EP4CE75F23I7N - Cyclone IV E FPGA, 75K LEs, 484-FBGA | Intel
料号： EP4CE75F23I7N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $175 | $175.00 |
| 10 | $158 | $1,580.00 |
| 100 | $142 | $14,200.00 |
| 500 | $128.5 | $64,250.00 |
| 1,000 | $118 | $118,000.00 |
EP4CE75F23I7N 概述
An FPGA (field-programmable gate array) is a programmable logic device whose architecture consists of an array of configurable logic blocks (CLBs), programmable interconnect, embedded memory blocks, multiplier/DSP blocks, and phase-locked loops. FPGAs sit above microcontrollers and fixed-function ASICs in the programmable-logic hierarchy, enabling hardware-level parallelism and per-design logic customization. The Cyclone IV E family targets cost-optimized applications such as industrial control, video bridging, automotive driver assistance, and low-cost ASIC prototyping.
Key features of the EP4CE75F23I7N include 75,408 logic elements, 4 PLLs for clock synthesis, 15 embedded 18x18 multipliers delivering up to ~300 MHz DSP performance, 2,810,880 bits of embedded M9K memory (312 blocks), 200 Kbits of distributed RAM, 292 user I/Os, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The 484-ball FBGA package (23 mm body, 1.0 mm pitch) supports high-density board designs while maintaining the Cyclone IV family's signature low power budget of roughly 150 mW per 100K LEs typical.
The device uses a 60 nm low-power CMOS process, runs Quartus II / Quartus Prime design-software support, and supports JTAG, Active Serial (AS), and Passive Serial (PS) configuration modes. Configuration memory is volatile; an external configuration device (typically EPCS16/EPCS64) is required to load the bitstream at power-up. The Cyclone IV E family is the lowest-cost member of the Cyclone IV line versus Cyclone IV GX which adds transceivers.
Typical applications include industrial machine vision and video bridging (HDMI/DVI/VGA interface conversion), factory-automation controllers with EtherCAT/Modbus interfaces, automotive infotainment and rear-view camera bridges, low-cost ASIC prototyping and emulation, motor-control loops with high-speed encoder feedback, and consumer-display controllers for LCD or LED panels.
When designing with this device, ensure the 484-ball FBGA land pattern is matched to manufacturer-recommended pad dimensions (typically 0.5 mm to 0.6 mm diameter with NSMD pads) and that the FPGA's decoupling network follows the Quartus Prime power-supply design guidelines - typically 100 nF and 10 uF capacitors per VCCINT/VCCIO rail plus a ferrite bead on supply entry.
This page synthesizes distributor pricing, drop-in alternatives from the Cyclone IV E family, comparison data, and practical design notes not found in a single place in the manufacturer datasheet.
直接替换替代料： EP4CE75F23I7N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP4CE75F23I7N （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Process Technology, Configuration Modes, Family.
快速对比工具——选择替代料号进行并排对比：
EP4CE75F23I7
✅ 直接替换✓ 有现货
$220.4 / 个
查看数据手册 →EP4CE75F23I8LN
✅ 直接替换✓ 有现货
$199.5 / 个
查看数据手册 →EP4CE75F23C8N
✅ 直接替换✓ 有现货
$42.3 / 个
查看数据手册 →EP4CE115F23I7N
✅ 直接替换✓ 有现货
$87.95 / 个
查看数据手册 →EP4CE55F23I7N
✅ 直接替换✓ 有现货
$130.4 / 个
查看数据手册 →EP4CE40F23I7N
✅ 直接替换✓ 有现货
$52.75 / 个
查看数据手册 →EP4CE75F23I7N 最大额定值与电气特性
| Product Line | Cyclone IV E |
| Family | Cyclone IV E (EP4CE) |
| Logic Elements (LEs) | 75,408 |
| Logic Array Blocks (LABs) | 4,713 |
| Embedded Memory Bits | 2,810,880 bits (312 M9K blocks) |
| Distributed RAM Bits | 200 Kbits |
| Embedded 18x18 Multipliers | 15 |
| PLLs | 4 |
| Maximum User I/Os | 292 |
| Core Voltage (VCCINT) | 1.2 V nominal |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
| Process Technology | 60 nm low-power CMOS |
| 封装 | 484-ball FBGA (F23, 23 mm body, 1.0 mm pitch) |
| Operating Temperature Grade | Industrial (I7: -40C to +100C Tj) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG |
| External Memory Interfaces | DDR / DDR2 SDRAM, QDRII SRAM |
| Design Software | Quartus II / Quartus Prime |
| RoHS 状态 | Compliant |
EP4CE75F23I7N 484-ball fbga (f23, 23 mm body, 1.0 mm pitch) 引脚配置指南
EP4CE75F23I7N（484-ball fbga (f23, 23 mm body, 1.0 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP4CE75F23I7N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP4CE75F23I7N 适用于 6 应用s: Industrial Machine Vision and Video Bridging, Factory Automation Controllers (EtherCAT/Modbus), Automotive Infotainment and Rear-View Camera Bridges, Low-Cost ASIC Prototyping and Emulation, Motor-Control Loops with Encoder Feedback, Consumer Display Controllers (LCD / LED Panels).
Industrial Machine Vision and Video Bridging
The EP4CE75F23I7N fits machine-vision and video-bridging designs because its 75,408 logic elements and 15 embedded 18x18 multipliers handle real-time pixel processing at common camera resolutions (VGA, 720p, 1080p) while four PLLs synthesize the multiple clock domains needed for HDMI/DVI/VGA/LVDS interfaces. With 292 user I/Os and external memory support for DDR/DDR2 SDRAM, the part captures video from a sensor, scales and color-converts it, and drives an HDMI transmitter IC such as the ADV7513 without external frame-buffer logic. The industrial -40C to +100C operating range allows deployment in factory-floor enclosures without thermal screening.
推荐
Factory Automation Controllers (EtherCAT/Modbus)
Industrial EtherCAT and Modbus fieldbus controllers benefit from the EP4CE75F23I7N's combination of high logic count and deterministic low-latency parallel processing. The 4 PLLs synthesize the 100 Mbps PHY clocks for EtherCAT slave controllers with sub-microsecond jitter, and the 15 embedded multipliers accelerate field-oriented control (FOC) math for direct motor-drive feedback loops. With 292 user I/Os the part can manage multi-axis servo drive control plus industrial I/O expansion. Industrial-grade -40C to +100C operation is required for cabinet installations near motor drives.
推荐
Automotive Infotainment and Rear-View Camera Bridges
The EP4CE75F23I7N is well-suited for automotive infotainment back-end processing because it bridges BT.656 / LVDS / MIPI-CSI camera inputs to LVDS / OpenLDI / i.LINK display outputs at low BOM cost versus ASSPs. The 75,408 LEs implement on-the-fly image scaling, color-space conversion, and overlay blending while four PLLs generate the precise display timing clocks. Its -40C to +100C operating junction range supports center-console and rear-camera electronics, although AEC-Q100 qualification should be confirmed with the manufacturer for safety-critical applications. Designers typically pair this part with an external DDR2 SDRAM for line buffers.
推荐
Low-Cost ASIC Prototyping and Emulation
With 75,408 logic elements, 2.8 Mbits of M9K memory, and 292 user I/Os, the EP4CE75F23I7N serves as a mid-density ASIC prototyping platform. Designers targeting ASICs in the 30K-60K gate-equivalent range can map their RTL into the FPGA, validate functional and timing behaviour at near-ASIC speeds, then transition the design to a foundry with low risk. The four PLLs and DDR/DDR2 memory controllers help replicate real-world interface timing. Industrial-grade temperature rating supports in-vehicle and edge-device validation campaigns.
推荐
Motor-Control Loops with Encoder Feedback
The EP4CE75F23I7N implements multi-axis field-oriented control (FOC) loops where high-resolution encoder feedback (typically 1 MHz line frequency or higher) requires deterministic sub-microsecond interrupt latency. Its 15 embedded 18x18 multipliers execute Clarke/Park transforms, space-vector modulators, and PI loops at 50-100 kHz PWM rates, while the four PLLs derive the PWM switching frequencies and the encoder sampling clocks. The 292 user I/Os handle multi-axis PWM outputs, encoder inputs, and isolation-driver interfaces. Industrial-temperature operation is required for servo-amplifier cabinet deployments.
推荐
Consumer Display Controllers (LCD / LED Panels)
The EP4CE75F23I7N drives mid-resolution LCD and LED display panels by accepting HDMI/DVI/VGA inputs, scaling the image to the panel's native resolution, and timing the LVDS or eDP output with sub-pixel precision. With 75,408 LEs the part implements scalers, color-management engines, and on-screen-display (OSD) overlays; 292 user I/Os accommodate multi-channel LVDS pairs and backlight control. Industrial-temperature operation is suitable for kiosk and digital-signage installations; commercial-temperature C8N grade is sufficient for indoor consumer displays.
推荐
推荐产品汇总
工程参考数据： EP4CE75F23I7N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP4CE75F23I7 | EP4CE75F23I8LN | EP4CE75F23C8N | EP4CE115F23I7N | EP4CE55F23I7N | EP4CE40F23I7N |
|---|---|---|---|---|---|---|---|
| Package | FBGA-484 (F23, 23 mm, 1.0 mm pitch) | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 75,408 | 75,408 (same die) | 75,408 (same die) | 75,408 (same die) | 114,480 (+52%) | 55,896 (-26%) | 39,600 (-48%) |
| Embedded Memory Bits | 2,810,880 (312 M9K blocks) | 2,810,880 (same) | 2,810,880 (same) | 2,810,880 (same) | 3,981,312 (+42%) | 2,340,000 (-17%) | 1,161,216 (-59%) |
| Embedded 18x18 Multipliers | 15 | 15 (same) | 15 (same) | 15 (same) | 28 (+87%) | 13 (-13%) | 8 (-47%) |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Maximum User I/Os | 292 | 292 | 292 | 292 | 292 | 324 (+11%) | 328 (+12%) |
| Operating Temperature | Industrial (I7: -40C to +100C) | Industrial (I7) - same | Industrial (I8: -40C to +105C) - wider | Commercial (C8: 0C to +85C) | Industrial (I7) - same | Industrial (I7) - same | Industrial (I7) - same |
| RoHS Compliance | Yes (lead-free, 'N' suffix) | No (Pb-containing) | Yes | Yes | Yes | Yes | Yes |
关键差异点
- RoHS-compliant industrial-temperature grade in 484-FBGA （对比 EP4CE75F23I7)
- Highest logic-element count in same F23 footprint family （对比 EP4CE115F23I7N)
- 15 embedded multipliers with industrial temperature grade （对比 EP4CE75F23C8N)
设计说明
The 484-ball FBGA package uses a 1.0 mm ball pitch on a 23 mm body. Use NSMD (non-solder-mask-defined) pads of approximately 0.5-0.55 mm diameter with 0.10 mm solder-mask clearance to maximize pad-to-pad spacing and improve manufacturability. Microvia (0.1 mm/0.2 mm) technology with via-in-pad is recommended for inner balls; outer rows can use conventional 0.2 mm through-vias. Follow IPC-7351 and IPC-SM-782 guidelines for FBGA land pattern. Maintain at least 8 layers with continuous VCCINT and GND planes directly beneath the BGA for power delivery and thermal dissipation.
Estimated: at full logic utilization (75% toggle rate, 75C ambient), the EP4CE75F23I7N consumes approximately 1.2-1.8 W from VCCINT (1.2 V) and additional dynamic current from VCCIO banks (1.2 V to 3.3 V). Apply the Quartus Prime PowerPlay Early Power Estimator (EPE) spreadsheet during design to obtain an accurate figure for your specific utilization. Decoupling: place one 100 nF X7R 0402 ceramic capacitor within 1 mm of every VCCINT/VCCIO ball pair, plus 10 uF X5R 0805 bulk capacitors per voltage rail (one per ~10-20 decoupling balls). Add a ferrite bead at each supply entry to filter board-level noise. All 1.2 V VCCINT balls MUST be connected for proper operation; floating VCCINT pins cause logic errors.
Differential-pair routing (LVDS, DDR memory clocks) must be 100 ohm differential impedance with intra-pair length matching of 50 mil or better. DDR/DDR2 memory interfaces should follow the Cyclone IV E external memory interface guidelines in the Intel/Altera EMIF documentation - DQ-DQS skew typically must be held under 50 ps within a byte lane. Place configuration-memory device (EPCS16 / EPCS64) within 2 inches of the FPGA's Active Serial (AS) interface pins (DATA0, DCLK, nCSO, ASDO) and route on inner layers with a continuous ground reference. Keep JTAG chain signals away from high-speed differential pairs to avoid coupling noise into boundary-scan mode.
Configuration failure modes: (1) MSEL[3:0] pins select Active Serial (AS), Passive Serial (PS), JTAG, or Fast Passive Parallel modes - incorrect MSEL strapping causes the FPGA to silently fail to configure. (2) The Cyclone IV E configuration memory is volatile - power-cycling without an external configuration device (EPCS16 / EPCS64 / EPCQ16) leaves the device unconfigured. (3) nCONFIG, nSTATUS, and CONF_DONE pins must be properly pulled up to VCCIO or driven by the host during multi-FPGAs configurations; floating pins cause intermittent startup. (4) I/O bank voltages must not be applied before VCCINT to prevent I/O latch-up.
合规信息
EP4CE75F23I7N carries the 'N' suffix indicating Pb-free / RoHS-compliant assembly per Intel/Altera ordering-code conventions. REACH and conflict-minerals compliance statements are published on the Intel product-compliance page. AEC-Q100 qualification status is not explicitly stated for this Cyclone IV E variant; consult Intel for safety-critical automotive applications.
