EP4SGX530NF45C4 - Stratix IV GX 531K LE FPGA, 920 I/O | Intel
料号： EP4SGX530NF45C4 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $9058.01 | $9,058.01 |
| 10 | $8152.21 | $81,522.10 |
| 100 | $7246.41 | $724,641.00 |
| 500 | $6339.41 | $3,169,705.00 |
| 1,000 | $5434.81 | $5,434,810.00 |
EP4SGX530NF45C4 概述
A Field Programmable Gate Array (FPGA) is a programmable logic device whose architecture combines configurable logic blocks (LABs/LEs), programmable interconnect, dedicated DSP blocks, on-chip memory, and (in GX variants) multi-gigabit transceivers. Stratix IV GX sits within Intel/Altera's high-end FPGA hierarchy as a 40 nm transceive-capable family: FPGA > programmable logic > SRAM-based configuration > Stratix IV > GX transceiver series. The architecture enables hardware-level parallelism for DSP, packet processing, and ASIC prototyping without sacrificing I/O density.
Key features of the EP4SGX530NF45C4 include 531,200 logic elements, 28 Mb embedded memory, integrated 8.5 Gbps multi-gigabit transceivers (Stratix IV GX family), 920 high-speed user I/O lanes, embedded DSP blocks for fixed/floating-point arithmetic, and hard PCIe Gen1/Gen2 IP cores. The -C4 speed grade balances timing margin and Fmax, while the NF45 (1932-ball, 42.5 x 42.5 mm) package maximizes I/O density for line-card and backplane designs.
Typical applications include 40G/100G optical transport line cards, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, XAUI, SFI), ASIC prototyping, broadcast video processing, radar and signal-intelligence front-ends, and high-performance computing (HPC) fabric. Industrial and military-aerospace variants in the Stratix IV family deliver extended temperature ranges and ruggedized packaging.
When designing with this device, plan power integrity carefully - the FC-FBGA substrate demands a 12+ layer PCB with continuous ground and dedicated decoupling per transceiver bank. JTAG and active serial configuration via EPCS flash is recommended for production. Lead-free and RoHS compliant per Intel product declaration.
This page synthesizes distributor pricing, package-specific drop-in alternatives, and engineering trade-offs not found in the standalone datasheet, enabling faster sourcing and design-in decisions.
直接替换替代料： EP4SGX530NF45C4 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP4SGX530NF45C4 （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Process Technology, Operating Temperature, Embedded Memory.
快速对比工具——选择替代料号进行并排对比：
EP4SGX530NF45C3N
✅ 直接替换✓ 有现货
$9850 / 个
查看数据手册 →EP4SGX530NF45C2N
✅ 直接替换✓ 有现货
$9450 / 个
查看数据手册 →EP4SGX530NF45I4N
✅ 直接替换✓ 有现货
$11800 / 个
查看数据手册 →EP4SGX530NF45C3
✅ 直接替换✓ 有现货
$3450 / 个
查看数据手册 →EP4SGX530NF45C3G
✅ 直接替换✓ 有现货
$3655 / 个
查看数据手册 →EP4SGX530NF45C2NES
✅ 直接替换✓ 有现货
$3950 / 个
查看数据手册 →EP4SGX530NF45C2
✅ 直接替换✓ 有现货
$11650 / 个
查看数据手册 →EP4SGX530NF45C4 最大额定值与电气特性
| Device Family | Stratix IV GX |
| Logic Elements | 531,200 |
| Logic Array Blocks (LABs) | 21,248 |
| Embedded Memory Bits | 28,033,024 (28 Mb) |
| User I/O Count | 920 |
| Maximum Internal Frequency | 800 MHz |
| Process Technology | 40 nm CMOS |
| Core Supply Voltage | 0.9 V |
| 封装 | 1932-ball Flip-Chip BGA (FC-FBGA), 42.5 x 42.5 mm |
| Speed Grade | C4 |
| 工作温度 | 0 C to +85 C (Commercial) |
| 安装类型 | Surface Mount (FC-BGA) |
| Transceivers | Multi-gigabit transceivers (GX family) |
| RoHS 状态 | Compliant |
EP4SGX530NF45C4 1932-ball flip-chip bga (fc-fbga), 42.5 x 42.5 mm 引脚配置指南
EP4SGX530NF45C4（1932-ball flip-chip bga (fc-fbga), 42.5 x 42.5 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP4SGX530NF45C4.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP4SGX530NF45C4 适用于 6 应用s: 40G/100G Optical Transport Line Cards, PCIe Gen2 Endpoint and Switch Bridging, ASIC Prototyping and Emulation, Broadcast Video Processing and Routing, Radar and Signal-Intelligence Front-End, High-Performance Computing (HPC) Fabric Bridges.
40G/100G Optical Transport Line Cards
The EP4SGX530NF45C4's 531,200 logic elements and 28 Mb embedded memory provide the parallel fabric needed for OTU4/100G framer, MAC, and forward-error-correction (FEC) logic. Its multi-gigabit transceivers reach 8.5 Gbps per lane, sufficient for SFI/SFP+ and CAUI-4 interfaces without external PHY chips. The 920 user I/O exposes wide external memory buses (DDR3/QDR-IV) for line-rate packet buffers. Recommended companion: external 100G Gearbox or optical module.
推荐
PCIe Gen2 Endpoint and Switch Bridging
The Stratix IV GX hard IP cores for PCIe Gen1/Gen2 (x1/x4/x8) make the EP4SGX530NF45C4 ideal for PCIe-to-RapidIO or PCIe-to-Ethernet bridging ASICs. The 920 user I/O and abundant DSP blocks handle protocol translation, DMA engines, and scatter-gather logic in a single device. Recommended companion: external PCIe Gen2 PHY or switch.
推荐
ASIC Prototyping and Emulation
With 531K logic elements, 21,248 LABs, and 28 Mb memory, the EP4SGX530NF45C4 emulates ASICs up to 50M ASIC gates when partitioned across multiple Stratix IV devices. The 920 user I/O and abundant transceivers let ASIC test vectors be applied at high speed. This makes it a preferred platform for ASIC bring-up, software development, and architectural validation prior to silicon tape-out.
推荐
Broadcast Video Processing and Routing
The 28 Mb embedded memory and high fabric throughput allow the EP4SGX530NF45C4 to handle uncompressed 3G-SDI/HD-SDI routing, format conversion, and on-screen-display mixing in production switchers. The 920 user I/O connects to SDI deserializer/serializer PHYs and HDMI/DisplayPort bridges. Its commercial 0-85C grade suits air-cooled video router chassis.
推荐
Radar and Signal-Intelligence Front-End
The Stratix IV GX transceivers and DSP blocks deliver the FIR/FFT throughput required for phased-array radar beamforming and wideband SIGINT capture. At 800 MHz fabric performance, the EP4SGX530NF45C4 implements channelizers, polyphase filters, and pulse-compression logic. The 1932-ball BGA enables dense PCB integration in 6U VPX and ATR chassis used in airborne platforms.
推荐
High-Performance Computing (HPC) Fabric Bridges
The EP4SGX530NF45C4 serves as a low-latency bridge between InfiniBand QDR, 10/40G Ethernet, and proprietary HPC interconnects. The combination of high-speed transceivers, 920 user I/O, and 28 Mb memory fabric enables cut-through switching and credit-based flow control in HPC cluster fabrics. The commercial temperature grade is ideal for climate-controlled data centers.
推荐
推荐产品汇总
工程参考数据： EP4SGX530NF45C4 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP4SGX530NF45C3N | EP4SGX530NF45C2N | EP4SGX530NF45I4N | EP4SGX530NF45C3G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FC-FBGA (NF45) | 1932-ball FC-FBGA (NF45) - same | 1932-ball FC-FBGA (NF45) - same | 1932-ball FC-FBGA (NF45) - same | 1932-ball FC-FBGA (NF45) - same |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| Speed Grade | C4 | C3 | C2 | I4 | C3 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Embedded Memory | 28 Mb (28,033,024 bits) | 28 Mb | 28 Mb | 28 Mb | 28 Mb |
| User I/O | 920 | 920 | 920 | 920 | 920 |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes |
关键差异点
- Highest-density Stratix IV GX with maximum I/O and transceiver count （对比 EP4SGX230KF40C2N)
- Same NF45 BGA pinout across speed grades - true drop-in scalability （对比 EP4SGX530NF45C3N)
- Industrial temperature variant exists in same package （对比 EP4SGX530NF45I4N)
设计说明
Estimated: At a typical Stratix IV GX 530 power envelope of 25-30W, the FC-FBGA NF45 package requires a high-performance thermal interface material (TIM) and a heatsink with at least 0.5 C/W thermal resistance. Input values used: 25W TDP, 70C max ambient. For closed-chassis deployments (40G line cards), forced-air cooling at 2-3 m/s is recommended; for outdoor or industrial variants, choose the EP4SGX530NF45I4N and derate at 70% max ambient.
Design a 12+ layer PCB with continuous ground planes beneath the BGA, dedicated transceiver power islands, and 100-ohm differential controlled impedance for all transceiver lanes. Decoupling: 1x 470uF bulk + 10x 22uF + 100x 100nF + 1000x 10nF distributed within the BGA footprint. Source: Intel Stratix IV GX PCB design guidelines.
Do not hot-swap configuration modes without resetting the device; use AS (active serial) mode with EPCS flash for production, JTAG for development. Transceiver reference clocks require dedicated low-jitter PLLs; sharing clocks between banks can degrade jitter margin below 8.5 Gbps compliance. Always validate timing closure in Quartus II before tape-out; -C4 timing models are conservative.
合规信息
RoHS compliant per Intel product declaration. AEC-Q100 is not applicable for FPGAs; automotive-grade variants do not exist for this part. Halogen-free status not explicitly stated in provided data.
