EP4SGX70HF35I3G - 72.6K LE Stratix IV GX FPGA, FCBGA-1152 | Intel
料号： EP4SGX70HF35I3G ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1680 | $16,800.00 |
| 100 | $1520 | $152,000.00 |
| 500 | $1380 | $690,000.00 |
| 1,000 | $1250 | $1,250,000.00 |
EP4SGX70HF35I3G 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by customer configuration after manufacturing, rather than at the fab. FPGAs sit in the hierarchy of programmable logic devices (PLD) -> CPLD -> FPGA -> structured ASIC, and serve as the highest-density programmable platform for digital signal processing, high-speed serial I/O, and parallel datapath designs. The Stratix IV family specifically targets high-performance, transceiver-rich applications such as wireline telecom, military radar, and high-end test and measurement.
Key features of the EP4SGX70HF35I3G include 9 integrated transceivers capable of up to 8.5 Gbps data rates (GX variant), 7.20 Mbit of embedded SRAM organized as M9K and M144K blocks, support for DDR/DDR2/DDR3/QDR II/QDR II+ external memory interfaces, and 4 phase-locked loops (PLLs) per device quadrant. The I3 speed grade and -40C to +100C industrial temperature range make it suitable for harsh-environment deployments while still meeting demanding timing budgets.
Architecture-wise, the device uses Altera's Logic Array Blocks (LABs) containing 8 ALMs each, with routing driven by MultiTrack interconnect and DirectDrive technology. Transceiver tiles are arranged adjacent to the I/O banks on the device periphery, with PCS and PMA blocks supporting protocols such as PCIe Gen1/Gen2, XAUI, CPRI, and Serial RapidIO. The 1152-ball FCBGA utilizes a 35 mm x 35 mm substrate with 1.0 mm ball pitch, requiring high-density PCB manufacturing.
Typical applications include 10G Ethernet line cards, baseband processing for wireless infrastructure, video broadcast and imaging pipelines, military secure-communication modems, and high-channel-count data acquisition systems. Its combination of transceivers, DSP blocks, and large memory makes it especially effective for signal-processing pipelines requiring both packet handling and parallel arithmetic.
When designing with this FPGA, prioritize signal-integrity-aware stackup design for the FCBGA footprint, allocate sufficient decoupling (typically 0.1 uF, 1 uF, and bulk capacitance) around each transceiver tile power pin, and validate pin assignments against the Quartus II pin-out file before layout commit. Industrial-grade I3 silicon requires proper thermal management to keep junction temperature below 100C at full transceiver utilization.
This page synthesizes distributor pricing, same-family pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： EP4SGX70HF35I3G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP4SGX70HF35I3G （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Process Technology, Mounting Type, Logic Elements.
快速对比工具——选择替代料号进行并排对比：
EP4SGX70HF35C3G
✅ 直接替换✓ 有现货
$1380 / 个
查看数据手册 →EP4SGX70HF35C4G
✅ 直接替换✓ 有现货
$1650 / 个
查看数据手册 →EP4SGX70HF35C2G
✅ 直接替换✓ 有现货
$1490 / 个
查看数据手册 →EP4SGX70HF35I4G
✅ 直接替换✓ 有现货
$1150 / 个
查看数据手册 →EP4SGX110HF35I3G
✅ 直接替换✓ 有现货
$7900 / 个
查看数据手册 →EP4SGX70DF29I3G
✅ 直接替换✓ 有现货
$1080 / 个
查看数据手册 →EP4SGX70HF35I3G 最大额定值与电气特性
| Series | Stratix IV GX |
| Logic Elements | 72,600 LE |
| Adaptive Logic Modules (ALMs) | 29,040 ALM |
| Embedded Memory | 7.20 Mbit (7,564,880 bits) |
| User I/Os | 480 |
| Transceivers | 9 channels up to 8.5 Gbps (GX) |
| 18x18 Multipliers | 488 |
| PLLs | 4 per quadrant |
| Process Technology | 40 nm TSMC |
| Core Supply Voltage | 950 mV |
| 工作温度 | -40C to +100C (Industrial) |
| Speed Grade | I3 |
| 封装 | 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch |
| 安装类型 | Surface Mount (Flip-Chip BGA) |
| Packaging | Tray |
EP4SGX70HF35I3G 1152-ball fcbga, 35x35 mm, 1.0 mm pitch 引脚配置指南
EP4SGX70HF35I3G（1152-ball fcbga, 35x35 mm, 1.0 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP4SGX70HF35I3G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP4SGX70HF35I3G 适用于 6 应用s: 10G Ethernet Line Card, Wireless Baseband Processing, Video Broadcast and Imaging Pipeline, Military Secure Communication Modem, High-Channel Data Acquisition System, Radar Signal Processing.
10G Ethernet Line Card
The EP4SGX70HF35I3G integrates 9 transceivers at up to 8.5 Gbps and 488 (18x18) multipliers, making it well suited to 10G Ethernet line-card datapaths. Placed as the fabric element between SFP+/XFP optical modules and a network processor, the FPGA handles MAC framing, CRC offload, and small-form-factor pipeline processing. The 7.20 Mbit embedded SRAM absorbs packet bursts while DDR3 external memory interfaces feed deep lookup tables. Industrial temperature grade supports telco central-office and edge-aggregation deployments where ambient cabinet temperatures approach 75C. Compared with pure ASSP solutions, the FPGA delivers protocol flexibility for evolving 10G/40G bridge standards.
推荐
Wireless Baseband Processing
The EP4SGX70HF35I3G's DSP-rich fabric with 488 (18x18) multipliers and high transceivers count supports LTE and 5G NR baseband signal processing pipelines. Designers instantiate FFT/iFFT blocks, channel estimators, and MIMO detectors directly in fabric while the transceivers carry CPRI or JESD204B links to RF front ends. The 1152-ball FCBGA package provides ample I/O for parallel CPRI streams up to 9 channels. Industrial temperature grade enables outdoor small-cell and macro-base-station deployment. The same pinout as EP4SGX110HF35I3G allows smooth scaling when channel-count requirements grow.
推荐
Video Broadcast and Imaging Pipeline
Video broadcast routers, multi-viewer processors, and 4K/UHD imaging systems benefit from the EP4SGX70HF35I3G's 7.20 Mbit embedded memory, 480 user I/Os, and 8.5 Gbps transceivers. The FPGA buffers uncompressed video frames in M9K/M144K blocks while DPRAM interfaces to external DDR3 frame stores. Transceivers enable SDI-over-IP or SMPTE 2022-6/7 transport. Industrial temperature grade supports outside-broadcast trucks and studio equipment operating at elevated ambient. The same-package EP4SGX110HF35I3G upgrade path supports higher channel counts.
推荐
Military Secure Communication Modem
The military secure-communication segment requires FPGAs that combine cryptographic throughput, robust I/O, and harsh-environment qualification. The EP4SGX70HF35I3G delivers 488 multipliers for AES/SHA acceleration, transceivers up to 8.5 Gbps for protected RF datalinks, and -40C to +100C industrial temperature range suitable for tactical deployments. Conformal-coated assemblies based on this FPGA appear in radio modems, line-of-sight datalinks, and satellite-communication modems. The HF35 package option supports PCB designs requiring maximum I/O access for parallel sensor aggregation.
推荐
High-Channel Data Acquisition System
High-channel-count DAQ systems digitize hundreds of analog inputs through multi-channel ADCs and require a central FPGA for sample storage, channelization, and pre-processing. The EP4SGX70HF35I3G serves this role with 488 multipliers, 7.20 Mbit buffer memory, 480 I/Os for parallel ADC/LVDS lanes, and 8.5 Gbps transceivers for backplane upload. Industrial temperature grade suits test-stand and field-deployment DAQ in industrial, geophysical, and aerospace applications. The same HF35 pinout as EP4SGX110HF35I3G allows design teams to flex between two density points without PCB rework.
推荐
Radar Signal Processing
Phased-array radar and synthetic-aperture-radar (SAR) systems require intensive real-time FFT, pulse compression, and beamforming, all of which map efficiently onto the EP4SGX70HF35I3G's 488 (18x18) multipliers and 9 transceivers. The FPGA sits between the RF front end and a host processor, performing channelization, Doppler filtering, and target detection. Industrial temperature grade supports shipboard, ground-vehicle, and airborne radar. The HF35 package provides the largest I/O envelope for parallel ADC aggregation; alternative DF29 / F40 packages trade I/O for smaller board area.
推荐
推荐产品汇总
工程参考数据： EP4SGX70HF35I3G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP4SGX70HF35C3G | EP4SGX70HF35C4G | EP4SGX70HF35C2G | EP4SGX70HF35I4G | EP4SGX110HF35I3G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FCBGA (HF35) | 1152-ball FCBGA (HF35) - same | 1152-ball FCBGA (HF35) - same | 1152-ball FCBGA (HF35) - same | 1152-ball FCBGA (HF35) - same | 1152-ball FCBGA (HF35) - same |
| Logic Elements | 72,600 | 72,600 | 72,600 | 72,600 | 72,600 | 105,600 |
| Embedded Memory | 7.20 Mbit | 7.20 Mbit | 7.20 Mbit | 7.20 Mbit | 7.20 Mbit | 10.89 Mbit |
| 18x18 Multipliers | 488 | 488 | 488 | 488 | 488 | 704 |
| User I/Os | 480 | 480 | 480 | 480 | 480 | 480 |
| Transceivers | 9 ch up to 8.5 Gbps | 9 ch up to 8.5 Gbps | 9 ch up to 8.5 Gbps | 9 ch up to 8.5 Gbps | 9 ch up to 8.5 Gbps | 9 ch up to 8.5 Gbps |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | I3 | C3 | C4 | C2 | I4 | I3 |
关键差异点
- Industrial temperature grade vs commercial-only HF35 variants （对比 EP4SGX70HF35C3G)
- Larger design headroom in the same HF35 footprint （对比 EP4SGX70HF35I4G)
- Smaller and larger density options in same package family （对比 EP4SGX110HF35I3G)
设计说明
The 1152-ball FCBGA package with 1.0 mm ball pitch requires a controlled-impedance stackup with matched trace lengths for transceiver channels; route to Altera Stratix IV GX transceiver channel-length matching guidelines to keep within 25 mil tolerance. Use microvia or staggered-via construction; place antipads below ground-pour power planes to maintain return path. Allow the FCBGA land pattern from Altera's mechanical specifications - never substitute a generic BGA footprint.
Decouple every transceiver tile power pin with one 0.1 uF and one 1 uF X7R ceramic capacitor placed within 100 mils of the package balls. Add a single 22 uF bulk capacitor per power rail near the BGA periphery. The 950 mV core rail typically draws 4-6 A at full utilization; estimate junction temperature rise using the Quartus II PowerPlay early-power-estimator output before committing layout.
FCBGA thermal performance depends heavily on PCB copper content and airflow. The HF35 35x35 mm package exhibits theta_JA near 11 C/W with 8-layer 2 oz copper and 200 LFM airflow. At full transceiver utilization and industrial +100C ambient, you must meet the datasheet maximum-junction specification. Use a heatsink with thermal interface material if airflow falls below 150 LFM, especially in outdoor telecom or military deployments.
Do not mix HF35 pinout with H40 / F29 / DF29 pinout files - these are distinct pin maps for the same silicon. Pin-out mismatches between Engineering Sample silicon and Production silicon can also occur across device-revision letters; always re-export the pin assignment from Quartus II 13.1+ with the device handbook revision matched to the silicon device-letter on the package marking.
合规信息
RoHS and REACH compliance per Intel/Altera product declarations. AEC-Q100 not applicable (FPGA is not an automotive-qualified IC under AEC-Q100). Halogen-free status not stated in the available data and is reported as unknown.
