EP4SGX530KH40C2N - 531K LEs Stratix IV GX FPGA, 1517-FCBGA | Intel
料号： EP4SGX530KH40C2N ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4750 | $4,750.00 |
| 10 | $4520 | $45,200.00 |
| 50 | $4280 | $214,000.00 |
| 100 | $3995 | $399,500.00 |
| 500 | $3700 | $1,850,000.00 |
EP4SGX530KH40C2N 概述
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - itself a category of integrated circuit (IC) - that allows engineers to configure digital logic after manufacture using a hardware description language (HDL) or block-based design tool. FPGAs sit in the broader semiconductor taxonomy as: programmable logic -> digital IC -> integrated circuit -> semiconductor device. Unlike an ASIC, an FPGA is re-programmable in the field, which makes it ideal for evolving standards, low-volume ASIC prototyping, and DSP acceleration workloads. Within Altera/Intel's Stratix family, the GX variant adds high-speed serial transceivers specifically targeted at wired communications, broadcast video, and high-performance computing interconnect.
Key features include 24 DSP blocks totaling 1,024 18x18 multipliers, four hard PCI Express hard IP blocks (Gen1/Gen2), and an advanced modular I/O subsystem that supports LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards with on-die termination (OCT). Memory interfaces include dedicated hard controllers for DDR3, DDR2, QDR II, and RLDRAM II up to 800 MHz, simplifying external memory integration. The 40 nm process delivers favorable performance-per-watt versus the prior Stratix III generation while the Adaptive Logic Module (ALM) architecture improves logic utilization.
Typical applications include high-speed serial backplane bridging, 10G/40G Ethernet line cards, wireless baseband processing, ASIC prototyping in ASIC-emulation platforms, and test & measurement instrumentation. The combination of dense logic, abundant transceivers, and large embedded memory makes the EP4SGX530KH40C2N especially well-suited to designs that previously required multiple FPGAs or expensive ASICs.
When designing with this device, pay close attention to PCB signal integrity for the multi-gigabit transceivers (controlled impedance, length matching), provide a low-noise multi-rail power supply (typically 0.9 V core, 1.1 V/1.5 V/2.5 V/3.0 V aux/IO), and ensure the FCBGA thermal pad has sufficient copper pour and via array to meet the thermal envelope. Always download and consult the Stratix IV GX Handbook and the Pin Connection Guidelines before PCB layout.
This page consolidates distributor stock levels, drop-in alternative options from the Stratix IV GX family and competing families, and practical design notes that complement the manufacturer datasheet.
直接替换替代料： EP4SGX530KH40C2N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP4SGX530KH40C2N （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Process Technology, Transceivers, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EP4SGX530KH40C2
✅ 直接替换✓ 有现货
$2150 / 个
查看数据手册 →EP4SGX530KH40C4N
✅ 直接替换✓ 有现货
$3680 / 个
查看数据手册 →EP4SGX530KF43C2N
✅ 直接替换✓ 有现货
$3450 / 个
查看数据手册 →EP4S40G5H40I1N
✅ 直接替换📋 参考替代料（不在目录中）
EP4SGX530KH40C2N 最大额定值与电气特性
| Family | Stratix IV GX |
| Logic Elements | 531,200 |
| Logic Array Blocks (LABs) | 21,248 |
| Embedded Memory Bits | 28,033,024 |
| Adaptive Logic Modules (ALMs) | 212,480 |
| DSP Blocks | 24 |
| 18x18 Multipliers | 1,024 |
| Maximum User I/O Pins | 744 |
| Transceivers | Up to 48 (GX) |
| Maximum Transceiver Data Rate | 8.5 Gbps |
| PCI Express Hard IP Blocks | 4 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| 封装 | 1517-ball FCBGA (KH40) |
| 安装类型 | Surface Mount (flip-chip BGA) |
| 工作温度 | -40C to +100C (industrial) |
| RoHS 状态 | Compliant |
EP4SGX530KH40C2N 1517-ball fcbga (kh40) 引脚配置指南
EP4SGX530KH40C2N（1517-ball fcbga (kh40) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP4SGX530KH40C2N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP4SGX530KH40C2N 适用于 6 应用s: 10G/40G Ethernet Line Card, Wireless Baseband Processing, ASIC Prototyping and Emulation, High-Speed Serial Backplane Bridging, Test & Measurement Instrumentation, Industrial Imaging and Video Processing.
10G/40G Ethernet Line Card
The EP4SGX530KH40C2N's 531,200 logic elements and up to 48 multi-gigabit transceivers rated at 8.5 Gbps are well matched to 10 Gbps and 40 Gbps Ethernet line cards. In a typical design the FPGA implements the PCS layer, MAC, and bridging logic while the GX transceivers handle SERDES duties to SFP+, QSFP+, and backplane SFP modules. The hard PCI Express Gen2 blocks also enable direct attachment to a host CPU or switch ASIC. Power dissipation is non-trivial - engineers must budget 20-30 W for the FPGA alone and provide a 0.9 V core supply with tight DC tolerance.
推荐
Wireless Baseband Processing
With 1,024 18x18 multipliers and 24 DSP blocks, the EP4SGX530KH40C2N can implement multi-antenna LTE, WiMAX, or proprietary baseband DSP functions in a single device. The 28,033,024 bits of embedded RAM support chip-rate buffering for de-spreading and FFT blocks, while the GX transceivers interface directly to CPRI/OBSAI links to the radio unit. Designers pair the FPGA with external DDR3 SDRAM via the hard memory controller, allowing multi-carrier aggregation without an external ASIC.
推荐
ASIC Prototyping and Emulation
The 531,200 logic elements and abundant interconnect make the EP4SGX530KH40C2N a popular building block for ASIC and SoC prototyping platforms that wire several FPGAs together. Designers partition RTL across multiple EP4SGX530 devices and use the GX transceivers to shuttle multi-gigabit streams between FPGAs, emulating ASIC clock domains and bus widths before tape-out. Quartus Prime supports the TimeQuest timing analyzer to close timing across the partitioned design. With 28 Mb of embedded memory each, the emulation cluster can model deep register files and large FIFO queues.
推荐
High-Speed Serial Backplane Bridging
Use the EP4SGX530KH40C2N as a protocol-agnostic bridge across ATCA, MicroTCA, or proprietary backplanes. The 48 GX transceivers carry multiple lanes of XAUI, Serial RapidIO, or PCIe Gen2 between line cards, while the 531,200 LEs implement the bridging state machine, buffer management, and link-training logic. The hard PCI Express blocks simplify Root Complex or Endpoint integration. Board designers must follow the Stratix IV GX pin connection guidelines for the KH40 package and provide matched-length differential pairs.
推荐
Test & Measurement Instrumentation
Test equipment manufacturers deploy the EP4SGX530KH40C2N in protocol analyzers, logic analyzers, and high-speed digitizers that need dense logic to capture and process data in real time. The 1,024 multipliers accelerate DSP functions such as FFTs and FIR filters, while the 28 Mb of RAM store deep acquisition buffers. The GX transceivers stream digitized data to host CPUs at line rate. The KH40 FCBGA package supports the fine ball pitch required by today's 12.5 Gbps+ instrumentation front ends.
推荐
Industrial Imaging and Video Processing
The EP4SGX530KH40C2N's combination of high logic density, 24 DSP blocks, and high-speed transceivers suits real-time image processing pipelines such as multi-stream HD/4K video analysis, machine vision, and medical imaging pre-processing. The FPGA absorbs Bayer demosaicing, color correction, and feature-extraction stages while the transceivers push processed frames to downstream processors over CoaXPress or proprietary links. Industrial temperature grade (-40C to +100C) allows deployment in factory automation cells.
推荐
推荐产品汇总
工程参考数据： EP4SGX530KH40C2N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP4SGX530KH40C2 | EP4SGX530KH40C4N | EP4SGX530KF43C2N | EP4S40G5H40I1N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1517-ball FCBGA (KH40) | 1517-ball FCBGA (KH40) | 1517-ball FCBGA (KH40) | 1517-ball FCBGA (KF43) | 1517-Pin FC-HFBGA |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| Speed Grade | -2 (C2) | -2 (C2) | -4 (C4) | -2 (C2) | -1 industrial (I1) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.95 V |
| Transceiver Data Rate | Up to 8.5 Gbps | Up to 8.5 Gbps | Up to 8.5 Gbps | Up to 8.5 Gbps | Up to 11.3 Gbps (GT family) |
| Embedded Memory Bits | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 |
| RoHS Compliance | Yes (N suffix) | No (leaded finish) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| Lifecycle Status | Last-time-buy | Obsolete | Last-time-buy | Last-time-buy | Last-time-buy |
关键差异点
- Highest logic density in the Stratix IV GX family （对比 EP4SGX360KF40C2N)
- Faster speed grade than the C4 variant （对比 EP4SGX530KH40C4N)
- Lower power consumption than the industrial I1 grade GT family （对比 EP4S40G5H40I1N)
设计说明
Estimated: The KH40 1517-ball FCBGA has a 1.0 mm ball pitch and requires high-density interconnect PCB (typically 12+ layer stack-up with stacked micro-vias under the BGA). Provide a continuous ground reference plane beneath the BGA, matched-length differential pair routing for the GX transceivers (typically +/-5 mil tolerance), and 100-ohm differential impedance for SERDES lanes. The exposed die pad must have a full-array via pattern to ground for thermal dissipation; missing vias will trigger thermal runaway at full utilization.
The EP4SGX530KH40C2N requires multiple power rails: 0.9 V VCC (core), 1.1 V VCCPT, 1.5 V/2.5 V/3.0 V VCCIO banks, and the VCCL_GXB/L_GXB rails for the transceivers. Estimated: total power at 85% utilization with 48 transceivers at 8.5 Gbps reaches 25-30 W. Use a multi-phase PWM controller such as the LTM4677 or ISL8277 to deliver 30+ A on the 0.9 V rail with tight +/-3% regulation. Decouple each rail with 0402 0.1 uF X7R capacitors placed within 100 mil of every supply pin.
Do not power the FPGA without programming a configuration image or asserting a valid MSEL pin state - leaving the device unconfigured can cause high I/O leakage through unterminated banks. Always download the Stratix IV GX pin connection guidelines PDF before PCB layout: missing the VCCPD reference voltage or the RREF resistor is a common board-rework cause. When migrating from a -2 to a -4 speed grade, re-run TimeQuest to confirm timing closure on critical paths.
Estimated: at 25 W total power dissipation and a 4-layer PCB with 4 thermal vias under the BGA, junction-to-ambient thermal resistance is roughly 1.5 C/W, giving a 38 C temperature rise above 25 C ambient. At 85 C ambient this reaches the 100 C junction limit. Add a heatsink or 8+ layer PCB with dense via array to extend thermal headroom. Use the Quartus Prime PowerPlay Early Power Estimator (EPE) spreadsheet before PCB commitment.
合规信息
RoHS compliance indicated by N suffix. AEC-Q100 is not applicable - this is a programmable logic device rather than an automotive-grade IC. Conflict-minerals compliance per Intel standard supplier disclosures.
