EP4SGX530KH40C2N - 531K LEs Stratix IV GX FPGA, 1517-FCBGA | Intel
부품 번호: EP4SGX530KH40C2N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4750 | $4,750.00 |
| 10 | $4520 | $45,200.00 |
| 50 | $4280 | $214,000.00 |
| 100 | $3995 | $399,500.00 |
| 500 | $3700 | $1,850,000.00 |
EP4SGX530KH40C2N 개요
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - itself a category of integrated circuit (IC) - that allows engineers to configure digital logic after manufacture using a hardware description language (HDL) or block-based design tool. FPGAs sit in the broader semiconductor taxonomy as: programmable logic -> digital IC -> integrated circuit -> semiconductor device. Unlike an ASIC, an FPGA is re-programmable in the field, which makes it ideal for evolving standards, low-volume ASIC prototyping, and DSP acceleration workloads. Within Altera/Intel's Stratix family, the GX variant adds high-speed serial transceivers specifically targeted at wired communications, broadcast video, and high-performance computing interconnect.
Key features include 24 DSP blocks totaling 1,024 18x18 multipliers, four hard PCI Express hard IP blocks (Gen1/Gen2), and an advanced modular I/O subsystem that supports LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards with on-die termination (OCT). Memory interfaces include dedicated hard controllers for DDR3, DDR2, QDR II, and RLDRAM II up to 800 MHz, simplifying external memory integration. The 40 nm process delivers favorable performance-per-watt versus the prior Stratix III generation while the Adaptive Logic Module (ALM) architecture improves logic utilization.
Typical applications include high-speed serial backplane bridging, 10G/40G Ethernet line cards, wireless baseband processing, ASIC prototyping in ASIC-emulation platforms, and test & measurement instrumentation. The combination of dense logic, abundant transceivers, and large embedded memory makes the EP4SGX530KH40C2N especially well-suited to designs that previously required multiple FPGAs or expensive ASICs.
When designing with this device, pay close attention to PCB signal integrity for the multi-gigabit transceivers (controlled impedance, length matching), provide a low-noise multi-rail power supply (typically 0.9 V core, 1.1 V/1.5 V/2.5 V/3.0 V aux/IO), and ensure the FCBGA thermal pad has sufficient copper pour and via array to meet the thermal envelope. Always download and consult the Stratix IV GX Handbook and the Pin Connection Guidelines before PCB layout.
This page consolidates distributor stock levels, drop-in alternative options from the Stratix IV GX family and competing families, and practical design notes that complement the manufacturer datasheet.
드롭인 대체품: EP4SGX530KH40C2N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX530KH40C2N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, Transceivers, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX530KH40C2
✅ 드롭인✓ 재고 있음
$2150 / 개
데이터시트 보기 →EP4SGX530KH40C4N
✅ 드롭인✓ 재고 있음
$3680 / 개
데이터시트 보기 →EP4SGX530KF43C2N
✅ 드롭인✓ 재고 있음
$3450 / 개
데이터시트 보기 →EP4S40G5H40I1N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4SGX530KH40C2N 최대 정격 & 전기적 특성
| Family | Stratix IV GX |
| Logic Elements | 531,200 |
| Logic Array Blocks (LABs) | 21,248 |
| Embedded Memory Bits | 28,033,024 |
| Adaptive Logic Modules (ALMs) | 212,480 |
| DSP Blocks | 24 |
| 18x18 Multipliers | 1,024 |
| Maximum User I/O Pins | 744 |
| Transceivers | Up to 48 (GX) |
| Maximum Transceiver Data Rate | 8.5 Gbps |
| PCI Express Hard IP Blocks | 4 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| 패키지 | 1517-ball FCBGA (KH40) |
| 실장 유형 | Surface Mount (flip-chip BGA) |
| 동작 온도 | -40C to +100C (industrial) |
| RoHS 상태 | Compliant |
EP4SGX530KH40C2N 1517-ball fcbga (kh40) 핀 구성 가이드
EP4SGX530KH40C2N(1517-ball fcbga (kh40) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX530KH40C2N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX530KH40C2N 적합 용도: 6 애플리케이션s: 10G/40G Ethernet Line Card, Wireless Baseband Processing, ASIC Prototyping and Emulation, High-Speed Serial Backplane Bridging, Test & Measurement Instrumentation, Industrial Imaging and Video Processing.
10G/40G Ethernet Line Card
The EP4SGX530KH40C2N's 531,200 logic elements and up to 48 multi-gigabit transceivers rated at 8.5 Gbps are well matched to 10 Gbps and 40 Gbps Ethernet line cards. In a typical design the FPGA implements the PCS layer, MAC, and bridging logic while the GX transceivers handle SERDES duties to SFP+, QSFP+, and backplane SFP modules. The hard PCI Express Gen2 blocks also enable direct attachment to a host CPU or switch ASIC. Power dissipation is non-trivial - engineers must budget 20-30 W for the FPGA alone and provide a 0.9 V core supply with tight DC tolerance.
추천
Wireless Baseband Processing
With 1,024 18x18 multipliers and 24 DSP blocks, the EP4SGX530KH40C2N can implement multi-antenna LTE, WiMAX, or proprietary baseband DSP functions in a single device. The 28,033,024 bits of embedded RAM support chip-rate buffering for de-spreading and FFT blocks, while the GX transceivers interface directly to CPRI/OBSAI links to the radio unit. Designers pair the FPGA with external DDR3 SDRAM via the hard memory controller, allowing multi-carrier aggregation without an external ASIC.
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ASIC Prototyping and Emulation
The 531,200 logic elements and abundant interconnect make the EP4SGX530KH40C2N a popular building block for ASIC and SoC prototyping platforms that wire several FPGAs together. Designers partition RTL across multiple EP4SGX530 devices and use the GX transceivers to shuttle multi-gigabit streams between FPGAs, emulating ASIC clock domains and bus widths before tape-out. Quartus Prime supports the TimeQuest timing analyzer to close timing across the partitioned design. With 28 Mb of embedded memory each, the emulation cluster can model deep register files and large FIFO queues.
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High-Speed Serial Backplane Bridging
Use the EP4SGX530KH40C2N as a protocol-agnostic bridge across ATCA, MicroTCA, or proprietary backplanes. The 48 GX transceivers carry multiple lanes of XAUI, Serial RapidIO, or PCIe Gen2 between line cards, while the 531,200 LEs implement the bridging state machine, buffer management, and link-training logic. The hard PCI Express blocks simplify Root Complex or Endpoint integration. Board designers must follow the Stratix IV GX pin connection guidelines for the KH40 package and provide matched-length differential pairs.
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Test & Measurement Instrumentation
Test equipment manufacturers deploy the EP4SGX530KH40C2N in protocol analyzers, logic analyzers, and high-speed digitizers that need dense logic to capture and process data in real time. The 1,024 multipliers accelerate DSP functions such as FFTs and FIR filters, while the 28 Mb of RAM store deep acquisition buffers. The GX transceivers stream digitized data to host CPUs at line rate. The KH40 FCBGA package supports the fine ball pitch required by today's 12.5 Gbps+ instrumentation front ends.
추천
Industrial Imaging and Video Processing
The EP4SGX530KH40C2N's combination of high logic density, 24 DSP blocks, and high-speed transceivers suits real-time image processing pipelines such as multi-stream HD/4K video analysis, machine vision, and medical imaging pre-processing. The FPGA absorbs Bayer demosaicing, color correction, and feature-extraction stages while the transceivers push processed frames to downstream processors over CoaXPress or proprietary links. Industrial temperature grade (-40C to +100C) allows deployment in factory automation cells.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX530KH40C2N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX530KH40C2 | EP4SGX530KH40C4N | EP4SGX530KF43C2N | EP4S40G5H40I1N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1517-ball FCBGA (KH40) | 1517-ball FCBGA (KH40) | 1517-ball FCBGA (KH40) | 1517-ball FCBGA (KF43) | 1517-Pin FC-HFBGA |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| Speed Grade | -2 (C2) | -2 (C2) | -4 (C4) | -2 (C2) | -1 industrial (I1) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.95 V |
| Transceiver Data Rate | Up to 8.5 Gbps | Up to 8.5 Gbps | Up to 8.5 Gbps | Up to 8.5 Gbps | Up to 11.3 Gbps (GT family) |
| Embedded Memory Bits | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 | 28,033,024 |
| RoHS Compliance | Yes (N suffix) | No (leaded finish) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| Lifecycle Status | Last-time-buy | Obsolete | Last-time-buy | Last-time-buy | Last-time-buy |
주요 차별점
- Highest logic density in the Stratix IV GX family (vs EP4SGX360KF40C2N)
- Faster speed grade than the C4 variant (vs EP4SGX530KH40C4N)
- Lower power consumption than the industrial I1 grade GT family (vs EP4S40G5H40I1N)
설계 노트
Estimated: The KH40 1517-ball FCBGA has a 1.0 mm ball pitch and requires high-density interconnect PCB (typically 12+ layer stack-up with stacked micro-vias under the BGA). Provide a continuous ground reference plane beneath the BGA, matched-length differential pair routing for the GX transceivers (typically +/-5 mil tolerance), and 100-ohm differential impedance for SERDES lanes. The exposed die pad must have a full-array via pattern to ground for thermal dissipation; missing vias will trigger thermal runaway at full utilization.
The EP4SGX530KH40C2N requires multiple power rails: 0.9 V VCC (core), 1.1 V VCCPT, 1.5 V/2.5 V/3.0 V VCCIO banks, and the VCCL_GXB/L_GXB rails for the transceivers. Estimated: total power at 85% utilization with 48 transceivers at 8.5 Gbps reaches 25-30 W. Use a multi-phase PWM controller such as the LTM4677 or ISL8277 to deliver 30+ A on the 0.9 V rail with tight +/-3% regulation. Decouple each rail with 0402 0.1 uF X7R capacitors placed within 100 mil of every supply pin.
Do not power the FPGA without programming a configuration image or asserting a valid MSEL pin state - leaving the device unconfigured can cause high I/O leakage through unterminated banks. Always download the Stratix IV GX pin connection guidelines PDF before PCB layout: missing the VCCPD reference voltage or the RREF resistor is a common board-rework cause. When migrating from a -2 to a -4 speed grade, re-run TimeQuest to confirm timing closure on critical paths.
Estimated: at 25 W total power dissipation and a 4-layer PCB with 4 thermal vias under the BGA, junction-to-ambient thermal resistance is roughly 1.5 C/W, giving a 38 C temperature rise above 25 C ambient. At 85 C ambient this reaches the 100 C junction limit. Add a heatsink or 8+ layer PCB with dense via array to extend thermal headroom. Use the Quartus Prime PowerPlay Early Power Estimator (EPE) spreadsheet before PCB commitment.
규정 준수 정보
RoHS compliance indicated by N suffix. AEC-Q100 is not applicable - this is a programmable logic device rather than an automotive-grade IC. Conflict-minerals compliance per Intel standard supplier disclosures.
