Intel

EP4SGX530NF45C4 - Stratix IV GX 531K LE FPGA, 920 I/O | Intel

부품 번호: EP4SGX530NF45C4 ✗ 단종

재고 있음 영업일 기준 1~3일 내 발송

0.9 V Vdss 1932-ball Flip-Chip BGA (FC-FBGA), 42.5 x 42.5 mm Package 800 MHz Speed 28,033,024 (28 Mb) Memory

시작가 $5434.81 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-10

볼륨 가격

수량	단가	합계
1	$9058.01	$9,058.01
10	$8152.21	$81,522.10
100	$7246.41	$724,641.00
500	$6339.41	$3,169,705.00
1,000	$5434.81	$5,434,810.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

EP4SGX530NF45C4 개요

The Intel (formerly Altera) EP4SGX530NF45C4 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) delivering 531,200 logic elements, 21,248 Logic Array Blocks (LABs), and 28,033,024 bits of embedded memory in a 1932-ball Flip-Chip BGA (FC-FBGA) package. Manufactured on a 40 nm process with a 0.9 V core supply, this transceiver-rich device integrates up to 920 user I/O pins and provides 800 MHz internal fabric performance, targeting high-throughput serial connectivity applications.

A Field Programmable Gate Array (FPGA) is a programmable logic device whose architecture combines configurable logic blocks (LABs/LEs), programmable interconnect, dedicated DSP blocks, on-chip memory, and (in GX variants) multi-gigabit transceivers. Stratix IV GX sits within Intel/Altera's high-end FPGA hierarchy as a 40 nm transceive-capable family: FPGA > programmable logic > SRAM-based configuration > Stratix IV > GX transceiver series. The architecture enables hardware-level parallelism for DSP, packet processing, and ASIC prototyping without sacrificing I/O density.

Key features of the EP4SGX530NF45C4 include 531,200 logic elements, 28 Mb embedded memory, integrated 8.5 Gbps multi-gigabit transceivers (Stratix IV GX family), 920 high-speed user I/O lanes, embedded DSP blocks for fixed/floating-point arithmetic, and hard PCIe Gen1/Gen2 IP cores. The -C4 speed grade balances timing margin and Fmax, while the NF45 (1932-ball, 42.5 x 42.5 mm) package maximizes I/O density for line-card and backplane designs.

Typical applications include 40G/100G optical transport line cards, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, XAUI, SFI), ASIC prototyping, broadcast video processing, radar and signal-intelligence front-ends, and high-performance computing (HPC) fabric. Industrial and military-aerospace variants in the Stratix IV family deliver extended temperature ranges and ruggedized packaging.

When designing with this device, plan power integrity carefully - the FC-FBGA substrate demands a 12+ layer PCB with continuous ground and dedicated decoupling per transceiver bank. JTAG and active serial configuration via EPCS flash is recommended for production. Lead-free and RoHS compliant per Intel product declaration.

This page synthesizes distributor pricing, package-specific drop-in alternatives, and engineering trade-offs not found in the standalone datasheet, enabling faster sourcing and design-in decisions.

드롭인 대체품: EP4SGX530NF45C4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX530NF45C4 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Process Technology, Operating Temperature, Embedded Memory.

EP4SGX530NF45C2

Intel

Package: 1932-ball FCBGA (NF45) 42.5 x 42.5 mm

Process Technology: 40 nm

Operating Temperature: 0 C to 85 C (Commercial)

비교 대상: EP4SGX530NF45C4 →

EP4SGX530NF45C2N

Altera

Package: 1932-ball FCBGA (NF45, 45 mm, 1.0 mm pitch)

Speed Grade: -2

비교 대상: EP4SGX530NF45C4 →

EP4SGX530NF45C2NES

Intel

Package: 1932-ball FBGA (FCBGA), 45 mm x 45 mm

Process Technology: 40 nm

Embedded Memory: 28,033,024 bits (approx. 27.2 Mbit / 3,423 Kbit per M9K block)

비교 대상: EP4SGX530NF45C4 →

EP4SGX530NF45C3

Intel

Package: 1932-ball FC-FBGA (NF45), 42.5 x 42.5 mm

Speed Grade: 3

Process Technology: TSMC 40 nm

비교 대상: EP4SGX530NF45C4 →

EP4SGX530NF45C3G

Intel

Package: 1932-ball FCBGA

Speed Grade: C3 (commercial)

Embedded Memory: 27,840 Kbits

비교 대상: EP4SGX530NF45C4 →

EP4SGX530NF45C3N

Altera

Package: 1932-ball FC-FBGA (NF45)

Process Technology: 40 nm CMOS (TSMC)

Operating Temperature: 0 C to 85 C (commercial)

비교 대상: EP4SGX530NF45C4 →

EP4SGX530NF45C4N

Intel

Speed Grade: C4 (highest performance)

Process Technology: 40 nm

Operating Temperature: 0 C to 85 C (commercial)

비교 대상: EP4SGX530NF45C4 →

EP4SGX530NF45I3

Intel

Package: 1932-ball FC-FBGA (NF45), 45 mm, 1.0 mm pitch

Speed Grade: I3

Process Technology: 40 nm

비교 대상: EP4SGX530NF45C4 →

EP4SGX530NF45I4

Intel

Package: 1932-ball FC-FBGA (45 mm)

Speed Grade: I4 (highest performance, industrial)

Process Technology: 40 nm low-power CMOS

✅ 드롭인

Intel

📦 1932-ball FC-FBGA (NF45)

FPGA - Field Programmable Gate Array · Stratix IV GX · 531200 · 21248 · 28033024 (approx 27.4 Mbit) · 1024 · 920 · 21248

✓ 재고 있음

$11650 / 개

데이터시트 보기 →

EP4SGX530NF45C4 최대 정격 & 전기적 특성

Device Family	Stratix IV GX
Logic Elements	531,200
Logic Array Blocks (LABs)	21,248
Embedded Memory Bits	28,033,024 (28 Mb)
User I/O Count	920
Maximum Internal Frequency	800 MHz
Process Technology	40 nm CMOS
Core Supply Voltage	0.9 V
패키지	1932-ball Flip-Chip BGA (FC-FBGA), 42.5 x 42.5 mm
Speed Grade	C4
동작 온도	0 C to +85 C (Commercial)
실장 유형	Surface Mount (FC-BGA)
Transceivers	Multi-gigabit transceivers (GX family)
RoHS 상태	Compliant

EP4SGX530NF45C4 1932-ball flip-chip bga (fc-fbga), 42.5 x 42.5 mm 핀 구성 가이드

EP4SGX530NF45C4(1932-ball flip-chip bga (fc-fbga), 42.5 x 42.5 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP4SGX530NF45C4의 1932-ball flip-chip bga (fc-fbga), 42.5 x 42.5 mm 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP4SGX530NF45C4.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP4SGX530NF45C4 적합 용도: 6 애플리케이션s: 40G/100G Optical Transport Line Cards, PCIe Gen2 Endpoint and Switch Bridging, ASIC Prototyping and Emulation, Broadcast Video Processing and Routing, Radar and Signal-Intelligence Front-End, High-Performance Computing (HPC) Fabric Bridges.

🌐

40G/100G Optical Transport Line Cards

The EP4SGX530NF45C4's 531,200 logic elements and 28 Mb embedded memory provide the parallel fabric needed for OTU4/100G framer, MAC, and forward-error-correction (FEC) logic. Its multi-gigabit transceivers reach 8.5 Gbps per lane, sufficient for SFI/SFP+ and CAUI-4 interfaces without external PHY chips. The 920 user I/O exposes wide external memory buses (DDR3/QDR-IV) for line-rate packet buffers. Recommended companion: external 100G Gearbox or optical module.

추천

🖥️

PCIe Gen2 Endpoint and Switch Bridging

The Stratix IV GX hard IP cores for PCIe Gen1/Gen2 (x1/x4/x8) make the EP4SGX530NF45C4 ideal for PCIe-to-RapidIO or PCIe-to-Ethernet bridging ASICs. The 920 user I/O and abundant DSP blocks handle protocol translation, DMA engines, and scatter-gather logic in a single device. Recommended companion: external PCIe Gen2 PHY or switch.

추천

EP4SGX530NF45C3N · Altera EP4CGX75DF27I7N · Intel

🔧

ASIC Prototyping and Emulation

With 531K logic elements, 21,248 LABs, and 28 Mb memory, the EP4SGX530NF45C4 emulates ASICs up to 50M ASIC gates when partitioned across multiple Stratix IV devices. The 920 user I/O and abundant transceivers let ASIC test vectors be applied at high speed. This makes it a preferred platform for ASIC bring-up, software development, and architectural validation prior to silicon tape-out.

추천

EP4SGX530NF45C3N · Altera EP4SE530H35C4N · Intel

📺

Broadcast Video Processing and Routing

The 28 Mb embedded memory and high fabric throughput allow the EP4SGX530NF45C4 to handle uncompressed 3G-SDI/HD-SDI routing, format conversion, and on-screen-display mixing in production switchers. The 920 user I/O connects to SDI deserializer/serializer PHYs and HDMI/DisplayPort bridges. Its commercial 0-85C grade suits air-cooled video router chassis.

추천

EP4SGX230KF40I4N · Intel EP4CGX50CF23I7N · Intel

✈️

Radar and Signal-Intelligence Front-End

The Stratix IV GX transceivers and DSP blocks deliver the FIR/FFT throughput required for phased-array radar beamforming and wideband SIGINT capture. At 800 MHz fabric performance, the EP4SGX530NF45C4 implements channelizers, polyphase filters, and pulse-compression logic. The 1932-ball BGA enables dense PCB integration in 6U VPX and ATR chassis used in airborne platforms.

추천

EP4SGX530NF45I4N · Intel EP4S40G2F40I2NAB · Intel

🖥️

High-Performance Computing (HPC) Fabric Bridges

The EP4SGX530NF45C4 serves as a low-latency bridge between InfiniBand QDR, 10/40G Ethernet, and proprietary HPC interconnects. The combination of high-speed transceivers, 920 user I/O, and 28 Mb memory fabric enables cut-through switching and credit-based flow control in HPC cluster fabrics. The commercial temperature grade is ideal for climate-controlled data centers.

추천

EP4SGX360NF45C4N · Intel EP4SGX110FF35C4G · Intel

추천 제품 요약

EP4SGX530NF45I4N Intel 사용처: 40G/100G Optical Transport Line Cards, Radar and Signal-Intelligence Front-End EP4SGX530NF45C3N Altera 사용처: 40G/100G Optical Transport Line Cards, PCIe Gen2 Endpoint and Switch Bridging, ASIC Prototyping and Emulation EP4CGX75DF27I7N Intel 사용처: PCIe Gen2 Endpoint and Switch Bridging EP4SE530H35C4N Intel 사용처: ASIC Prototyping and Emulation EP4SGX230KF40I4N Intel 사용처: Broadcast Video Processing and Routing EP4CGX50CF23I7N Intel 사용처: Broadcast Video Processing and Routing EP4S40G2F40I2NAB Intel 사용처: Radar and Signal-Intelligence Front-End EP4SGX360NF45C4N Intel 사용처: High-Performance Computing (HPC) Fabric Bridges EP4SGX110FF35C4G Intel 사용처: High-Performance Computing (HPC) Fabric Bridges

What is the logic element count of EP4SGX530NF45C4?

The EP4SGX530NF45C4 contains 531,200 logic elements across 21,248 Logic Array Blocks, with 28 Mb of embedded memory. According to the Intel Stratix IV device handbook, this places the device at the top of the Stratix IV GX family density range, supporting high-throughput wireline DSP and ASIC prototyping workloads.

What package does EP4SGX530NF45C4 use?

The EP4SGX530NF45C4 uses a 1932-ball Flip-Chip BGA (FC-FBGA, package code NF45) measuring 42.5 x 42.5 mm. This high-density BGA exposes 920 user I/O and the Stratix IV GX multi-gigabit transceiver banks, requiring a 12+ layer PCB with controlled-impedance routing for production deployment.

Is EP4SGX530NF45C4 RoHS compliant?

Yes, the EP4SGX530NF45C4 is RoHS compliant per the Intel product declaration and is lead-free. The device is suitable for global commercial deployments where RoHS, REACH, and lead-free assembly are mandatory, though designers should still verify halogen-free status on a per-lot basis.

What is the operating temperature range of EP4SGX530NF45C4?

The EP4SGX530NF45C4 (commercial grade) operates from 0 C to +85 C junction temperature. For industrial or military-aerospace deployments, designers should select an -I (industrial, -40C to +100C) or -E (extended, -40C to +125C) variant of the same Stratix IV GX 530 device family.

How does EP4SGX530NF45C4 compare to EP4SGX230KF40C2N?

The EP4SGX530NF45C4 offers roughly 2.3x more logic elements (531K vs ~230K) and significantly higher I/O count (920 vs 372 typical), but uses the larger NF45 FC-FBGA package. The EP4SGX230KF40C2N fits smaller boards with KF40 (780-ball) BGA, trading capacity for PCB area. Both are Stratix IV GX transceive-capable parts.

What is the current price of EP4SGX530NF45C4?

As of 2026-09-10, the EP4SGX530NF45C4 unit price at qty-1 is approximately $9,058.01 USD based on Heisener distributor listing. Bulk pricing at qty-1000 is around $5,434.81. Stock at one distributor is approximately 2,064 pieces; lead times for industrial volumes should be confirmed directly with authorized Intel/Altera channels.

Where can I download the EP4SGX530NF45C4 datasheet?

The official Intel Stratix IV device handbook is hosted at the Intel FPGA documentation library (intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/stratix-iv/stratix4_handbook.pdf). Pinout, package mechanical drawings, and transceiver characteristics are documented in the Stratix IV GX family datasheet volume.

Is EP4SGX530NF45C4 in stock at distributors?

As of 2026-09-10, Heisener.com lists approximately in stock, and DigiKey stocks the part with 'ships today' availability. Because this is a high-end FGPA in an EOL/NRND lifecycle, lead times for higher volumes can be variable; check Octopart for real-time aggregated stock across 13 distributors.

What is the best drop-in replacement for EP4SGX530NF45C4?

The closest drop-in alternatives are same-package Stratix IV GX variants: EP4SGX530NF45C3N (speed grade -C3, otherwise identical), EP4SGX530NF45C2N (speed grade -C2), and EP4SGX530NF45I4N (industrial temperature grade, same NF45 BGA). All share the NF45 FC-FBGA footprint, enabling PCB reuse with minor Quartus timing re-fit.

What are the key specifications of EP4SGX530NF45C4 that engineers should know?

EP4SGX530NF45C4 key specifications: 531,200 logic elements, 21,248 LABs, 28 Mb embedded memory, 920 user I/O, 40 nm process, 0.9 V core, 800 MHz internal fabric, integrated multi-gigabit transceivers (GX family, up to 8.5 Gbps), 1932-ball FC-BGA package, 0C to +85C commercial temperature, and -C4 speed grade. Source: Intel Stratix IV handbook.

Can EP4SGX530NF45C4N replace EP4SGX530NF45C4?

Yes, the EP4SGX530NF45C4N is a near-identical variant of the EP4SGX530NF45C4 with the 'N' suffix typically denoting lead-free or updated revision per Intel ordering codes. Both share the same NF45 FC-FBGA package, 531K logic elements, 920 user I/O, and Stratix IV GX transceiver set, making them functionally drop-in compatible on the same PCB.

EP4SGX530NF45C4 vs EP4SGX110FF35C3G - which is better for high-throughput design?

The EP4SGX530NF45C4 is significantly more capable than the EP4SGX110FF35C3G: 531K vs ~105K logic elements, 920 vs ~430 user I/O, and Stratix IV GX with full transceiver bank support. For designs exceeding 200K logic elements, 40G/100G line-card bridging, or large ASIC prototyping, choose the EP4SGX530NF45C4; for cost-sensitive mid-density tasks the EP4SGX110FF35C3G suffices.

When should I choose EP4SGX530NF45C4 over a smaller Stratix IV variant?

Choose the EP4SGX530NF45C4 when your design requires more than 200K logic elements, 28 Mb+ of on-chip memory, or the maximum Stratix IV GX transceiver count. For sub-100K LE designs or cost-optimized boards, an EP4SGX230 or EP4SGX110 variant with a smaller BGA (KF40/FF35/DF29) gives the same GX transceivers at lower unit cost and simpler PCB fabrication.

Is EP4SGX530NF45C4 suitable for aerospace applications?

The EP4SGX530NF45C4 commercial variant (0C to +85C) is not qualified for aerospace deployment; Intel offers military-temperature Stratix IV GX variants with -M temperature grades and ruggedized packaging. For aerospace, contact Intel FPGA aerospace program for V/QML or ceramic-Hermetic equivalents. Source: Intel Stratix IV product lifecycle note.

엔지니어링 참조 데이터: EP4SGX530NF45C4 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose EP4SGX530NF45C4 when your design requires 200K+ logic elements, 28 Mb+ embedded memory, and full Stratix IV GX transceiver bank count in a single device. For 40G/100G line cards, ASIC prototyping above 30M ASIC gates, or radar/SIGINT front-ends where density matters most, this is the right part. For sub-100K LE designs, consider EP4SGX230KF40 or EP4SGX110FF35 with smaller BGA packages (lower cost, simpler PCB). For military/aerospace deployment, specify EP4SGX530NF45I4N (industrial) or contact Intel FPGA aerospace for -M/ML-qualified equivalents. Avoid the -C2 speed grade unless power is the primary constraint, since Quartus timing closure becomes significantly harder at -C2.

대체품과의 비교

파라미터	이 제품	EP4SGX530NF45C3N	EP4SGX530NF45C2N	EP4SGX530NF45I4N	EP4SGX530NF45C3G
Brand	Intel	Intel	Intel	Intel	Intel
Package	1932-ball FC-FBGA (NF45)	1932-ball FC-FBGA (NF45) - same	1932-ball FC-FBGA (NF45) - same	1932-ball FC-FBGA (NF45) - same	1932-ball FC-FBGA (NF45) - same
Logic Elements	531,200	531,200	531,200	531,200	531,200
Speed Grade	C4	C3	C2	I4	C3
Operating Temperature	0C to +85C (Commercial)	0C to +85C (Commercial)	0C to +85C (Commercial)	-40C to +100C (Industrial)	0C to +85C (Commercial)
Embedded Memory	28 Mb (28,033,024 bits)	28 Mb	28 Mb	28 Mb	28 Mb
User I/O	920	920	920	920	920
RoHS Compliant	Yes	Yes	Yes	Yes	Yes

주요 차별점

Highest-density Stratix IV GX with maximum I/O and transceiver count (vs EP4SGX230KF40C2N)
Same NF45 BGA pinout across speed grades - true drop-in scalability (vs EP4SGX530NF45C3N)
Industrial temperature variant exists in same package (vs EP4SGX530NF45I4N)

설계 노트

Estimated: At a typical Stratix IV GX 530 power envelope of 25-30W, the FC-FBGA NF45 package requires a high-performance thermal interface material (TIM) and a heatsink with at least 0.5 C/W thermal resistance. Input values used: 25W TDP, 70C max ambient. For closed-chassis deployments (40G line cards), forced-air cooling at 2-3 m/s is recommended; for outdoor or industrial variants, choose the EP4SGX530NF45I4N and derate at 70% max ambient.

Design a 12+ layer PCB with continuous ground planes beneath the BGA, dedicated transceiver power islands, and 100-ohm differential controlled impedance for all transceiver lanes. Decoupling: 1x 470uF bulk + 10x 22uF + 100x 100nF + 1000x 10nF distributed within the BGA footprint. Source: Intel Stratix IV GX PCB design guidelines.

Do not hot-swap configuration modes without resetting the device; use AS (active serial) mode with EPCS flash for production, JTAG for development. Transceiver reference clocks require dedicated low-jitter PLLs; sharing clocks between banks can degrade jitter margin below 8.5 Gbps compliance. Always validate timing closure in Quartus II before tape-out; -C4 timing models are conservative.

규정 준수 정보

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

무연

Yes

무할로겐

Unknown

분쟁 광물

Compliant

RoHS compliant per Intel product declaration. AEC-Q100 is not applicable for FPGAs; automotive-grade variants do not exist for this part. Halogen-free status not explicitly stated in provided data.

데이터 검증일: 2026-09-10 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

출처: Distributor, Distributor, Octopart, Distributor, Distributor, Manufacturer Datasheet, Distributor