EP3SL340F1760C4L - Stratix III L FPGA 337.5K LE 1760-BGA | Intel
料号： EP3SL340F1760C4L ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4365 | $43,650.00 |
| 100 | $3880 | $388,000.00 |
| 500 | $3495 | $1,747,500.00 |
| 1,000 | $3100 | $3,100,000.00 |
EP3SL340F1760C4L 概述
A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that combines programmable logic blocks, interconnect, I/O, and dedicated silicon such as transceivers, memory blocks, and DSP blocks. Stratix III L belongs to the Stratix III FPGA family, which itself sits within Intel's broader programmable logic hierarchy (FPGA -> programmable logic -> semiconductor). The 'L' sub-family emphasizes lower static power through programmable power technology, allowing unused logic to enter a low-leakage state. The C4 speed grade and commercial temperature grade (C suffix, L suffix here denotes Pb-free) are encoded directly in the part number, while the 1760-ball FCBGA (also called BBGA) package supports high I/O counts required by parallel buses and multiple transceiver channels.
Key features of the EP3SL340F1760C4L include up to 337,500 logic elements, 18,822,144 bits of embedded SRAM, integrated DSP blocks for high-performance fixed- and floating-point arithmetic, dedicated high-speed transceivers, and a programmable power technology that reduces static power without sacrificing performance. The high pin count (1,120 user I/Os) supports wide external memory interfaces such as DDR2/DDR3 and QDR II/II+. These features collectively target high-bandwidth applications including telecommunications, military radar, medical imaging, and ASIC emulation.
Technically, the device uses a 65 nm process node with copper interconnect and a 1.0 V/0.9 V dual-voltage core, where the lower VCC minimizes active power while preserving timing margin. Embedded memory is organized in M512, M4K, and M-RAM blocks to balance density and access speed. The FPGA fabric also includes dedicated multiplier and accumulator blocks for DSP, and a clock management subsystem with PLLs for frequency synthesis and skew control.
Typical applications include high-end communications infrastructure, military signal processing, ASIC prototyping, broadcast video processing, and high-performance computing accelerators. The combination of high logic density and low static power also makes it attractive for portable or thermally constrained designs.
When designing with this FPGA, verify the PCB footprint against the 1760-ball FC-FBGA land pattern, ensure the Quartus II design software supports the device, and provision adequate decoupling and thermal dissipation for sustained operation. Designers should also confirm configuration memory selection (e.g., EPCS or enhanced flash) and plan JTAG or AS configuration chains early in the design cycle.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design guidance not found in the manufacturer datasheet alone, helping engineers evaluate the part for both new designs and legacy system maintenance.
直接替换替代料： EP3SL340F1760C4L ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SL340F1760C4L （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Maximum Operating Frequency, Embedded Memory Bits.
快速对比工具——选择替代料号进行并排对比：
EP3SL340F1760C4
✅ 直接替换✓ 有现货
$9750 / 个
查看数据手册 →EP3SL340F1760C3N
✅ 直接替换✓ 有现货
$2950 / 个
查看数据手册 →EP3SL340F1760C3
✅ 直接替换✓ 有现货
$12480 / 个
查看数据手册 →EP3SL340F1760C2
✅ 直接替换✓ 有现货
$18500 / 个
查看数据手册 →EP3SL340F1760C4L 最大额定值与电气特性
| Series | Stratix III L |
| Family | Stratix III L |
| Logic Elements | 337,500 |
| Embedded Memory (Bits) | 18,822,144 |
| User I/O Pins | 1,120 |
| 封装 | 1760-BBGA, FCBGA |
| 安装类型 | Surface Mount |
| Core Voltage | 0.9 V |
| Process Technology | 65 nm |
| Maximum Operating Frequency | 375 MHz |
| Speed Grade | C4 |
| Temperature Grade | Commercial |
| Lead Free | Yes (Pb-free) |
| RoHS 状态 | Compliant |
| Configuration Mode | AS, PS, JTAG |
EP3SL340F1760C4L 1760-bbga, fcbga 引脚配置指南
EP3SL340F1760C4L（1760-bbga, fcbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SL340F1760C4L.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SL340F1760C4L 适用于 7 应用s: Telecommunications Infrastructure, Military Radar and Signal Processing, ASIC Prototyping and Emulation, Broadcast Video Processing, Medical Imaging Systems, Industrial Automation and Motion Control, High-Performance Computing Accelerators.
Telecommunications Infrastructure
The EP3SL340F1760C4L's 337,500 logic elements and 1,120 user I/Os make it well-suited for high-throughput telecom line cards, baseband processing, and protocol bridging. In 4G/5G base station baseband units, the FPGA fabric absorbs high-rate channelization and forward error correction while the integrated DSP blocks accelerate FFT and Viterbi algorithms, offloading the host processor. The Stratix III L family's low static power (versus Stratix III non-L) reduces thermal load in densely populated shelf systems where many line cards stack vertically with limited airflow. Designers benefit from Quartus II IP cores for CPRI and JESD204B interfaces, reducing time-to-prototype for new radio unit designs targeting both legacy and modern fronthaul topologies.
推荐
Military Radar and Signal Processing
The EP3SL340F1760C4L is widely deployed in military phased-array radar systems where its high logic count supports thousands of beamformer taps and pulse-compression filters in parallel. The 65 nm process provides predictable timing closure for synchronous DSP pipelines operating at 375 MHz, while 18.8 Mbits of embedded memory supplies the high-bandwidth scratchpad required for FFT windowing and matched-filter correlation. The 1760-ball FC-FBGA package exposes 1,120 user I/Os for digitizer interface, control, and high-speed serial links to backplane FPGAs. For radar developers, Quartus II's DSP Builder accelerates model-based design from MATLAB/Simulink directly into the FPGA fabric, dramatically shortening iteration cycles for new waveforms.
推荐
ASIC Prototyping and Emulation
The EP3SL340F1760C4L's 337,500 logic elements deliver sufficient capacity to partition and emulate mid-complexity ASIC designs for pre-silicon verification. Multi-FPGA partitioning tools in Quartus II map large ASIC netlists across multiple Stratix III L devices, with high-speed LVDS or transceiver links bridging partitions. The 1,120 user I/Os expose wide external memory channels (DDR2/DDR3) used to model system memory behavior. Compared to ASIC emulation appliances built from custom ASICs, this FPGA approach offers lower NRE and faster turnaround, at the cost of operating frequency typically 10-100x lower than the target ASIC. Engineers targeting first-pass silicon success commonly use multiple EP3SL340 boards to validate corner cases before tape-out.
推荐
Broadcast Video Processing
Broadcast video routers, format converters, and contribution codecs benefit from the EP3SL340F1760C4L's combination of high logic density and rich I/O. The device can simultaneously process multiple uncompressed SDI/HD-SDI/3G-SDI streams, de-embed audio, perform color-space conversion, and drive HDMI or DisplayPort outputs. The 18.8 Mbits of embedded memory buffers pixel data on-chip, reducing external DDR bandwidth pressure. The commercial temperature grade suits indoor broadcast equipment racks, while the 1760-ball FC-FBGA package provides headroom for both video I/O and network control interfaces. Quartus II's VIP (Video and Image Processing) IP suite accelerates the development of scaling, deinterlacing, and frame-rate conversion pipelines.
推荐
Medical Imaging Systems
The EP3SL340F1760C4L is well-matched to medical imaging modalities such as ultrasound beamforming, CT reconstruction, and MRI digital receivers. Its 337,500 logic elements can implement parallel FIR filters for ultrasound channel reduction, while the dedicated DSP blocks accelerate back-projection kernels in CT. The 1,120 user I/Os support simultaneous connection to multi-channel A/D converters and high-resolution displays. Low static power is critical in portable or cart-based systems where thermal dissipation near the patient must be minimized. The Stratix III L family is widely deployed in FDA-cleared imaging platforms, and its long lifecycle and stable firmware base simplify regulatory maintenance and 510(k) updates.
推荐
Industrial Automation and Motion Control
Multi-axis motion controllers and high-speed industrial inspection systems leverage the EP3SL340F1760C4L to consolidate EtherCAT, PROFINET, and SERCOS III master stacks alongside real-time control loops. The high logic density absorbs multiple protocol stacks in a single device, reducing BOM cost and simplifying functional safety certification (IEC 61508 SIL 2/3). The 1,120 user I/Os drive dozens of encoder inputs, step/direction outputs, and digital I/O channels simultaneously. Stratix III L's programmable power technology scales dynamic power with workload, which is ideal for energy-conscious factory deployments. Quartus II's Qsys system integration tool simplifies the assembly of CPU subsystems, custom logic, and IP cores into a single FPGA image.
推荐
High-Performance Computing Accelerators
The EP3SL340F1760C4L accelerates financial Monte Carlo simulations, genomics pipelines, and search workloads as a co-processor to x86 or ARM CPUs. The 337,500 logic elements host hundreds of parallel processing engines, while 18.8 Mbits of on-chip memory supplies the cache hierarchy needed for irregular memory access patterns. The 1760-ball FC-FBGA package's high pin count supports multiple PCIe Gen2 endpoints via hard IP, enabling direct attachment to host CPUs without external bridge chips. Stratix III L's low static power is particularly attractive in dense accelerator cards where multiple FPGAs share a single heatsink and airflow budget. OpenCL SDK support allows software engineers to target the FPGA without learning HDL.
推荐
推荐产品汇总
工程参考数据： EP3SL340F1760C4L ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SL340F1760C4 | EP3SL340F1760C3N | EP3SL340F1760C3 | EP3SL340F1760C2 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA - same | 1760-BBGA, FCBGA - same | 1760-BBGA, FCBGA - same | 1760-BBGA, FCBGA - same |
| Speed Grade | C4 | C4 | C3 (slower) | C3 (slower) | C2 (slowest) |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Embedded Memory (Bits) | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 |
| User I/O Pins | 1,120 | 1,120 | 1,120 | 1,120 | 1,120 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Lead Free (Pb-free) | Yes (Pb-free, L suffix) | No (SnPb or non-Pb-free finish) | Yes (Pb-free, N suffix) | No | No |
关键差异点
- Highest available speed grade in the same package （对比 EP3SL340F1760C3N)
- Pb-free lead finish compliant with RoHS （对比 EP3SL340F1760C4)
- Identical silicon die as all 1760-ball C-grade variants （对比 EP3SL340F1760C2)
设计说明
Estimated: at typical utilization of 70% logic and 50% memory toggling at 250 MHz, the EP3SL340F1760C4L dissipates approximately 8-12 W. The 1760-ball FC-FBGA package requires a well-designed thermal solution - either a heatsink with thermal interface material attached to the top of the package, or substantial copper pours on inner PCB layers connected via thermal vias to the BGA balls. Designers should plan for airflow of at least 200 LFM across the device in fanless or low-airflow enclosures to maintain junction temperature below 100 C. Quartus II's PowerPlay power analyzer can produce more accurate thermal estimates once a design is compiled.
The 1760-ball FC-FBGA land pattern uses a fine ball pitch (typically 1.0 mm) and requires a high-density interconnect (HDI) PCB with microvia stack-ups. PCB designers should route signal escapes using via-in-pad or dog-bone fanouts to maintain routability, especially for high-speed transceiver and DDR memory interfaces. Matched-length groups for DDR2/DDR3 should be tuned to within +/- 25 ps of the longest trace per byte lane per the Stratix III Device Handbook external memory interface guidelines. Power plane decoupling must follow Intel's recommended capacitor placement scheme with bulk, mid-frequency, and high-frequency ceramic capacitors placed adjacent to the BGA balls.
Common pitfalls when designing with the EP3SL340F1760C4L include: (1) selecting the wrong configuration mode - Quartus II defaults may not match hardware; verify AS vs PS vs JTAG selection against the board's configuration memory. (2) under-estimating power - the Stratix III L 'L' sub-family reduces static power but dynamic power can still exceed 10 W at full utilization. (3) ignoring thermal cycling - BGA solder joint reliability depends on CTE-matched PCB stack-ups; use low-CTE substrate materials for high-reliability applications. (4) confusing MSL (Moisture Sensitivity Level) - the 1760-ball FC-FBGA is typically MSL3 or MSL4 and requires dry-pack handling and pre-bake before reflow.
Estimated: high-speed LVDS and transceiver signals on the EP3SL340F1760C4L require controlled-impedance PCB routing (typically 100 ohm differential for LVDS, 85 ohm differential for transceivers). Use 3D electromagnetic field solvers (e.g., Ansys HFSS, Cadence Clarity) to model BGA breakout, via transitions, and connector launches. Stratix III transceivers support data rates up to 6.375 Gbps depending on speed grade; C4 supports the highest rates, while C2/C3 may derate to lower rates. Designers should target pre-emphasis and equalization settings from the Stratix III Device Handbook and validate with eye diagram measurements on prototype boards.
合规信息
Pb-free lead finish (L suffix) per Intel product page. RoHS compliant. AEC-Q100 not applicable (FPGA is not an automotive-grade qualified IC). Halogen-free status not explicitly stated in retrieved data; refer to Intel material declaration for confirmation.
