EP4CE55F23I7N - 55K LE Cyclone IV E FPGA 484-BGA | Intel
料号： EP4CE55F23I7N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $196.55 | $196.55 |
| 10 | $178.5 | $1,785.00 |
| 100 | $155.2 | $15,520.00 |
| 250 | $142 | $35,500.00 |
| 500 | $130.4 | $65,200.00 |
EP4CE55F23I7N 概述
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic, memory, and I/O blocks can be programmed by the end user to implement arbitrary digital functions. FPGAs sit in the programmable-logic layer of the digital design hierarchy - above fixed-function ASICs and microcontrollers in flexibility, below them in per-unit cost at very high volumes. The Cyclone IV E family is positioned for high-volume, cost-sensitive applications such as industrial control, video processing, and communications infrastructure, balancing logic density, DSP capability, and static power.
Key features of the EP4CE55F23I7N include 3,491 configurable logic blocks (CLBs) arranged as logic array blocks (LABs), 56 embedded 18x18 multipliers for moderate DSP throughput, 4 phase-locked loops (PLLs) for flexible clock management, and an industrial operating junction temperature range of -40C to +100C. The device supports a broad mix of I/O standards including LVDS, LVCMOS, SSTL, and HSTL, and offers dedicated DDR/DDR2/QDRII memory interfaces with hard PHY blocks to reduce soft-logic overhead.
Architecturally, the Cyclone IV E family uses a TSMC 60 nm low-power process with 1.2 V core operation, separately powered programmable I/O banks that each support single-ended and differential standards, and an on-chip configuration controller that supports JTAG, AS, PS, and FPP configuration modes. Hard IP blocks such as memory controllers and PLLs reduce soft-logic utilization and improve timing closure, while the 324 user I/Os are partitioned across 8 I/O banks for board-level signal-routing flexibility.
Typical applications include industrial machine vision, video surveillance and broadcast infrastructure, motor and motion control, automotive infotainment prototypes, wireline/wireless bridge and aggregation equipment, and medical imaging front-ends. The combination of high logic density and a generous user-I/O count makes the EP4CE55F23I7N particularly suitable for mid-range digital signal aggregation designs.
When designing with this part, plan thermal dissipation carefully - the 1.0 mm pitch FBGA requires a multi-layer PCB with via-in-pad and a solid ground/power plane stack-up. Quartus II (or Quartus Prime Lite) is required for synthesis, place-and-route, and timing analysis. Configuration memory size must be sized appropriately for the chosen bitstream compression setting.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： EP4CE55F23I7N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP4CE55F23I7N （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, Configuration Modes, Embedded 18x18 Multipliers.
快速对比工具——选择替代料号进行并排对比：
EP4CE55F23C7N
✅ 直接替换✓ 有现货
$56.4 / 个
查看数据手册 →EP4CE55F23C8N
✅ 直接替换✓ 有现货
$74 / 个
查看数据手册 →EP4CE55F29C7N
✅ 直接替换✓ 有现货
$138 / 个
查看数据手册 →EP4CE55U19I7N
✅ 直接替换✓ 有现货
$112.4 / 个
查看数据手册 →EP4CE55F23I7
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
联系询价
查看数据手册 →EP4CE55F23I7N 最大额定值与电气特性
| Series | Cyclone IV E |
| Logic Elements | 55,856 |
| Configurable Logic Blocks (CLBs) | 3,491 |
| Embedded Memory | 2,396,160 bits |
| Embedded 18x18 Multipliers | 56 |
| PLLs | 4 |
| Maximum User I/O | 324 |
| 封装 | 484-ball FBGA (23x23 mm, 1.0 mm pitch) |
| Process Technology | TSMC 60 nm low-power |
| Core Voltage | 1.2 V |
| 工作温度 | -40C to +100C (industrial, I7 grade) |
| 安装类型 | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (lead-free finish) |
| Configuration Modes | JTAG, AS, PS, FPP |
| Memory Interface Support | DDR, DDR2, QDRII |
EP4CE55F23I7N 484-ball fbga (23x23 mm, 1.0 mm pitch) 引脚配置指南
EP4CE55F23I7N（484-ball fbga (23x23 mm, 1.0 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP4CE55F23I7N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP4CE55F23I7N 适用于 6 应用s: Industrial Machine Vision, Video Surveillance and Broadcast Infrastructure, Motor and Motion Control, Automotive Infotainment Prototypes, Wireline/Wireless Bridge and Aggregation Equipment, Medical Imaging Front-Ends.
Industrial Machine Vision
The EP4CE55F23I7N is well matched to industrial machine vision systems because its 55,856 logic elements and 56 embedded 18x18 multipliers provide enough DSP throughput for Sobel, Gaussian, and basic convolution kernels at common camera resolutions. The 2,396,160 bits of embedded memory are sufficient for line buffers and small frame stores without external SRAM, while the 324 user I/Os across 8 banks comfortably accommodate parallel camera interfaces (Camera Link, parallel LVDS) plus GPIO for lighting and trigger control. Industrial -40C to +100C temperature range matches factory-floor deployment. Typical latency for a 1080p pipeline is well under one frame at 60 fps, and the Cyclone IV E static power stays below 1 W core for typical utilization.
推荐
Video Surveillance and Broadcast Infrastructure
Video surveillance encoders, broadcast glue logic, and SDI/HDMI bridge boards benefit from the EP4CE55F23I7N's high user-I/O count and DDR/DDR2 hard memory interface. The 324 user I/Os allow aggregation of multiple parallel video streams (e.g., four 1080p60 inputs) without external mux logic, and the hard DDR2 controller simplifies external DRAM interfacing for frame buffering. Industrial temperature grade and lead-free FBGA package suit sealed outdoor NVR enclosures. The 60 nm low-power process keeps total board power within PoE+ budgets for IP-camera designs.
推荐
Motor and Motion Control
The EP4CE55F23I7N serves as the central logic device in multi-axis motor and motion controllers, where it implements field-oriented control (FOC) loops, encoder decoding, and EtherCAT/CANopen slave logic. Its 56 18x18 multipliers handle the Park/Clarke transforms and PID loops for up to 4 axes at 20 kHz PWM, while the 4 PLLs generate jitter-free reference clocks for encoder interfaces and communication PHYs. The 324 user I/Os are sufficient for 4 channels of quadrature encoder inputs plus 4 channels of PWM/Enable outputs plus a 100 Mbps Ethernet MAC interface.
推荐
Automotive Infotainment Prototypes
Although the EP4CE55F23I7N is not AEC-Q100 qualified, it is widely used in pre-production automotive infotainment prototypes, head-unit demonstrators, and ADAS test platforms. The 55K LE capacity fits LVDS display aggregation, MOST network bridging, and surround-view camera stitching prototypes. The industrial -40C to +100C range matches cabin and trunk thermal environments for prototype validation. Designers typically migrate to automotive-grade Cyclone V or MAX 10 devices once the design reaches production intent.
推荐
Wireline/Wireless Bridge and Aggregation Equipment
Small-cell baseband cards, industrial gateways, and protocol-bridge routers use the EP4CE55F23I7N for serial-protocol aggregation (e.g., TDM-to-IP, RS-485-to-Ethernet, CAN-to-TCP). The FPGA sits between a network processor and multiple PHY devices, performing rate adaptation, framing, and timestamping. The hard DDR2 controller provides packet buffer memory, and the 4 PLLs synthesize the multiple reference clocks needed by Ethernet PHYs, SFP modules, and GPS-disciplined oscillators.
推荐
Medical Imaging Front-Ends
Ultrasound beamformers, endoscopy video processors, and patient-monitoring aggregators leverage the EP4CE55F23I7N for low-latency parallel data acquisition. The 56 embedded multipliers perform pre-beamformer FIR filtering, while the 2.4 Mbit of block memory implements per-channel sample delay lines. The 324 user I/Os are sufficient for 32-channel LVDS ADC interfaces plus a PCIe endpoint or USB 3.0 bridge. Industrial temperature grade suits the thermal envelope of cart-based diagnostic equipment.
推荐
推荐产品汇总
工程参考数据： EP4CE55F23I7N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP4CE55F23C7N | EP4CE55F23C8N | EP4CE55F23I7 |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F23, 23x23 mm, 1.0 mm pitch) | 484-ball FBGA (F23, 23x23 mm) | 484-ball FBGA (F23, 23x23 mm) | 484-ball FBGA (F23, 23x23 mm) |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 |
| Speed Grade | I7 (industrial, fast speed bin) | C7 (commercial, fast) | C8 (commercial, slower) | I7 (industrial, fast) |
| Operating Temperature | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Embedded Memory | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits |
| Embedded 18x18 Multipliers | 56 | 56 | 56 | 56 |
| Maximum User I/O | 324 | 324 | 324 | 324 |
| RoHS / Lead-Free | Yes | Yes | Yes | Yes (legacy code, may be Pb-bearing) |
关键差异点
- Mid-density sweet spot at 55K LE with 56 multipliers （对比 EP4CE30F23I7N)
- Industrial temperature grade for harsh environments （对比 EP4CE55F23C7N)
- 324 user I/Os across 8 banks for parallel interfaces （对比 EP4CE40F23I7N)
设计说明
The FBGA-484 at 1.0 mm pitch requires a multi-layer PCB (typically 6+ layers) with via-in-pad technology to route the inner balls and provide a thermal path to inner copper planes. Without thermal vias to an inner ground plane, junction-to-ambient thermal resistance (theta_JA) can exceed 20 C/W, risking thermal shutdown at high utilization. For designs running above 70% logic utilization or with sustained high toggle rates, attach a heatsink or use forced airflow. Use the Intel Early Power Estimator (EPE) tool with your specific resource utilization to size the thermal solution.
Route all 8 I/O banks to their dedicated bank power pins (VCCIO) - mixing standards across banks without independent VCCIO rails is impossible. Use a 0.1 uF decoupling capacitor within 3 mm of every VCC/VCCIO/VCCPD pin, and add 4.7 uF bulk capacitors per bank. For DDR2/DDR/QDRII interfaces, follow Intel's pinout guideline and match trace lengths within the listed tolerances. Keep clock PLL power pins (VCCA_PLL) on a quiet filtered rail with a ferrite bead.
Do not confuse the EP4CE55F23I7N with the EP4CE115F23I7N or EP4CE40F23I7N - they share the same F23 23x23 mm body but have different ball maps and are NOT pin-compatible. When migrating between Cyclone IV E densities, you must redesign the PCB. Also note that the EP4CE55F29C7N (F29 29x29 mm body) is a different package family and is NOT a drop-in. Always check the ordering part number carefully against the Intel Cyclone IV device handbook before committing to a footprint.
For LVDS inputs, provide a 100 ohm differential termination resistor placed within 7 mm of the FPGA receive pins. DDR2 memories require fly-by topology with source-synchronous timing; consult the Cyclone IV external memory interface guidelines. Keep high-speed serializer-deserializer (if implemented in soft logic) traces length-matched to within 20 ps. Series-stagger resistors on critical clock nets reduce reflections.
合规信息
RoHS and REACH compliant per Altera/Intel product page. Lead-free finish. Not AEC-Q100 qualified - automotive production should target Cyclone V or MAX 10 automotive grades.
