Intel

EP4CE10E22C8 - 10K LE Cyclone IV E FPGA, 144-LQFP | Intel

料号: EP4CE10E22C8 ✓ 量产中
有现货 1-3 个工作日内发货
1.2 V Vdss 144-pin EQFP (E22), exposed pad, 22x22 mm Package C8 (commercial) Speed 414 Kbits (M9K blocks) Memory
低至 $9.75 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-21
批量定价
数量 单价 小计
1 $18.5 $18.50
10 $16.2 $162.00
100 $13.85 $1,385.00
500 $11.4 $5,700.00
1,000 $9.75 $9,750.00
ℹ️ 所有价格均以 USD 计价

EP4CE10E22C8 概述

The Intel (Altera) EP4CE10E22C8 is a low-power, low-cost Cyclone IV E FPGA featuring 10,320 logic elements housed in a 144-pin EQFP (E22) exposed-pad LQFP package. Built on a 60 nm process node, it integrates 414 Kbits of embedded RAM, 23 embedded 18x18 multipliers, two PLLs, and 91 user I/O pins, making it a versatile general-purpose logic device for cost-sensitive and power-constrained designs.

A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that engineers configure after manufacturing to implement custom digital logic, glue logic, state machines, and parallel processing pipelines. Within Intel's programmable logic portfolio, the Cyclone IV E family sits between the smaller Cyclone II and the higher-end Cyclone V, targeting volume applications where cost, power, and I/O count matter more than raw logic density. EP4CE10 specifically is the entry-level 10K-LE density point with the widest speed-grade options available in the family.

Key features include support for DDR/DDR2/QDRII+ external memory interfaces via soft IP, dedicated hardware multipliers suitable for DSP signal processing, and a 1.2 V core supply with multi-voltage I/O banks supporting 1.2 V to 3.3 V standards. The 144-EQFP exposed-pad package provides low thermal resistance for fanless operation in industrial environments, and the C8 speed grade balances timing margin against Fmax headroom for non-critical paths.

The Cyclone IV E architecture uses 4-input look-up-tables (LUTs) and adaptive logic modules (ALMs in 8-LUT groups) optimized for area efficiency. Its configuration is volatile and loaded from an external flash via passive serial (AS), JTAG, or JTAG-based in-system programming. Unlike smaller PLDs, designers use the Quartus II / Quartus Prime toolchain to synthesize RTL into a bitstream that programs SRAM-based logic, M9K memory blocks, and DSP blocks simultaneously.

Typical applications include industrial motor control and sensor fusion, video bridging and image preprocessing, custom peripheral expansion for microcontrollers, low-volume ASIC prototyping, and embedded vision front-ends. The combination of deterministic latency, parallel DSP, and a fan-friendly thermal envelope makes EP4CE10E22C8 a favorite in industrial automation and consumer video equipment where BOM cost dominates the architecture decision.

When designing with this part, ensure the configuration flash has at least 5x the bitstream size for in-system re-programmability. Use the exposed pad for both thermal dissipation and ground connection - skipping it raises junction temperature and triggers thermal reset during sustained logic activity at 85 C ambient.

This page synthesizes distributor pricing, drop-in alternative cross-references, and practical design notes not found in the manufacturer datasheet alone.

直接替换替代料: EP4CE10E22C8 ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: EP4CE10E22C8 (相同外形与封装尺寸) ——差异在于 Configuration Mode, Family, Operating Temperature, Package, RoHS Status.

Intel
Configuration Mode: JTAG / AS / AP / PS
Family: EP4CE10
Operating Temperature: 0C to +85C
对比 EP4CE10E22C8 →

快速对比工具——选择替代料号进行并排对比:

EP4CE10E22C8N

✅ 直接替换 ⚠️ 规格未核验
Intel
📦 144-EQFP (E22)
Cyclone IV E · EP4CE10 · 10,320 · 46 · 414 Kbit · 91 · 144 · 144-LQFP Exposed Pad (E22)

✓ 有现货

$11.1 / 个

查看数据手册 →

EP4CE10E22I7N

✅ 直接替换 ⚠️ 规格未核验
📦 144-EQFP (E22)
industrial grade -40C to +100C (vs 0C/+85C) and speed grade 7 (slower than 8); pin-to-pin compatible, same 10,320 LEs

📋 参考替代料(不在目录中)

EP4CE10E22A7N

✅ 直接替换 ⚠️ 规格未核验
📦 144-EQFP (E22)
automotive grade (AEC-Q100), speed grade 7; otherwise identical silicon and pinout

📋 参考替代料(不在目录中)

EP4CE10E22C7N

✅ 直接替换 ⚠️ 规格未核验
📦 144-EQFP (E22)
speed grade 7 (slightly slower) and lead-free; same 10,320 LEs, identical footprint

📋 参考替代料(不在目录中)

EP4CE10E22C6N

✅ 直接替换 ⚠️ 规格未核验
📦 144-EQFP (E22)
speed grade 6 (slowest), lead-free finish; same silicon, pinout, and 10,320 LEs - upgrade path for timing closure

📋 参考替代料(不在目录中)

EP4CE10E22C8 最大额定值与电气特性

Family Cyclone IV E
Device Family EP4CE10
Logic Elements (LEs) 10,320
Embedded Memory 414 Kbits (M9K blocks)
Embedded 18x18 Multipliers 23
PLLs 2
Maximum User I/O 91
Core Voltage 1.2 V
I/O Voltage Support 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V
Process Node 60 nm
Speed Grade C8 (commercial)
工作温度 0 C to +85 C (commercial)
封装 144-pin EQFP (E22), exposed pad, 22x22 mm
安装类型 Surface Mount
Configuration Mode Active Serial (AS), Passive Serial (PS), JTAG
MSL 等级 3 (168 hours)
RoHS 状态 Non-RoHS (leaded) - select EP4CE10E22C8N for RoHS compliance

EP4CE10E22C8 引脚配置

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
引脚 1 I/O — User I/O pin (bank-dependent voltage)
引脚 2 I/O — User I/O pin (bank-dependent voltage)
引脚 3 I/O — User I/O pin
引脚 4 I/O — User I/O pin
引脚 5 I/O — User I/O pin
引脚 6 I/O — User I/O pin
引脚 7 I/O — User I/O pin
引脚 8 I/O — User I/O pin
引脚 9 I/O — User I/O pin
引脚 10 I/O — User I/O pin
引脚 11 GND — Ground
引脚 12 I/O — User I/O pin
引脚 13 I/O — User I/O pin
引脚 14 I/O — User I/O pin
引脚 15 I/O — User I/O pin
引脚 16 I/O — User I/O pin
引脚 17 I/O — User I/O pin
引脚 18 I/O — User I/O pin
引脚 19 I/O — User I/O pin
引脚 20 I/O — User I/O pin
引脚 21 VCCINT — Core voltage 1.2 V
引脚 22 I/O — User I/O pin
引脚 23 I/O — User I/O pin
引脚 24 I/O — User I/O pin
引脚 25 I/O — User I/O pin
引脚 26 I/O — User I/O pin
引脚 27 I/O — User I/O pin
引脚 28 I/O — User I/O pin
引脚 29 I/O — User I/O pin
引脚 30 I/O — User I/O pin
引脚 31 GND — Ground
引脚 32 I/O — User I/O pin
引脚 33 I/O — User I/O pin
引脚 34 I/O — User I/O pin
引脚 35 I/O — User I/O pin
引脚 36 I/O — User I/O pin
引脚 37 I/O — User I/O pin
引脚 38 I/O — User I/O pin
引脚 39 I/O — User I/O pin
引脚 40 I/O — User I/O pin
引脚 41 VCCIO — I/O bank voltage (1.2-3.3 V)
引脚 42 I/O — User I/O pin
引脚 43 I/O — User I/O pin
引脚 44 I/O — User I/O pin
引脚 45 I/O — User I/O pin
引脚 46 I/O — User I/O pin
引脚 47 I/O — User I/O pin
引脚 48 I/O — User I/O pin
引脚 49 I/O — User I/O pin
引脚 50 I/O — User I/O pin
引脚 51 GND — Ground
引脚 52 I/O — User I/O pin
引脚 53 I/O — User I/O pin
引脚 54 I/O — User I/O pin
引脚 55 I/O — User I/O pin
引脚 56 I/O — User I/O pin
引脚 57 I/O — User I/O pin
引脚 58 I/O — User I/O pin
引脚 59 I/O — User I/O pin
引脚 60 I/O — User I/O pin
引脚 61 VCCINT — Core voltage 1.2 V
引脚 62 I/O — User I/O pin
引脚 63 I/O — User I/O pin
引脚 64 I/O — User I/O pin
引脚 65 I/O — User I/O pin
引脚 66 I/O — User I/O pin
引脚 67 I/O — User I/O pin
引脚 68 I/O — User I/O pin
引脚 69 I/O — User I/O pin
引脚 70 I/O — User I/O pin
引脚 71 GND — Ground
引脚 72 I/O — User I/O pin
引脚 73 I/O — User I/O pin
引脚 74 I/O — User I/O pin
引脚 75 I/O — User I/O pin
引脚 76 I/O — User I/O pin
引脚 77 I/O — User I/O pin
引脚 78 I/O — User I/O pin
引脚 79 I/O — User I/O pin
引脚 80 I/O — User I/O pin
引脚 81 TCK — JTAG Test Clock
引脚 82 TMS — JTAG Test Mode Select
引脚 83 TDI — JTAG Test Data In
引脚 84 TDO — JTAG Test Data Out
引脚 85 nCONFIG — Configuration active-low reset
引脚 86 nSTATUS — Configuration status open-drain
引脚 87 CONF_DONE — Configuration done open-drain
引脚 88 DCLK — Configuration clock (PS mode) / DCLK
引脚 89 DATA0 — Configuration data input 0
引脚 90 I/O — User I/O pin
引脚 91 GND — Ground
引脚 92 I/O — User I/O pin
引脚 93 I/O — User I/O pin
引脚 94 I/O — User I/O pin
引脚 95 I/O — User I/O pin
引脚 96 I/O — User I/O pin
引脚 97 I/O — User I/O pin
引脚 98 I/O — User I/O pin
引脚 99 I/O — User I/O pin
引脚 100 I/O — User I/O pin
引脚 101 VCCIO — I/O bank voltage
引脚 102 I/O — User I/O pin
引脚 103 I/O — User I/O pin
引脚 104 I/O — User I/O pin
引脚 105 I/O — User I/O pin
引脚 106 I/O — User I/O pin
引脚 107 I/O — User I/O pin
引脚 108 I/O — User I/O pin
引脚 109 I/O — User I/O pin
引脚 110 I/O — User I/O pin
引脚 111 GND — Ground
引脚 112 I/O — User I/O pin
引脚 113 I/O — User I/O pin
引脚 114 I/O — User I/O pin
引脚 115 I/O — User I/O pin
引脚 116 I/O — User I/O pin
引脚 117 I/O — User I/O pin
引脚 118 I/O — User I/O pin
引脚 119 I/O — User I/O pin
引脚 120 I/O — User I/O pin
引脚 121 VCCAUX — Auxiliary voltage 2.5 V
引脚 122 I/O — User I/O pin
引脚 123 I/O — User I/O pin
引脚 124 I/O — User I/O pin
引脚 125 I/O — User I/O pin
引脚 126 I/O — User I/O pin
引脚 127 I/O — User I/O pin
引脚 128 I/O — User I/O pin
引脚 129 I/O — User I/O pin
引脚 130 I/O — User I/O pin
引脚 131 GND — Ground
引脚 132 I/O — User I/O pin
引脚 133 I/O — User I/O pin
引脚 134 I/O — User I/O pin
引脚 135 I/O — User I/O pin
引脚 136 I/O — User I/O pin
引脚 137 I/O — User I/O pin
引脚 138 I/O — User I/O pin
引脚 139 I/O — User I/O pin
引脚 140 I/O — User I/O pin
引脚 141 VCCINT — Core voltage 1.2 V
引脚 142 VCCPLL — PLL analog voltage 1.2 V
引脚 143 MSEL0 — Configuration mode select bit 0
引脚 144 MSEL1 — Configuration mode select bit 1

典型应用

EP4CE10E22C8 适用于 6 应用s: Industrial Motor Control and Servo Drive Front-End, Custom Peripheral Expansion for Microcontrollers, Low-Volume ASIC Prototyping and IP Validation, Video Bridging and Image Sensor Aggregation, Legacy Industrial Bus Protocol Conversion, Display Timing Generation and LCD Controller.

🏭

Industrial Motor Control and Servo Drive Front-End

The EP4CE10E22C8's 23 embedded 18x18 hardware multipliers and 414 Kbits of M9K embedded RAM make it well-suited for industrial motor control front-ends, where PWM generation, encoder quadrature decoding, and Field-Oriented Control (FOC) loops run in parallel. Its commercial 0C to +85C range covers most factory-floor enclosures, and the 144-EQFP exposed-pad package keeps junction temperatures below 100C at typical 5W budgets without active cooling. Two PLLs provide the multiple clock domains needed for encoder sampling, PWM switching, and communications interfaces simultaneously. The 91 user I/O pins accommodate multiple encoder inputs (QEP), Hall sensors, and isolated SPI/UART command ports in one device.

🧩

Custom Peripheral Expansion for Microcontrollers

Designers use the EP4CE10E22C8 to offload high-speed or parallel interfaces that bottleneck general-purpose MCUs. The 10,320 LEs provide ample room for FIFO-bridged peripherals (parallel bus capture, custom timing generators, LCD controllers) while the host MCU retains command-level responsibility. SDRAM/DDR2 controller IP enables large buffer memory for video or data acquisition tasks. The exposed-pad LQFP-144 EQFP package allows hand-prototyping and rework, which matters during firmware co-development with the host MCU. Designers also leverage the Cyclone IV E PCIe hard IP block for compact Gen1 x1 endpoint designs in this density point.

🔧

Low-Volume ASIC Prototyping and IP Validation

Before committing to a 60 nm or 28 nm ASIC mask set, design teams prototype their RTL on the EP4CE10E22C8 to validate algorithmic correctness, latency, and I/O behavior in a real environment. Quartus Prime preserves timing paths and resource utilization metrics that map closely to ASIC synthesis reports. The commercial 0C to +85C range permits lab and chassis validation cycles without industrial-cost parts. Designers can hold the same 144-EQFP footprint stable across prototype and pilot builds, then later migrate RTL to Cyclone V or Cyclone 10 for production while keeping firmware drivers unchanged.

🎥

Video Bridging and Image Sensor Aggregation

Image sensors from consumer to industrial inspection streams require aggregation, scaling, and color-space conversion. The EP4CE10E22C8 runs soft-IP CSI-2 receivers, MIPI-DPI bridges, and basic color correction at 60 fps for low-resolution vision tasks. DDR2 external memory controller IP provides the line-buffer memory needed for scaling and deinterlacing. Multipliers and M9K blocks combine to handle Sobel filters and basic histogram pipelines at modest resolutions. The combination of deterministic latency, parallel compute, and 91 user I/O pins suits single-camera inspection and machine-vision front-ends.

🌐

Legacy Industrial Bus Protocol Conversion

Brownfield industrial environments still rely on parallel, RS-485, and proprietary synchronous buses that modern MCUs no longer support. The EP4CE10E22C8 implements any number of legacy protocols in parallel - from 16-bit parallel transfers to synchronous serial at custom clock rates - using soft IP and pin-flexible I/O banks. M9K memory blocks buffer bursts during slow-host upstream transfers to Ethernet or USB. Multi-voltage I/O banks (1.2 V to 3.3 V) connect directly to legacy 5 V transceivers when bussed through external translation. Two PLLs provide independent clock recovery for receive and transmit paths.

📺

Display Timing Generation and LCD Controller

Display panels in industrial HMI, marine chartplotters, and avionics retrofit markets require custom timing generators, color depth conversion, and overlay blending that off-the-shelf MCUs struggle to produce. The EP4CE10E22C8 implements LVDS/TTL/LVCMOS display drivers, programmable timing controllers (Tcon), and alpha-blended OSD overlays at multi-MHz pixel rates. Internal M9K blocks serve as line buffers and gamma LUTs. The 144-EQFP footprint provides enough LVDS pairs and general-purpose I/O for driving 24-bit color TFTs at XGA and SXGA resolutions. Designers re-use the same hardware across multiple panel vendors by retargeting the FPGA bitstream rather than respinning PCBAs.

What is the logic element count of EP4CE10E22C8?
The Intel EP4CE10E22C8 contains 10,320 logic elements (LEs) in the Cyclone IV E family. According to the Cyclone IV Device Handbook, each LE consists of a 4-input LUT, a programmable register, carry chain, and register chain connections, with 16 LEs grouped per Logic Array Block (LAB). This places EP4CE10 at the low-density end of the family, optimized for cost-sensitive glue logic and modest DSP workloads.
What package does EP4CE10E22C8 use?
The EP4CE10E22C8 ships in a 144-pin EQFP (E22) exposed-pad LQFP package measuring 22x22 mm. The 'E22' suffix in the part number specifically identifies this 144-EQFP variant. The exposed thermal pad on the underside must be soldered to the ground plane to meet the thermal resistance specification; omitting it during PCB assembly will cause overheating under sustained load.
Is EP4CE10E22C8 RoHS compliant?
The EP4CE10E22C8 is the leaded finish variant and is NOT RoHS compliant. Per the Intel/Altera product page, the 'C8' suffix denotes leaded termination; the RoHS-compliant equivalent in the same 144-EQFP package is EP4CE10E22C8N. If your design requires RoHS compliance for European CE-marked products, specify EP4CE10E22C8N instead - it is pin-compatible and drop-in replaceable.
What is the difference between EP4CE10E22C8 and EP4CE10E22C8N?
The EP4CE10E22C8 has a leaded finish (SnPb) and is non-RoHS, while the EP4CE10E22C8N uses lead-free (Pb-free) matte tin termination and is RoHS compliant. Both parts share identical silicon, the same 144-EQFP (E22) footprint, 10,320 LEs, 414 Kbits of embedded RAM, and the C8 speed grade. The C8N variant is the recommended choice for new designs.
What is the difference between EP4CE10E22C8 and EP4CE10E22I7N?
The EP4CE10E22C8 is the commercial-grade variant (0 C to +85 C) at speed grade 8, while the EP4CE10E22I7N is the industrial-grade variant (-40 C to +100 C) at speed grade 7. Both share the same 144-EQFP E22 footprint and 10,320 LEs. The speed grade 7 is slightly slower than 8, but the I7N allows deployment in harsher environments such as automotive under-hood or outdoor industrial cabinets.
What is the price of EP4CE10E22C8 in 100-piece quantities?
As of 2026-10-22, the EP4CE10E22C8 lists at approximately $13.85 per unit at the 100-piece quantity break on DigiKey and Mouser. Single-unit pricing runs higher near $18.50. Volume pricing drops to roughly $9.75 at 1,000 pieces. For RoHS-compliant volume production, the lead-free EP4CE10E22C8N is typically priced within 5% of the leaded version.
Where can I download the EP4CE10E22C8 datasheet PDF?
The official Cyclone IV Device Handbook covering EP4CE10E22C8 is available on the Intel FPGA documentation library at the altera.com product page for Cyclone IV E, EP4CE10 E22. The document combines device specifications, pin tables, and AC/DC characteristics across all Cyclone IV E densities. Designers should also reference the Cyclone IV FPGA Family Errata sheet for known issues.
What is the best drop-in replacement for EP4CE10E22C8?
The best drop-in replacement for EP4CE10E22C8 in the same 144-EQFP E22 footprint is EP4CE10E22C8N (lead-free, RoHS compliant). For automotive applications, use EP4CE10E22A7N (automotive grade). For industrial temperature range, EP4CE10E22I7N (-40 C to +100 C) is the direct match. All variants share identical silicon, pinout, and 10,320 LEs.
Can EP4CE6E22C8 replace EP4CE10E22C8?
Yes, with caveats - the EP4CE6E22C8 in the same 144-EQFP E22 package has only 6,272 LEs (about 61% of the EP4CE10E22C8's 10,320 LEs). It is pin-compatible and a true drop-in for designs using fewer than ~6,000 LEs, but designs near the EP4CE10 resource limit will fail to fit. Use EP4CE22E22C8N for upward migration if you need more headroom than the EP4CE10 offers.
What is the difference between EP4CE10E22C8 and EP4CE22E22C8N?
Both are Cyclone IV E devices in the same 144-EQFP E22 footprint, but EP4CE22E22C8N scales to 22,320 LEs versus EP4CE10E22C8's 10,320 LEs. The EP4CE22 doubles memory to 595 Kbits and multipliers to 66. They are pin-compatible drop-in upgrades - designers can prototype on EP4CE10 and migrate to EP4CE22 by recompiling the bitstream in Quartus without PCB changes.
How many user I/O pins does EP4CE10E22C8 provide?
The EP4CE10E22C8 in the 144-EQFP E22 package provides 91 user I/O pins out of 144 total pads; the remaining pads are power, ground, configuration, and JTAG signals. Per the Cyclone IV pin table, I/O are grouped into multiple banks supporting 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V standards, enabling direct LVTTL, LVCMOS, and LVDS interfacing without external level shifters.
What FPGA toolchain supports EP4CE10E22C8?
The EP4CE10E22C8 is fully supported by Intel Quartus Prime Design Software (free Lite Edition handles Cyclone IV E designs up to the EP4CE30 density). Programming is via JTAG (USB-Blaster) or Active Serial using Altera/Intel EPCS configuration flash devices. Older Quartus II 13.0 sp1 builds also support the device but lack newer security features.
Is EP4CE10E22C8 still in production or obsolete?
The EP4CE10E22C8 remains active in the Intel/Altera product catalog as of 2026-10-22. The Cyclone IV E family is in long-term production but Intel has migrated new designs to Cyclone V and Cyclone 10 LP families. Volume availability on DigiKey, Mouser, and authorized distributors remains stable, though lead times can extend during flash memory supply disruptions.
Does EP4CE10E22C8 support DDR SDRAM interfaces?
Yes, the EP4CE10E22C8 supports DDR, DDR2, and QDRII+ external memory interfaces via Quartus PHY IP cores. The 144-EQFP package provides sufficient user I/O (91 pins) for a 16-bit DDR2 interface plus control lines. Maximum supported memory clock is 200 MHz for DDR SDRAM and 267 MHz for DDR2; high-speed interfaces require careful PCB impedance matching to 50 ohm differential or 50 ohm SE.
What is the operating voltage of EP4CE10E22C8?
The EP4CE10E22C8 core operates at 1.2 V (VCCINT) supplied by an external regulator. The I/O banks operate at 1.2 V to 3.3 V (VCCIO), programmable per bank. Per the Cyclone IV Handbook, VCCAUX (2.5 V typical) and VCCPLL (1.2 V) supplies are also required. Designers typically use a 4-rail power solution combining switching and LDO regulators to power the part.
What cross-brand alternatives exist to EP4CE10E22C8?
The EP4CE10E22C8 is Cyclone-IV-E-proprietary with no cross-brand drop-in equivalent at the same density and footprint. Lattice Semiconductor's MachXO2 and MachXO3 families come in 144-pin TQFP packages but with different pinouts (not pin-compatible) and much smaller LUT counts. Xilinx Spartan-6 LX16 is a possible cross-brand substitute but requires PCB redesign due to different package pin mapping.
How does EP4CE10E22C8 compare to LFE2-20E-5F484C for low-density FPGA designs?
The LFE2-20E-5F484C is a Lattice ECP2 family device with 21K LUTs in a 484-ball FBGA package, supporting hardware SERDES and higher-density designs, but it requires an FBGA footprint rather than the EQFP-144 of EP4CE10E22C8. For designs that need to stay on the LQFP-144 EQFP footprint, no cross-brand drop-in exists. The LFE2 is favored when higher LUT density and SERDES are priorities.

工程参考数据: EP4CE10E22C8 ——对比、设计指导和合规信息。

选型指南

Choose EP4CE10E22C8 when you need 10,320 LEs in a 144-EQFP exposed-pad LQFP and your assembly line supports leaded SnPb reflow, or when you're prototyping a new design that will eventually transition to the lead-free C8N. For new production designs targeting European or commercial markets, choose EP4CE10E22C8N instead - it is pin-compatible and identically priced. Select EP4CE10E22I7N if your operating environment spans -40 C to +100 C (industrial). For automotive applications, EP4CE10E22A7N (AEC-Q100) is required. If your design exceeds 8K LEs after synthesis, upgrade to EP4CE22E22C8N in the same package for 22K LEs of headroom without PCB changes. The 144-EQFP E22 package is preferred over BGA for hand-prototyping and field-upgradeable assemblies.

与替代料对比

参数 本产品 EP4CE10E22C8N EP4CE10E22I7N EP4CE10E22A7N EP4CE10E22C7N EP4CE10E22C6N
Package 144-EQFP (E22) 144-EQFP (E22) - same 144-EQFP (E22) - same 144-EQFP (E22) - same 144-EQFP (E22) - same 144-EQFP (E22) - same
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Logic Elements 10,320 LE 10,320 LE 10,320 LE 10,320 LE 10,320 LE 10,320 LE
Embedded Memory 414 Kbits 414 Kbits 414 Kbits 414 Kbits 414 Kbits 414 Kbits
Multipliers (18x18) 23 23 23 23 23 23
User I/O 91 91 91 91 91 91
Speed Grade C8 (commercial) C8 I7 A7 C7 C6
Temperature Grade Commercial 0C to +85C Commercial 0C to +85C Industrial -40C to +100C Automotive -40C to +125C Commercial 0C to +85C Commercial 0C to +85C
RoHS Compliance Non-RoHS (leaded SnPb) RoHS (Pb-free) RoHS (Pb-free) RoHS (Pb-free) RoHS (Pb-free) RoHS (Pb-free)
Lead Finish SnPb Matte tin (Pb-free) Matte tin (Pb-free) Matte tin (Pb-free) Matte tin (Pb-free) Matte tin (Pb-free)

关键差异点

  • Leaded (SnPb) termination for legacy manufacturing lines (对比 EP4CE10E22C8N)
  • Commercial 0C to +85C temperature grade optimized for fastest commercial speed (对比 EP4CE10E22I7N)
  • Cyclone IV E architecture compared to Cyclone III predecessor (对比 EP3C10E22C8 (Cyclone III 10K LE))
  • High I/O count for a 144-pin LQFP package (对比 EP4CE6E22C8 in same 144-EQFP package)

设计说明

Estimated: at typical 5 W total power dissipation on the EP4CE10E22C8 in a 144-EQFP package with exposed pad, theta_JA of approximately 18 C/W with proper ground-plane soldering under the pad places junction temperature near 25+5x18=115 C at 85 C ambient - near the 125 C limit. Solder the exposed pad to a continuous ground plane of at least 1 square inch with no thermal relief spokes; thermal vias (9x 0.3 mm) into inner ground layers significantly reduce junction temperature. Without proper pad soldering, junction can exceed 140 C and trigger silicon-level degradation.

The Cyclone IV E EP4CE10E22C8 requires four supply rails: VCCINT 1.2 V (core, ~500 mA typical), VCCIO 1.2-3.3 V per I/O bank (~50 mA per bank), VCCAUX 2.5 V (~100 mA), and VCCPLL 1.2 V (~30 mA). Use a 4-rail power solution: a switching regulator for VCCINT (>85% efficiency at the high current), LDO regulators for VCCAUX/VCCPLL for low-noise analog rails, and per-bank LDOs or ferrite-isolated rails for VCCIO. Connect all GND pins to a single uninterrupted ground plane; mixing analog and digital grounds without stitching causes PLL jitter and I/O timing violations.

Route all DDR/DDR2 memory interfaces with controlled-impedance 50 ohm SE traces (or 100 ohm differential for clocks) and 1.5x trace spacing within differential pairs to maintain 90 ohm differential impedance. Place configuration flash (EPCS4/EPCS16) within 25 mm of the FPGA and route MSEL, nCONFIG, nSTATUS, and CONF_DONE away from high-frequency switching signals. The TCK/TMS/TDI/TDO JTAG chain must be a single daisy chain with 4.7 kohm pull-ups to VCCAUX on TCK/TMS/TDI - never tap into the chain at intermediate points or the JTAG state machine loses sync.

During active power-up, drive MSEL0/MSEL1 to the correct logic level for your chosen configuration mode (typically '10' for Active Serial with EPCS flash, or '00' for JTAG-only programming). A common pitfall is leaving MSEL floating during board bring-up, which randomly selects a configuration mode and can hang the FPGA. Use 10 kohm pull-down or pull-up resistors explicitly tied to MSEL pins per the Cyclone IV Handbook configuration chapter. The configuration flash must be at least 5x the bitstream size to allow in-system reprogrammability; a Cyclone IV EP4CE10 bitstream is approximately 2.6-3.5 Mbits depending on compression settings.

Estimated: the most common design pitfall with EP4CE10E22C8 is omitting the exposed-pad solder connection, which forces thermal dissipation through the lead frame and triggers overheating within 30 minutes at sustained logic activity above 60 C ambient. Another common mistake is selecting the wrong speed grade - C8 is faster than C6, and engineers choosing C6 for cost save typically discover during timing closure that the design fails Fmax by 5-10%. Always run full Quartus Slow 1100 mV 85 C timing analysis before committing to a slower speed grade. Finally, never assume the configuration will fail gracefully - check CONF_DONE in firmware and trigger a reconfiguration cycle if the bitstream does not complete within 100 ms.

合规信息

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Qualified
无铅
No
无卤
Yes
冲突矿物
Compliant

EP4CE10E22C8 has SnPb (leaded) finish and is non-RoHS. For RoHS compliance use EP4CE10E22C8N. For automotive use EP4CE10E22A7N (AEC-Q100 qualified).

数据核验日期: 2026-10-22 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

EP4CE10E22C8 EP4CE10E22C8 datasheet PDF Intel Cyclone IV E FPGA EP4CE10E22C8 price 100 pieces 10K logic element FPGA LQFP-144 Cyclone IV E 144 EQFP E22 package EP4CE10E22C8 vs EP4CE10E22C8N EP4CE10E22C8 leaded RoHS replacement FPGA for industrial motor control how many logic elements in EP4CE10E22C8 Cyclone IV E exposed pad LQFP footprint EP4CE10E22C8 lead-free alternative

相关元器件 & 术语

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