP3SE110F780C3N
✅ 直接替换✓ 有现货
$1245 / 个
查看数据手册 →EP3SE110F780C2N
✅ 直接替换✓ 有现货
$305 / 个
查看数据手册 →EP3CLS70F780C8N
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →EP3CLS100F780C8N
✅ 直接替换✓ 有现货
$105.8 / 个
查看数据手册 →EP3SE110F780C3 最大额定值与电气特性
| Series | Stratix III E |
| Logic Elements | 107500 |
| Logic Array Blocks (LABs) | 4300 |
| Total Memory Bits | 8936448 |
| User I/O Count | 488 |
| 封装 | 780-BBGA, FCBGA |
| Number of Terminals | 780 |
| Package Code | BGA |
| Package Shape | Square |
| Form of Terminal | Ball |
| Temperature Grade | Other (Commercial) |
| Speed Grade | C3 |
| 安装类型 | Surface Mount |
EP3SE110F780C3 square 引脚配置指南
EP3SE110F780C3（square 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SE110F780C3.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SE110F780C3 适用于 6 应用s: ASIC Prototyping and Emulation, High-Throughput Image and Video Processing, Telecommunications Line Cards, Radar and Signal-Intelligence Front Ends, Test and Measurement Instrumentation, Software-Defined Radio Baseband.
ASIC Prototyping and Emulation
The EP3SE110F780C3 fits ASIC prototyping because its 107,500 logic elements, 8,936,448 embedded memory bits and 488 user I/Os provide the silicon area and I/O bandwidth required to map mid-complexity ASIC partitions in a single device. The Stratix III E architecture supports Quartus II partitioning flows, with design teams commonly mapping multi-million-gate ASICs by stitching together multiple Stratix III E devices. The 780-ball FCBGA exposes high-speed transceivers and wide parallel banks that mirror ASIC pin-count expectations, enabling realistic bring-up of DDR memory controllers and high-speed serial links alongside the prototyping workload.
推荐
High-Throughput Image and Video Processing
The EP3SE110F780C3 is well matched to image and video pipelines because its 8.9 Mbit of embedded memory acts as line buffers and frame stores for parallel datapaths, while the 4,300 LABs host the pixel-rate combinational logic. The 488 user I/Os allow wide parallel camera or display interfaces (LVDS, sub-LVDS, parallel CMOS) to be connected directly without external bus multiplexers, and the integrated DSP blocks accelerate filters, color-space conversions, and motion estimation. Compared with smaller Cyclone-family devices, the EP3SE110F780C3 doubles the available on-chip memory, eliminating the need for external SDRAM line buffers in many designs.
推荐
Telecommunications Line Cards
The EP3SE110F780C3 serves telecom line cards by combining high logic density with multi-gigabit transceivers and ample embedded memory for packet buffering, traffic shaping, and protocol adaptation. The 780-ball FCBGA exposes enough high-speed serial channels to support backplane interfaces such as CPRI, OBSAI or proprietary SERDES links, while the remaining I/Os handle parallel data paths to PHY devices, framers, and switch fabrics. Compared with newer Agilex devices it consumes more power, but its proven Stratix III E architecture remains a reliable choice for sustaining existing line-card deployments through their field life.
推荐
Radar and Signal-Intelligence Front Ends
The EP3SE110F780C3 is suited for radar and SIGINT front ends because its embedded DSP blocks, large TriMatrix memory and high-speed transceivers enable real-time FFT, channelization, and digital down-conversion on a single fabric. The 8,936,448 memory bits provide sample-rate buffering for ADC data streams at hundreds of MSPS, while the 488 user I/Os interface directly to ADC/DAC devices such as the ADS62P49 family without intermediate logic. Designers typically pair the FPGA with high-speed ADCs and DDR2/DDR3 memory for sustained real-time processing.
推荐
Test and Measurement Instrumentation
The EP3SE110F780C3 fits high-end test instruments because its 107,500 logic elements, abundant embedded memory and rich transceiver I/O enable deep pattern generation, protocol-aware analysis, and on-the-fly signal processing in a single chip. The 780-ball FCBGA exposes enough parallel I/Os to drive LCD/LED front panels, control analog front ends and capture high-bandwidth data simultaneously. Compared with a discrete logic implementation, the FPGA consolidates sequencing, DSP and protocol decoding into one device, simplifying board layout and reducing BOM cost for oscilloscope, logic-analyzer and protocol-analyzer products.
推荐
Software-Defined Radio Baseband
The EP3SE110F780C3 is a strong fit for software-defined radio baseband processing because its DSP blocks, large embedded memory and high-speed transceivers support multi-channel DDC/DUC, channel coding and rate adaptation in real time. The 488 user I/Os connect to RF front-end ADCs/DACs and CPRI/OBSAI links to remote radio heads, while the 8.9 Mbit of on-chip memory buffers symbol-rate data between DSP stages. Compared with DSP processors or GPUs, the FPGA delivers deterministic latency and substantially higher throughput per watt for parallel baseband workloads.
推荐
推荐产品汇总
工程参考数据： EP3SE110F780C3 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SE110F780C2 | EP3SE110F780C3N | EP3SE110F780C2N | EP3CLS70F780C8N | EP3CLS100F780C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FCBGA | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same |
| Logic Elements | 107500 | 107500 | 107500 | 107500 | 70000 | 100000 |
| Speed Grade | C3 | C2 | C3 | C2 | C8 | C8 |
| User I/O Count | 488 | 488 | 488 | 488 | 488 | 488 |
| Family | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Cyclone III LS | Cyclone III LS |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Active | Active |
关键差异点
- Highest logic density in the 780-ball FCBGA Stratix III E footprint （对比 EP3CLS100F780C8N)
- Faster C3 speed grade versus C8 in Cyclone III LS family （对比 EP3CLS100F780C8N)
- Backward-compatible drop-in speed grade options （对比 EP3SE110F780C2)
设计说明
The EP3SE110F780C3 Stratix III E device at full utilization can dissipate well over 10 W. According to the Stratix III Device Handbook, designers must attach a heatsink or thermal interface material to the FCBGA lid and provide sufficient airflow; confirm theta-JA against the actual PCB copper area around the BGA balls before locking the mechanical design. Estimated: assuming 12 W dissipation with 2 oz copper on inner layers, expect theta-JA in the 3-5 C/W range with a 1 m/s airflow.
The 780-ball FCBGA requires a high-density interconnect PCB with microvia stack-ups and matched length routing for the high-speed transceiver pairs. Place decoupling capacitors on both top and bottom layers immediately adjacent to the FCBGA balls, distributing 0.1 uF, 0.01 uF and bulk capacitors across the supply rails as recommended in the Stratix III pin-out guidelines. Use a 6-8 layer stack-up with continuous ground and power planes to control simultaneous switching noise.
Estimated: Quartus II software must be configured with the C3 speed grade model selected before synthesis, or timing closure will fail even when the silicon is correctly specified. Always regenerate the Stratix III E device library and run the Pin Planner import against the exact pin-out CSV downloaded from the Intel FPGA documentation portal - older Altera-format pin-outs occasionally mismatch newer silicon revisions.
合规信息
RoHS, REACH, lead-free and halogen-free status for EP3SE110F780C3 were not present in the verified web data and are marked as unknown. AEC-Q100 is not applicable because this is a commercial-grade FPGA in a BGA package, not an automotive-qualified part.