EP3SL340F1760C3 - Stratix III L FPGA, 337500 Cells, 1760-FBGA | Intel
料号： EP3SL340F1760C3 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $16850.17 | $16,850.17 |
| 5 | $15420 | $77,100.00 |
| 10 | $14280 | $142,800.00 |
| 25 | $13050 | $326,250.00 |
| 50 | $12480 | $624,000.00 |
EP3SL340F1760C3 概述
A field-programmable gate array (FPGA) is a programmable logic device that lets engineers implement arbitrary digital logic, memory, and DSP functions in silicon after fabrication. FPGAs sit above fixed-function ASICs in design flexibility and below microprocessors in programmability granularity, occupying a unique role in parallel processing pipelines. Within the Stratix III L sub-family, the 'L' suffix denotes the lower-static-power variant, optimized for power-sensitive applications while preserving the high-performance adaptive logic module (ALM) fabric. Stratix III devices support transceiver rates up to 6.375 Gbps, embedded transceivers, and hard IP for PCI Express Gen1/Gen2, depending on the die variant.
Key features include 337,500 logic elements, 18,822,144 RAM bits distributed across TriMatrix memory blocks, 1120 general-purpose I/O, integrated DSP blocks with up to 224 GMACs of throughput, and a high-speed serial interface supporting multi-gigabit transceivers. The 1760-pin FC-FBGA package provides ample signal headroom for parallel buses and memory interfaces common in image processing and telecom line-card designs. Industrial design tools such as Intel Quartus Prime provide synthesis, place-and-route, and timing closure for the device, with pre-verified IP cores available for DDR2/DDR3 memory controllers, PCIe, and Ethernet MACs.
Architecturally, the EP3SL340F1760C3 employs a logic-array block (LAB) structure composed of adaptive logic modules (ALMs) with eight inputs and dedicated carry chains for arithmetic operations. The 65 nm process node balances leakage and dynamic power, while the 'L' designation specifically targets reduced static power consumption. The device integrates PLLs, high-speed serial interface channels, and dedicated hardware multipliers for DSP, simplifying complex SoC designs and reducing external component count.
Typical applications include high-speed image processing, telecom line cards, military and aerospace signal processing, ASIC prototyping, and high-performance DSP compute engines. The combination of 337,500 logic elements and 1120 I/O suits designs requiring many parallel interfaces.
When designing with this FPGA, ensure proper power-rail sequencing and adequate decoupling per Quartus Prime power-supply design guidelines. The large FC-FBGA package requires multi-layer PCB stack-up with controlled-impedance routing and matched-length traces for DDR memory interfaces.
直接替换替代料： EP3SL340F1760C3 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SL340F1760C3 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Embedded Memory Bits, Core Voltage.
快速对比工具——选择替代料号进行并排对比：
EP3SL340F1760C2
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$18500 / 个
查看数据手册 →EP3SL340F1760I3
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1450 / 个
查看数据手册 →EP3SL340F1760C4N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1820 / 个
查看数据手册 →EP3SE260F1517I3N
✅ 直接替换✓ 有现货
$2275 / 个
查看数据手册 →EP3SE260F1152I3N
✅ 直接替换✓ 有现货
$3360 / 个
查看数据手册 →EP3SL340F1760C3 最大额定值与电气特性
| Family | Stratix III L |
| Logic Elements | 337,500 |
| Embedded Memory (bits) | 18,822,144 |
| Maximum User I/O | 1120 |
| Maximum Operating Frequency | 717 MHz |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.1 V |
| 封装 | 1760-ball FC-FBGA |
| Speed Grade | C3 |
| 工作温度 | Commercial (0C to +85C) |
| 安装类型 | Surface Mount |
| Family Variant | Stratix III L (low static power) |
| RoHS 状态 | Compliant |
| Total Memory Bits | 18822144 |
| IC Function | Field Programmable Gate Array (FPGA) |
EP3SL340F1760C3 1760-ball fc-fbga 引脚配置指南
EP3SL340F1760C3（1760-ball fc-fbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SL340F1760C3.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SL340F1760C3 适用于 6 应用s: ASIC Prototyping and Emulation, Telecom Line Card Signal Processing, High-Speed Image Processing Pipelines, Military and Aerospace Signal Processing, High-Performance DSP Compute Engines, Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP3SL340F1760C3's 337,500 logic elements and 18,822,144 bits of embedded memory make it an excellent platform for ASIC prototyping and emulation. Engineers map complex ASIC RTL designs onto the Stratix III L fabric, taking advantage of the abundant ALM resources, dedicated DSP blocks, and 1120 user I/O. The 1760-ball FC-FBGA package provides signal integrity for multi-clock-domain emulation. Compared to smaller FPGAs, the EP3SL340F1760C3 supports full-chip emulation of mid-complexity ASICs without partitioning, dramatically accelerating pre-silicon validation and software bring-up.
推荐
Telecom Line Card Signal Processing
The EP3SL340F1760C3 fits telecom line-card designs requiring packet processing, traffic management, and high-throughput I/O aggregation. With 1120 user I/O and 337500 logic elements, the device can host multiple SERDES lanes, packet classifiers, and QoS engines. The 65 nm Stratix III L process provides low static power suited for dense line-card chassis. Combined with hard PCIe Gen1/Gen2 IP, the FPGA integrates host interface and framer functions, reducing board complexity and BOM cost compared to processor-plus-ASIC solutions.
推荐
High-Speed Image Processing Pipelines
The 337500 logic elements, embedded TriMatrix memory, and 1120 user I/O make the EP3SL340F1760C3 suitable for image-processing pipelines including video format conversion, real-time filtering, and multi-channel surveillance aggregation. The dedicated DSP blocks deliver up to 224 GMACs of throughput, sufficient for HD video scaling and chroma resampling. The 1760-FBGA package accommodates wide parallel sensor interfaces. Compared to GPU-based solutions, the FPGA delivers deterministic low-latency processing required for industrial vision and machine-vision systems.
推荐
Military and Aerospace Signal Processing
The EP3SL340F1760C3 supports military and aerospace signal-processing applications including radar front-end processing, software-defined radio baseband, and electronic warfare subsystems. While the C3 commercial speed grade limits operating temperature, designs using industrial-grade EP3SL340F1760I3 share the same die. The high logic density supports real-time FFT, beamforming, and adaptive filtering. Combined with on-chip transceivers and DSP blocks, the FPGA replaces multiple DSP chips in legacy radar architectures, reducing SWaP-C.
推荐
High-Performance DSP Compute Engines
The EP3SL340F1760C3 integrates dedicated DSP blocks supporting up to 224 GMACs of throughput, ideal for high-performance compute engines running FFT, FIR filtering, encryption, and matrix operations. The 18,822,144 bits of embedded memory provide high-bandwidth data storage for streaming DSP workloads. Designers can implement multi-channel FFT pipelines, real-time encryption cores, and convolutional neural network accelerators. The 'L' suffix indicates low static power, beneficial for dense compute farms where power and cooling are constrained.
推荐
Test and Measurement Instrumentation
The EP3SL340F1760C3 supports test and measurement instrumentation such as protocol analyzers, logic analyzer backends, and arbitrary waveform generators. The 1120 user I/O accommodate parallel probe interfaces, while the 337500 logic elements and 18 Mbit memory enable deep capture buffers and pattern generators. The 717 MHz fMAX supports high-speed serial protocol decoding (PCIe, SATA, USB 3.0). Combined with hard PCIe IP, the FPGA streams captured data directly to host PCs at multi-gigabit rates, reducing test time and improving throughput.
推荐
推荐产品汇总
工程参考数据： EP3SL340F1760C3 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SL340F1760C2 | EP3SL340F1760I3 | EP3SL340F1760C4N | EP3SE260F1517I3N | EP3SE260F1152I3N |
|---|---|---|---|---|---|---|
| Package | 1760-ball FC-FBGA | 1760-ball FC-FBGA - same | 1760-ball FC-FBGA - same | 1760-ball FC-FBGA - same | 1517-ball FC-FBGA - different | 1152-ball FC-FBGA - different |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix IV E | Stratix IV E |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | ~254,000 | ~254,000 |
| Speed Grade | C3 | C2 | I3 | C4 | I3 | I3 |
| Temperature Grade | Commercial | Commercial | Industrial | Commercial | Industrial | Industrial |
| Maximum User I/O | 1120 | 1120 | 1120 | 1120 | ~888 | ~744 |
| Embedded Memory (bits) | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 | ~14,688,000 | ~14,688,000 |
关键差异点
- Highest density in the Stratix III L family at 337500 LE （对比 EP3SE260F1517I3N (Stratix IV E))
- 1120 user I/O with 1760-ball FC-FBGA （对比 EP3SE260F1152I3N (1152-FBGA))
- Stratix III L low-static-power 65 nm process （对比 EP3SE260F1517I3N (Stratix IV E))
设计说明
Estimated: At typical Stratix III L operating power of approximately 8-12 W for the EP3SL340F1760C3, the 1760-ball FC-FBGA requires a thermal management solution. With theta_JA in the range of 8-12 C/W for this large BGA, junction temperature rise above ambient can reach 100C without airflow. Designers should implement a heatsink with thermal interface material or forced-air cooling for sustained operation, and follow Quartus Prime thermal-modeling reports for junction temperature estimation.
The 1760-ball FC-FBGA package requires a multi-layer PCB stack-up with microvia technology and controlled-impedance routing. Use a high-density interconnect (HDI) process with stacked microvias to break out all signal balls, and provide at least 4 PCB layers dedicated to ground planes for return-path integrity. Matched-length traces are essential for DDR memory interfaces, with length-matching tolerance per the Stratix III Device Handbook DDR3 guidelines.
Do not exceed the absolute maximum core voltage of 1.15 V or I/O voltage limits per the Stratix III handbook. Always program the device through the JTAG or Active Serial configuration interface before applying full power, and provide proper power-rail sequencing (1.1 V core before 1.5 V/1.8 V/2.5 V/3.3 V I/O). Quartus Prime software generates per-design pin assignments and power-rail sequencing scripts.
Place decoupling capacitors as close as possible to every power pin, with bulk decoupling (10uF to 100uF) distributed across the board. Isolate high-speed SERDES regions with their own ground-return paths to minimize crosstalk. Per the Stratix III Device Handbook, all PLL analog supply pins require dedicated filtering with ferrite beads and decoupling to achieve low jitter performance.
合规信息
RoHS compliant per Intel product page. Not AEC-Q100 qualified (FPGA not for direct automotive qualification). Halogen-free per Intel FPGA packaging specifications.
