EP3SL70F780I4G - Stratix III L FPGA 67.5K LE, 488 I/O, 780-FBGA
料号： EP3SL70F780I4G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 50 | $1620 | $81,000.00 |
| 100 | $1540 | $154,000.00 |
| 250 | $1455 | $363,750.00 |
EP3SL70F780I4G 概述
A Field Programmable Gate Array (FPGA) is a programmable logic device that uses an array of configurable logic blocks (CLBs), programmable routing, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy a position in the system hierarchy between discrete logic/microcontrollers and ASICs: they offer far higher parallelism and throughput than a microcontroller, and far lower non-recurring engineering (NRE) cost than an ASIC. The Stratix III L variant is optimized for low static and dynamic power versus the standard Stratix III family, allowing denser boards without exceeding thermal envelopes.
Key features of the EP3SL70F780I4G include the 780-ball FineLine BGA package supporting 488 user I/Os, 67,500 logic elements, 2,699,264 embedded memory bits, a core architecture built on TSMC's 40nm process, and industrial-grade operation. The 780-FBGA FineLine BGA footprint enables vertical migration across Stratix III L densities within the same package outline, simplifying PCB reuse between EP3SL50, EP3SL70, and EP3SL110 devices.
Typical applications include high-performance DSP co-processing, ASIC prototyping, video broadcast infrastructure, software-defined radio front-ends, and high-speed serial protocol bridging. The high logic-element count combined with embedded memory and DSP blocks makes it well suited to parallel filter banks, FFT pipelines, and multi-channel baseband processing.
When designing with this device, allocate FPGA I/O banks to voltage domains before pin assignment, and follow Intel/Altera's decoupling and PCB stack-up guidelines for the 780-FBGA package. Vertical migration within the 780-pin package allows board reuse across EP3SL50/EP3SL70/EP3SL110 densities without PCB rework, reducing platform cost. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： EP3SL70F780I4G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SL70F780I4G （相同外形与封装尺寸） ——差异在于 Package, Logic Elements, Speed Grade, Embedded Memory, Process Technology.
快速对比工具——选择替代料号进行并排对比：
EP3SL70F780I4
✅ 直接替换✓ 有现货
$1850 / 个
查看数据手册 →EP3SL70F780I3G
✅ 直接替换✓ 有现货
$990 / 个
查看数据手册 →EP3SL70F780C4G
✅ 直接替换✓ 有现货
$835 / 个
查看数据手册 →EP3SL50F780I4G
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →EP3SL110F780I4G
✅ 直接替换📋 参考替代料（不在目录中）
EP3SE80F780I4N
✅ 直接替换✓ 有现货
$3400 / 个
查看数据手册 →EP3SE50F780I4G
✅ 直接替换✓ 有现货
$1320 / 个
查看数据手册 →EP3SL70F780I4G 最大额定值与电气特性
| Family | Stratix III L |
| Series | EP3SL70 |
| Logic Elements | 67,500 |
| Embedded Memory Bits | 2,699,264 |
| User I/O Count | 488 |
| 封装 | 780-ball FineLine BGA (FBGA) |
| 安装类型 | Surface Mount (BGA) |
| 工作温度范围 | -40C to +100C (Industrial) |
| Speed Grade | I4 (Industrial, mid-speed) |
| Process Technology | TSMC 40 nm |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
| MSL 等级 | 3 (168 hours) |
EP3SL70F780I4G 780-ball fineline bga (fbga) 引脚配置指南
EP3SL70F780I4G（780-ball fineline bga (fbga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SL70F780I4G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SL70F780I4G 适用于 6 应用s: High-Performance DSP Co-Processing, ASIC Prototyping and Emulation, Video Broadcast Infrastructure, Software-Defined Radio (SDR) Front-End, High-Speed Serial Protocol Bridging, Industrial Test & Measurement Equipment.
High-Performance DSP Co-Processing
The EP3SL70F780I4G's 67,500 logic elements combined with embedded DSP blocks and 2,699,264 bits of block RAM make it a strong fit for DSP co-processing engines. In radar and telecom baseband designs, the device hosts multi-channel FFT pipelines, FIR filter banks, and digital down-converters operating at hundreds of MSPS. The 780-FBGA package's 488 user I/Os provide ample parallel LVDS/CMOS interconnect to companion ADC and DAC devices, while the 40 nm Stratix III L process keeps dynamic power lower than the standard Stratix III family.
推荐
ASIC Prototyping and Emulation
The EP3SL70F780I4G is widely deployed as a single-FPGA or multi-FPGA ASIC prototyping vehicle. Its 67,500 LEs, abundant block RAM, and Quartus II/III design flow allow engineers to map moderate ASIC netlists directly into the device with minimal partitioning. Industrial-grade temperature support (-40C to +100C) means the same board can be used for lab bring-up and field trials. The 780-FBGA FineLine BGA footprint is shared with EP3SL50 and EP3SL110, enabling density scaling without board rework.
推荐
Video Broadcast Infrastructure
Broadcast video routers, multi-format converters, and SDI-over-IP bridges benefit from the EP3SL70F780I4G's parallel processing capability and high I/O count. The 488 user I/Os support multiple SDI/HDMI/SMPTE 2022 streams in parallel, while the embedded memory buffers multiple video frames simultaneously. The I4 industrial speed grade offers the timing margin needed for long-trace FR4 backplanes, and the 780-FBGA's thermal envelope accommodates sustained broadcast workloads with standard airflow.
推荐
Software-Defined Radio (SDR) Front-End
Software-defined radio platforms place the EP3SL70F780I4G between wideband ADCs and host processors to perform channelization, decimation, and modulation/demodulation. The 67,500 LEs and dedicated DSP blocks enable parallel polyphase filter banks and digital up/down conversion at sample rates above 100 MSPS. The industrial temperature grade and 780-FBGA package suit outdoor base-station and military SDR deployments where vibration and thermal stress are routine.
推荐
High-Speed Serial Protocol Bridging
The EP3SL70F780I4G can act as a custom protocol bridge between PCIe, Serial RapidIO, SATA, and 10G Ethernet domains in telecom and storage equipment. Its combination of general-purpose I/Os, embedded transceivers, and block RAM provides the elasticity to manage multiple lane widths and packet sizes. Industrial-grade operation permits deployment in telco central offices and edge-node enclosures.
推荐
Industrial Test & Measurement Equipment
Modular oscilloscope, logic analyzer, and protocol exerciser platforms use the EP3SL70F780I4G to manage high-speed acquisition channels and pattern generation. Its 488 user I/Os support wide parallel front-ends, while the embedded memory buffers deep captures before offload to a host processor. The -40C to +100C industrial range suits factory-floor and field-test deployment where temperature extremes are routine.
推荐
推荐产品汇总
工程参考数据： EP3SL70F780I4G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SL70F780I4 | EP3SL70F780I3G | EP3SL70F780C4G | EP3SL50F780I4G | EP3SL110F780I4G |
|---|---|---|---|---|---|---|
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 67,500 | 67,500 | 67,500 | 47,500 (-30%) | 107,500 (+59%) | 79,500 (+18% Stratix III E) |
| Speed Grade | I4 (Industrial) | I4 (Industrial) | I3 (Industrial, faster) | C4 (Commercial) | I4 (Industrial) | I4 (Industrial) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | |
| Embedded Memory (bits) | 2,699,264 | 2,699,264 | 2,214,144 (-18%) | 4,097,664 (+52%) | 3,153,408 (+17%) | |
| User I/Os | 488 | 488 | 488 (same package) | 488 (same package) | ||
| Family Variant | Stratix III L (low power) | Stratix III L | Stratix III E (enhanced DSP/memory) | Stratix III E |
关键差异点
- Vertical migration path within 780-FBGA （对比 EP3SL50F780I4G)
- Higher LE count than Stratix III E entry-level （对比 EP3SE50F780I4G)
- Industrial-grade speed grade at full density （对比 EP3SL70F780C4G)
设计说明
The 780-ball FineLine BGA has a relatively small die-to-package ratio, so for sustained high-utilization workloads (>70% LE toggle rate, hot climate, sealed enclosure) design with a thermal pad and per-ball ground/power via array. Use Intel/Altera's thermal model for Stratix III L to estimate theta_JA against your PCB stack-up. Forced airflow of 200-300 LFM is recommended for industrial-grade continuous operation at full I/O utilization.
Use the Stratix III Device Family Overview (stx3_siii51001) as the authoritative reference for the 780-FBGA ball map and recommended PCB stack-up. Decoupling requirements call for multiple bulk capacitors and a dense network of 0402/0201 ceramics under the device's power rails; place them on the bottom side of the PCB if BGA breakout density forces routing on the top. Maintain solid reference planes beneath all high-speed signal traces.
Take advantage of vertical migration across the 780-FBGA: route the board once and populate EP3SL50, EP3SL70, or EP3SL110 based on capacity needs. Verify dedicated-pin, configuration-pin, and power-pin compatibility across all SKUs in your BOM. Pin-swappable I/O banks must be assigned to the same voltage domain across all target devices, otherwise bank re-assignment is required.
Do not mix Stratix III L and Stratix III E SKUs on the same board without re-validating timing closure and IP support - although they share the same 780-FBGA footprint, the E variant has enhanced DSP/memory resources that may change Quartus fitter results. Always cross-check Quartus pin assignment files before tape-out and confirm the chosen speed grade (I4/I3/C4) meets timing across all corners before committing to a build.
合规信息
RoHS and lead-free compliance from Intel/Altera product page. AEC-Q100 is not applicable to FPGAs; automotive applications should use AEC-Q100-qualified parts. Halogen-free status not stated in provided data.
