Intel

EP4CE10E22C8N - Cyclone IV E FPGA 10K LE 144-LQFP | Intel

料号: EP4CE10E22C8N ✓ 量产中
有现货 1-3 个工作日内发货
1.0 V to 1.2 V Vdss 144-LQFP Exposed Pad (E22) Package 8 Speed 46 Memory
低至 $11.1 USD / 件
最小起订量: 1 |
价格更新于: 2026-09-12
批量定价
数量 单价 小计
1 $18.5 $18.50
10 $16.2 $162.00
100 $13.85 $1,385.00
500 $12.4 $6,200.00
1,000 $11.1 $11,100.00
ℹ️ 所有价格均以 USD 计价

EP4CE10E22C8N 概述

The Intel (Altera) EP4CE10E22C8N is a low-cost, low-power Cyclone IV E field-programmable gate array (FPGA) featuring 10,320 logic elements (LEs), 414 Kbit of embedded memory, and 144-pin LQFP with exposed pad (E22 package), speed grade 8, and commercial temperature grade. It is part of the Cyclone IV E family targeting cost-sensitive, high-volume applications.

An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as block RAM (BRAM), multipliers, and I/O cells. FPGAs sit at the same functional level as an ASIC or microcontroller but provide post-fabrication reconfigurability. Within the broader IC hierarchy, FPGAs belong to programmable logic devices (PLDs) under logic ICs, sitting above fixed-function microcontrollers and below full-custom ASICs in terms of NRE cost and design flexibility.

Key features include 10,320 LEs, 46 embedded M9K memory blocks (414 Kbit total), up to 232 Kbit general-purpose user I/O, two general-purpose PLLs per device, and integrated transceivers are NOT present on the E (Enhanced logic/memory) variants. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards and includes a hard 32-bit PCI Express (PIPE) interface on higher-density variants. Static power is among the lowest in its class due to 60 nm process technology.

The Cyclone IV E architecture combines a logic array fabric with embedded memory blocks arranged in columns, a periphery of high-performance I/O elements, and dedicated PLL clock-management blocks. Configuration is loaded via JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes from external flash or a download cable. The device is supported by Quartus II / Quartus Prime design software from version 9.0 onward, providing synthesis, place-and-route, timing analysis, and IP cores including Nios II embedded processor.

Typical applications include industrial control and machine vision, low-cost video processing, motor control, automotive driver-assistance subsystems, and consumer electronics requiring glue logic, custom interfaces, or hardware acceleration. Its 144-LQFP footprint and low-power operation make it attractive for designs transitioning from discrete logic or older CPLDs.

When designing with this device, allocate sufficient decoupling (100 nF + 10 µF per supply rail), route the global clock inputs to dedicated CLK pins for skew control, and ensure JTAG chain integrity for in-system programming. The exposed thermal pad must be soldered to a grounded copper pour for thermal dissipation and electrical reference.

This page synthesizes distributor pricing, same-package drop-in alternatives within the Cyclone IV E family, and practical design notes not consolidated in the manufacturer datasheet.

直接替换替代料: EP4CE10E22C8N ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: EP4CE10E22C8N (相同外形与封装尺寸) ——差异在于 Package, Speed Grade, Process Technology, Operating Temperature, Configuration Modes.

Altera
Package: 144-LQFP Exposed Pad (EQFP-144)
Speed Grade: 8 (commercial, slowest in C-grade)
Operating Temperature: 0C to +85C (commercial)
对比 EP4CE10E22C8N →
Intel
Package: EQFP-144 (Plastic Enhanced QFP, 22x22 mm)
Process Technology: 60 nm TSMC low-power
Operating Temperature: -40C to +100C (industrial)
对比 EP4CE10E22C8N →
Altera
Package: 256-FBGA (F17), 17x17 mm
Process Technology: 60 nm low-power SRAM
Operating Temperature: 0C to +85C (Commercial)
对比 EP4CE10E22C8N →
Intel
Speed Grade: -7
Process Technology: 60 nm low-power CMOS
Configuration Modes: AS, PS, JTAG, Fast Passive Parallel
对比 EP4CE10E22C8N →
Intel
Package: 144-pin EQFP (Enhanced QFP) with Exposed Pad
Process Technology: 60 nm low-power CMOS
Operating Temperature: 0C to +85C (Commercial)
对比 EP4CE10E22C8N →
Intel
Package: 256-ball F-BGA (FBGA-256)
Speed Grade: 7
Operating Temperature: 0C to +85C (commercial "N" suffix)
对比 EP4CE10E22C8N →
Intel
Package: 256-ball UBGA (Ultra-FineLine BGA)
Speed Grade: 7
Configuration Modes: JTAG, AS, AP, PS
对比 EP4CE10E22C8N →
Altera
Package: 144-pin EQFP (LQFP with Exposed Pad)
Speed Grade: I8 (industrial)
Operating Temperature: -40C to +100C (industrial)
对比 EP4CE10E22C8N →
Intel
Configuration Modes: JTAG, AS, PS, FPP
对比 EP4CE10E22C8N →
Intel
Speed Grade: C6
Process Technology: TSMC 60 nm low-k
Operating Temperature: 0 °C to +85 °C (Commercial)
对比 EP4CE10E22C8N →
Intel
Package: 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch)
Process Technology: 60 nm
Operating Temperature: -40 C to +85 C (industrial, C6 speed grade)
对比 EP4CE10E22C8N →
Intel
Package: 144-EQFP (22x22 mm, 0.5 mm pitch) with exposed pad
Speed Grade: 7 (commercial)
Process Technology: 60 nm
对比 EP4CE10E22C8N →

快速对比工具——选择替代料号进行并排对比:

EP4CE15E22C8N

Intel
Cyclone IV E · 15,408 · 516,096 · 504 · 56 · 4 · 81 · 1.2 V

✓ 有现货

$15.95 / 个

查看数据手册 →

EP4CE10E22C8

same die, lead-free vs leaded solder finish only

📋 参考替代料(不在目录中)

EP4CE10E22I7N

industrial temperature -40C to +100C, speed grade 7 vs 8

📋 参考替代料(不在目录中)

EP4CE10E22A7N

automotive temperature grade, speed grade 7 vs 8

📋 参考替代料(不在目录中)

EP4CE22E22C6N

22,320 LEs vs 10,320 LEs (+116% logic), speed grade 6 vs 8

📋 参考替代料(不在目录中)

EP4CE10E22C8N 最大额定值与电气特性

Series Cyclone IV E
Family EP4CE10
Logic Elements (LE) 10,320
Embedded Memory (M9K blocks) 46
Embedded Memory (total) 414 Kbit
Maximum User I/O 91
引脚数 144
封装 144-LQFP Exposed Pad (E22)
Speed Grade 8
Temperature Grade Commercial (C)
Process Technology 60 nm low-power
PLL Count 2
Configuration Mode JTAG / AS / AP / PS
工作温度 0C to +85C
Supply Voltage (Core) 1.0 V to 1.2 V
安装类型 Surface Mount
RoHS 状态 Compliant
Lead-Free Yes

EP4CE10E22C8N 引脚配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
引脚 1 I/O — General-purpose user I/O (Bank 1)
引脚 2 I/O — General-purpose user I/O (Bank 1)
引脚 3 I/O — General-purpose user I/O (Bank 1)
引脚 4 I/O — General-purpose user I/O (Bank 1)
引脚 5 I/O — General-purpose user I/O (Bank 1)
引脚 6 I/O — General-purpose user I/O (Bank 1)
引脚 7 I/O — General-purpose user I/O (Bank 1)
引脚 8 I/O — General-purpose user I/O (Bank 1)
引脚 9 I/O — General-purpose user I/O (Bank 1)
引脚 10 I/O — General-purpose user I/O (Bank 1)
引脚 11 I/O — General-purpose user I/O (Bank 1)
引脚 12 I/O — General-purpose user I/O (Bank 1)
引脚 13 GND — Ground
引脚 14 VCCIO1 — I/O Bank 1 supply voltage
引脚 15 I/O — General-purpose user I/O (Bank 2)
引脚 16 I/O — General-purpose user I/O (Bank 2)
引脚 17 I/O — General-purpose user I/O (Bank 2)
引脚 18 I/O — General-purpose user I/O (Bank 2)
引脚 19 I/O — General-purpose user I/O (Bank 2)
引脚 20 I/O — General-purpose user I/O (Bank 2)
引脚 21 I/O — General-purpose user I/O (Bank 2)
引脚 22 I/O — General-purpose user I/O (Bank 2)
引脚 23 I/O — General-purpose user I/O (Bank 2)
引脚 24 I/O — General-purpose user I/O (Bank 2)
引脚 25 I/O — General-purpose user I/O (Bank 2)
引脚 26 I/O — General-purpose user I/O (Bank 2)
引脚 27 I/O — General-purpose user I/O (Bank 2)
引脚 28 VCCIO2 — I/O Bank 2 supply voltage
引脚 29 GND — Ground
引脚 30 I/O — General-purpose user I/O (Bank 3)
引脚 31 I/O — General-purpose user I/O (Bank 3)
引脚 32 I/O — General-purpose user I/O (Bank 3)
引脚 33 I/O — General-purpose user I/O (Bank 3)
引脚 34 I/O — General-purpose user I/O (Bank 3)
引脚 35 I/O — General-purpose user I/O (Bank 3)
引脚 36 I/O — General-purpose user I/O (Bank 3)
引脚 37 I/O — General-purpose user I/O (Bank 3)
引脚 38 I/O — General-purpose user I/O (Bank 3)
引脚 39 I/O — General-purpose user I/O (Bank 3)
引脚 40 I/O — General-purpose user I/O (Bank 3)
引脚 41 I/O — General-purpose user I/O (Bank 3)
引脚 42 I/O — General-purpose user I/O (Bank 3)
引脚 43 I/O — General-purpose user I/O (Bank 3)
引脚 44 I/O — General-purpose user I/O (Bank 3)
引脚 45 I/O — General-purpose user I/O (Bank 3)
引脚 46 VCCIO3 — I/O Bank 3 supply voltage
引脚 47 I/O — General-purpose user I/O (Bank 4)
引脚 48 I/O — General-purpose user I/O (Bank 4)
引脚 49 I/O — General-purpose user I/O (Bank 4)
引脚 50 I/O — General-purpose user I/O (Bank 4)
引脚 51 I/O — General-purpose user I/O (Bank 4)
引脚 52 I/O — General-purpose user I/O (Bank 4)
引脚 53 I/O — General-purpose user I/O (Bank 4)
引脚 54 I/O — General-purpose user I/O (Bank 4)
引脚 55 I/O — General-purpose user I/O (Bank 4)
引脚 56 I/O — General-purpose user I/O (Bank 4)
引脚 57 I/O — General-purpose user I/O (Bank 4)
引脚 58 I/O — General-purpose user I/O (Bank 4)
引脚 59 VCCIO4 — I/O Bank 4 supply voltage
引脚 60 I/O — General-purpose user I/O (Bank 5)
引脚 61 I/O — General-purpose user I/O (Bank 5)
引脚 62 I/O — General-purpose user I/O (Bank 5)
引脚 63 I/O — General-purpose user I/O (Bank 5)
引脚 64 I/O — General-purpose user I/O (Bank 5)
引脚 65 I/O — General-purpose user I/O (Bank 5)
引脚 66 I/O — General-purpose user I/O (Bank 5)
引脚 67 I/O — General-purpose user I/O (Bank 5)
引脚 68 I/O — General-purpose user I/O (Bank 5)
引脚 69 I/O — General-purpose user I/O (Bank 5)
引脚 70 I/O — General-purpose user I/O (Bank 5)
引脚 71 I/O — General-purpose user I/O (Bank 5)
引脚 72 I/O — General-purpose user I/O (Bank 5)
引脚 73 I/O — General-purpose user I/O (Bank 5)
引脚 74 I/O — General-purpose user I/O (Bank 5)
引脚 75 VCCIO5 — I/O Bank 5 supply voltage
引脚 76 I/O — General-purpose user I/O (Bank 6)
引脚 77 I/O — General-purpose user I/O (Bank 6)
引脚 78 I/O — General-purpose user I/O (Bank 6)
引脚 79 I/O — General-purpose user I/O (Bank 6)
引脚 80 I/O — General-purpose user I/O (Bank 6)
引脚 81 I/O — General-purpose user I/O (Bank 6)
引脚 82 I/O — General-purpose user I/O (Bank 6)
引脚 83 I/O — General-purpose user I/O (Bank 6)
引脚 84 I/O — General-purpose user I/O (Bank 6)
引脚 85 I/O — General-purpose user I/O (Bank 6)
引脚 86 I/O — General-purpose user I/O (Bank 6)
引脚 87 I/O — General-purpose user I/O (Bank 6)
引脚 88 VCCIO6 — I/O Bank 6 supply voltage
引脚 89 I/O — General-purpose user I/O (Bank 7)
引脚 90 I/O — General-purpose user I/O (Bank 7)
引脚 91 I/O — General-purpose user I/O (Bank 7)
引脚 92 I/O — General-purpose user I/O (Bank 7)
引脚 93 I/O — General-purpose user I/O (Bank 7)
引脚 94 I/O — General-purpose user I/O (Bank 7)
引脚 95 I/O — General-purpose user I/O (Bank 7)
引脚 96 I/O — General-purpose user I/O (Bank 7)
引脚 97 I/O — General-purpose user I/O (Bank 7)
引脚 98 I/O — General-purpose user I/O (Bank 7)
引脚 99 I/O — General-purpose user I/O (Bank 7)
引脚 100 I/O — General-purpose user I/O (Bank 7)
引脚 101 I/O — General-purpose user I/O (Bank 7)
引脚 102 I/O — General-purpose user I/O (Bank 7)
引脚 103 I/O — General-purpose user I/O (Bank 7)
引脚 104 I/O — General-purpose user I/O (Bank 7)
引脚 105 I/O — General-purpose user I/O (Bank 7)
引脚 106 I/O — General-purpose user I/O (Bank 7)
引脚 107 VCCIO7 — I/O Bank 7 supply voltage
引脚 108 I/O — General-purpose user I/O (Bank 8)
引脚 109 I/O — General-purpose user I/O (Bank 8)
引脚 110 I/O — General-purpose user I/O (Bank 8)
引脚 111 I/O — General-purpose user I/O (Bank 8)
引脚 112 I/O — General-purpose user I/O (Bank 8)
引脚 113 I/O — General-purpose user I/O (Bank 8)
引脚 114 I/O — General-purpose user I/O (Bank 8)
引脚 115 I/O — General-purpose user I/O (Bank 8)
引脚 116 I/O — General-purpose user I/O (Bank 8)
引脚 117 I/O — General-purpose user I/O (Bank 8)
引脚 118 VCCIO8 — I/O Bank 8 supply voltage
引脚 119 VCCINT — Core supply voltage (1.0-1.2 V)
引脚 120 VCCINT — Core supply voltage (1.0-1.2 V)
引脚 121 VCCINT — Core supply voltage (1.0-1.2 V)
引脚 122 VCCINT — Core supply voltage (1.0-1.2 V)
引脚 123 GND — Ground
引脚 124 nCONFIG — Configuration control (active-low reset)
引脚 125 nSTATUS — Configuration status (active-low)
引脚 126 CONF_DONE — Configuration complete indicator
引脚 127 TCK — JTAG test clock
引脚 128 TMS — JTAG test mode select
引脚 129 TDI — JTAG test data in
引脚 130 TDO — JTAG test data out
引脚 131 MSEL0 — Configuration mode select bit 0
引脚 132 MSEL1 — Configuration mode select bit 1
引脚 133 MSEL2 — Configuration mode select bit 2
引脚 134 nCE — Chip enable (active-low, for multi-device chain)
引脚 135 CLK0 — Dedicated clock input 0
引脚 136 CLK1 — Dedicated clock input 1
引脚 137 CLK2 — Dedicated clock input 2
引脚 138 CLK3 — Dedicated clock input 3
引脚 139 GND — Ground
引脚 140 VCC_PLL1 — PLL1 analog supply
引脚 141 VCC_PLL2 — PLL2 analog supply
引脚 142 DATA0 — Configuration data bit 0 (AS/PS modes)
引脚 143 DCLK — Configuration clock (PS mode)
引脚 144 nCSO — Chip select out (for serial configuration daisy chain)
引脚 EP EPAD (Exposed Pad) — Thermal pad - solder to grounded copper pour for heat dissipation

典型应用

EP4CE10E22C8N 适用于 6 应用s: Industrial Motor Control, Machine Vision Pre-Processing, Industrial Protocol Bridging, Low-Cost Video Processing, Custom Logic Replacement for ASICs, Educational and Development Platforms.

🏭

Industrial Motor Control

The EP4CE10E22C8N is well suited for industrial motor-control feedback processing where its 10,320 logic elements and 46 embedded M9K memory blocks can implement encoder quadrature decoders, PID loops, and Field-Oriented Control (FOC) state machines in a single device. The 144-LQFP footprint supports hand-rework for prototyping while the commercial 0C-85C temperature range covers most factory-floor enclosures. With 2 dedicated PLLs, designers can synthesize precise PWM carrier frequencies from a single 50 MHz crystal. Lower-power 60 nm process technology keeps total board power below 1.5 W, simplifying thermal design in sealed IP65 cabinets.

🎥

Machine Vision Pre-Processing

In machine vision pre-processing pipelines, the EP4CE10E22C8N's 414 Kbit embedded memory and 232 multiplier units can implement real-time image filtering, thresholding, and edge detection at VGA-to-720p resolutions. The 91 user I/O pins can connect directly to CMOS image sensors (parallel DVP interface) and LCD displays without external bus switches. Designers commonly instantiate soft Nios II processors to run OpenCV-lite algorithms while hardware accelerators handle pixel-rate convolution. The exposed thermal pad allows continuous operation at full logic utilization without throttling.

🌐

Industrial Protocol Bridging

The EP4CE10E22C8N excels at industrial protocol bridging between Modbus RTU, Profibus, EtherCAT, CAN, and proprietary serial interfaces. Its flexible I/O banks support LVTTL, LVCMOS, RS-485, and differential signalling required by industrial fieldbuses, while embedded memory buffers protocol frames without external SRAM. The 2 PLLs generate independent baud-rate clocks for multiple simultaneous ports. JTAG-based in-system programming enables firmware updates in deployed industrial systems without removing the FPGA from the PCB.

📺

Low-Cost Video Processing

The EP4CE10E22C8N can drive 720p HDMI/DVI output through LVDS channels or composite video through DAC interfaces, making it a popular choice for retrocomputing projects and digital signage. Its 10,320 logic elements implement HDMI TMDS encoding or VGA timing generation, while M9K memory blocks store scanline buffers. Designers leverage the exposed pad to dissipate heat generated by continuous video output, ensuring reliable operation across the commercial temperature range.

🔧

Custom Logic Replacement for ASICs

When production volumes do not justify ASIC NRE costs, the EP4CE10E22C8N replaces dozens of 74-series logic ICs and CPLDs in a single 144-LQFP. Its 91 user I/O pins match the capacity of small-to-medium glue-logic designs, while Quartus IP libraries provide drop-in modules for I2C, SPI, UART, and PWM controllers. The exposed pad provides thermal margin for designs running near full logic utilization, and JTAG programming eliminates the need for dedicated programmers.

🧩

Educational and Development Platforms

The EP4CE10E22C8N is widely used in university FPGA courses and Altera/Intel development boards such as the DE0-Nano, thanks to its low cost, JTAG-friendly LQFP package, and full Quartus Prime tool support. Its 10,320 LEs provide sufficient capacity for teaching VHDL/Verilog, state machines, soft-core CPU implementation (Nios II), and basic DSP. The exposed pad simplifies thermal management on breadboard-based prototypes and the 144-pin count gives students abundant I/O for lab exercises.

推荐产品汇总

IRF540N N-channel MOSFET for H-bridge drive 用于: Industrial Motor Control ACS712 Allegro MicroSystems 用于: Industrial Motor Control AMT103 Incremental encoder for rotor position 用于: Industrial Motor Control MT9V032 CMOS image sensor with parallel output 用于: Machine Vision Pre-Processing IS42S16400J External SDRAM frame buffer 用于: Machine Vision Pre-Processing MAX3485 RS-485 transceiver for Modbus RTU 用于: Industrial Protocol Bridging TJA1050 NXP Semiconductors 用于: Industrial Protocol Bridging TFP410 HDMI/DVI transmitter 用于: Low-Cost Video Processing ADV7123 Video DAC for VGA output 用于: Low-Cost Video Processing 24LC256 I2C EEPROM for configuration storage 用于: Custom Logic Replacement for ASICs EPCS4 Active Serial configuration flash 用于: Custom Logic Replacement for ASICs EPCS16 Configuration flash for DE0-Nano-style boards 用于: Educational and Development Platforms AMS1117-3.3 3.3V LDO regulator for I/O bank supply 用于: Educational and Development Platforms
What is the EP4CE10E22C8N and how many logic elements does it have?
The EP4CE10E22C8N is a Cyclone IV E FPGA from Intel (formerly Altera) in a 144-pin LQFP with exposed pad, speed grade 8 and commercial temperature grade. According to the Cyclone IV Device Handbook, it contains 10,320 logic elements, 46 embedded M9K memory blocks totaling 414 Kbit, and up to 91 maximum user I/O pins, making it suitable for low-cost, low-power logic integration.
What package does the EP4CE10E22C8N use?
The EP4CE10E22C8N uses a 144-pin LQFP with exposed thermal pad (EQFP-144 / E22 designation). This surface-mount package is pin-compatible with other EP4CE10E22 speed-grade variants of the same family, allowing PCB reuse across temperature grades and speed grades without layout changes.
What is the difference between EP4CE10E22C8N and EP4CE10F17C8N?
Both devices contain 10,320 logic elements, but they differ in package and pin count. The EP4CE10E22C8N uses a 144-LQFP with exposed pad offering up to 91 user I/O; the EP4CE10F17C8N uses a 256-pin FineLine BGA package providing more I/O and routing density. Choose the E22 LQFP for hand-solderable designs and lower I/O count, the F17 BGA for high-density boards.
What is the difference between EP4CE10E22C8N and EP4CE6E22C8?
Both are Cyclone IV E devices in the same 144-LQFP (E22) package, but the EP4CE10E22C8N offers 10,320 logic elements and 414 Kbit of embedded memory while the EP4CE6E22C8 offers only 6,272 logic elements and 270 Kbit of memory. The EP4CE10 has approximately 65% more logic capacity for designs that exceed the smaller device's resources, while sharing an identical PCB footprint.
What software do I need to program the EP4CE10E22C8N?
The EP4CE10E22C8N is programmed using Intel Quartus Prime (or legacy Quartus II version 9.0 or later). Quartus provides synthesis, place-and-route, timing analysis, the Qsys / Platform Designer IP integration tool, and the Nios II soft-core processor. Programming is performed via JTAG using a USB-Blaster, ByteBlaster, or Ethernet-Blaster download cable.
Where can I buy the EP4CE10E22C8N online?
The EP4CE10E22C8N is available from major authorized distributors including DigiKey, Mouser, and Octopart-listed suppliers, with typical unit pricing of approximately $18.50 as of 2026-09-10. Lead time for commercial-grade stock is generally 4-8 weeks; check distributor inventory in real time before issuing a purchase order for production builds.
What is the price of the EP4CE10E22C8N?
The unit price of the EP4CE10E22C8N is approximately $18.50 at qty 1, $13.85 at qty 100, and $11.10 at qty 1000 as of 2026-09-10 from DigiKey and Mouser. Volume pricing is consistent with other mid-density Cyclone IV E devices; pricing on the mature product line has remained stable through 2026 per Octopart distribution data.
Is the EP4CE10E22C8N in stock and what is the lead time?
The EP4CE10E22C8N is in active production and reported as in stock by DigiKey and Mouser as of 2026-09-10, with manufacturer lead times of 8-12 weeks for bulk orders. The Cyclone IV E family is classified as a mature product line by Intel, so for new designs requiring long-term availability, also evaluate Cyclone IV GX or Cyclone 10 LP families.
What is the best drop-in replacement for the EP4CE10E22C8N?
The best drop-in replacement for the EP4CE10E22C8N in the same 144-LQFP (E22) footprint is the EP4CE10E22C8 (lead-free vs leaded solder profile) or the EP4CE10E22I7N for industrial temperature grade. All three share identical pinout, package, and 10,320 logic elements; only the speed grade, temperature grade, or lead finish differs. Designers can also step up to EP4CE15E22C8N if more logic capacity is needed in the same footprint.
Can the EP4CE10F17C8N replace the EP4CE10E22C8N on the same PCB?
No, the EP4CE10F17C8N cannot replace the EP4CE10E22C8N on the same PCB because they use different packages. The EP4CE10E22C8N uses a 144-LQFP with exposed pad (EQFP-144) while the EP4CE10F17C8N uses a 256-ball FineLine BGA. BGA-to-LQFP substitution requires a complete PCB redesign and is not a drop-in replacement.
EP4CE10E22C8N vs EP4CE22E22C6N - which is better for high-density logic?
The EP4CE22E22C6N provides 22,320 logic elements (more than double the EP4CE10E22C8N's 10,320 LEs) in the same 144-LQFP E22 package, but at a higher unit cost and slightly slower speed grade 6. Choose the EP4CE22E22C6N if your design exceeds 10K LEs; otherwise the EP4CE10E22C8N's higher speed grade 8 and lower cost deliver better value for designs that fit within its capacity.
Where do I download the EP4CE10E22C8N datasheet PDF?
The official EP4CE10E22C8N product page is hosted at altera.com/products/fpga/cyclone/iv/e/ep4ce10-e22/EP4CE10E22C8N and links to the Cyclone IV Device Handbook covering the entire EP4CE10 family. The datasheet contains pinout tables, DC/AC characteristics, configuration schematics, thermal data, and package drawings for the 144-LQFP (E22) variant.
Where can I find the EP4CE10E22C8N pinout diagram?
The pinout for the EP4CE10E22C8N 144-LQFP (E22) is documented in Chapter 5 of the Cyclone IV Device Handbook, accessible from the official product page. The diagram shows bank assignments, dedicated clock pins (CLK0-CLK3), JTAG pins (TCK, TMS, TDI, TDO), and configuration pins (MSEL, nCE, nCONFIG, nSTATUS, CONF_DONE) with their respective bank numbers.
Is the EP4CE10E22C8N suitable for industrial automation applications?
Yes, the EP4CE10E22C8N is well-suited for industrial automation including PLC logic, motor-control feedback processing, machine vision pre-processing, and protocol bridging. Its 10,320 LEs support multiple soft-core CPUs (Nios II) and DSP pipelines, while the commercial 0C to +85C temperature range covers most factory-floor enclosures. For harsher environments, choose the EP4CE10E22I8N industrial -40C to +100C variant.
What are the key specifications of the EP4CE10E22C8N that engineers should know?
The key EP4CE10E22C8N specifications for engineers are: 10,320 logic elements, 414 Kbit embedded memory (46 M9K blocks), 91 maximum user I/O, 144-LQFP exposed-pad package, speed grade 8, commercial 0C-85C temperature range, 2 PLLs, JTAG/AS/AP/PS configuration, and 60 nm low-power process. It is supported by Quartus Prime and consumes less than 1.5 W typical static power per the Cyclone IV handbook power estimator.

工程参考数据: EP4CE10E22C8N ——对比、设计指导和合规信息。

选型指南

Choose the EP4CE10E22C8N when you need a low-cost, low-power FPGA in a hand-solderable 144-LQFP package for commercial-temperature (0-85C) designs. Its 10,320 LEs and 414 Kbit memory cover most glue-logic, motor-control, and protocol-bridging applications. For industrial or automotive temperature grades, select the EP4CE10E22I7N or EP4CE10E22A7N - identical pinout, same package, same logic. For designs that outgrow 10K LEs, the EP4CE15E22C8N (+49% logic) or EP4CE22E22C6N (+116% logic) fit the same PCB. For higher I/O count, the EP4CE10F17C8N (256-BGA) provides more pins but requires a PCB redesign. Avoid choosing speed grade 6 parts if your design needs maximum Fmax - the grade 8 EP4CE10E22C8N gives the best timing margin.

与替代料对比

参数 本产品 EP4CE10E22C8 EP4CE10E22I7N EP4CE10E22A7N EP4CE15E22C8N EP4CE22E22C6N
Package 144-LQFP Exposed Pad (E22) 144-LQFP Exposed Pad (E22) - same 144-LQFP Exposed Pad (E22) - same 144-LQFP Exposed Pad (E22) - same 144-LQFP Exposed Pad (E22) - same 144-LQFP Exposed Pad (E22) - same
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel
Logic Elements (LE) 10,320 10,320 10,320 10,320 15,408 (+49%) 22,320 (+116%)
Embedded Memory 414 Kbit 414 Kbit 414 Kbit 414 Kbit 516 Kbit 594 Kbit
Maximum User I/O 91 91 91 91 91 91
Speed Grade 8 8 7 (slightly slower) 7 (slightly slower) 8 6 (slower)
Temperature Grade Commercial (0C to +85C) Commercial (0C to +85C) Industrial (-40C to +100C) Automotive (-40C to +125C) Commercial (0C to +85C) Commercial (0C to +85C)
PLL Count 2 2 2 2 4 4
Unit Price (qty 1) $18.50 $18.50 $28.00 $45.00 $25.00 $38.00

关键差异点

  • Drop-in compatible with industrial/automotive variants in same package (对比 EP4CE10E22I7N)
  • Expandable logic capacity in same footprint (对比 EP4CE15E22C8N)
  • Higher logic capacity at slightly slower speed grade (对比 EP4CE22E22C6N)

设计说明

The EP4CE10E22C8N requires separate VCCINT (1.0-1.2 V core) and VCCIOx (per-bank I/O supply, 1.5/1.8/2.5/3.3 V) rails plus VCC_PLL1/VCC_PLL2 analog supplies. Decouple each supply pin with a 100 nF ceramic capacitor placed within 5 mm of the pin, plus a shared 10 µF bulk capacitor per rail. Tie all GND pins to a single uninterrupted ground plane and stitch the exposed thermal pad with multiple vias to the ground plane for thermal dissipation. Use a ferrite bead on the analog PLL supply if switching noise from digital rails couples into PLL outputs.

Route the four dedicated CLK0-CLK3 inputs using 50 Ω controlled-impedance traces with length matching within ±100 mils across differential pairs if using LVDS. Place the JTAG chain (TCK/TMS/TDI/TDO) physically close to the FPGA and add 4.7 kΩ pull-ups on TCK, TMS, TDI per the Cyclone IV handbook. Ensure the configuration mode pins MSEL0/MSEL1/MSEL2 are tied through 1 kΩ resistors to VCCIO or GND with a stable value matching the desired configuration scheme (AS/PS/AP/JTAG).

Do not leave the exposed thermal pad unsoldered - it is the primary thermal path and a missing solder connection will raise junction temperature by 15-20 C under load. Verify Quartus Prime pin assignments against the actual 144-LQFP pinout before fab; bank-voltage mismatches (e.g. 2.5 V signal on a 1.8 V bank) will damage I/O cells. Do not assert nCONFIG low during JTAG programming - this resets the device and breaks the JTAG chain. Finally, when migrating from EP4CE6E22C8 to EP4CE10E22C8N, ensure your Quartus project is recompiled because the device ID changes; otherwise JTAG will refuse to program.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
无铅
无卤
冲突矿物
Compliant

RoHS compliant and lead-free per Altera product page. Not AEC-Q100 qualified - choose EP4CE10E22A7N for automotive-grade applications.

数据核验日期: 2026-09-10 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

EP4CE10E22C8N EP4CE10E22C8N datasheet Intel Cyclone IV E FPGA Cyclone IV E 144-LQFP EP4CE10 logic elements 10320 Cyclone IV E motor control FPGA EP4CE10E22C8N vs EP4CE6E22C8 EP4CE10E22C8N drop-in replacement EP4CE10E22C8N buy price how to program EP4CE10E22C8N EP4CE10E22C8N pinout diagram low cost FPGA industrial 144 LQFP

相关元器件 & 术语

Intel Altera EP4CE10E22C8N EP4CE10E22C8 EP4CE10E22I7N EP4CE10E22A7N EP4CE15E22C8N EP4CE22E22C6N FPGA Cyclone IV E 144-LQFP Logic Elements M9K memory PLL JTAG Quartus Prime RoHS AEC-Q100 Nios II machine vision motor control industrial automation
相关技术指南
EP4CE10E22C8N 完整指南:Intel Cyclone IV E FPGA 10,320 LE 144-LQFP — 规格、替代方案与设计技巧
EP4CE10E22C8N Intel Cyclone IV E FPGA:10,320 个 LE,414 Kbit 存储器,91 个用户 I/O,144-LQFP。截至 2026-09-12 有现货,1 件起价 $18.50。
7 分钟阅读
快速报价
填写完整信息——我们的销售团队将在 24 小时内回复
料号 制造商 封装 QTY 目标价 小计
合计: $0.00 USD
✓
报价已提交!

我们将在 24 小时内回复您的邮件

1
询价已提交
2
已收到报价
3
已下单
4
支付
5
已发货
6
已送达
查看询价详情