EP4SGX70HF35I3G - 72.6K LE Stratix IV GX FPGA, FCBGA-1152 | Intel
부품 번호: EP4SGX70HF35I3G ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1680 | $16,800.00 |
| 100 | $1520 | $152,000.00 |
| 500 | $1380 | $690,000.00 |
| 1,000 | $1250 | $1,250,000.00 |
EP4SGX70HF35I3G 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by customer configuration after manufacturing, rather than at the fab. FPGAs sit in the hierarchy of programmable logic devices (PLD) -> CPLD -> FPGA -> structured ASIC, and serve as the highest-density programmable platform for digital signal processing, high-speed serial I/O, and parallel datapath designs. The Stratix IV family specifically targets high-performance, transceiver-rich applications such as wireline telecom, military radar, and high-end test and measurement.
Key features of the EP4SGX70HF35I3G include 9 integrated transceivers capable of up to 8.5 Gbps data rates (GX variant), 7.20 Mbit of embedded SRAM organized as M9K and M144K blocks, support for DDR/DDR2/DDR3/QDR II/QDR II+ external memory interfaces, and 4 phase-locked loops (PLLs) per device quadrant. The I3 speed grade and -40C to +100C industrial temperature range make it suitable for harsh-environment deployments while still meeting demanding timing budgets.
Architecture-wise, the device uses Altera's Logic Array Blocks (LABs) containing 8 ALMs each, with routing driven by MultiTrack interconnect and DirectDrive technology. Transceiver tiles are arranged adjacent to the I/O banks on the device periphery, with PCS and PMA blocks supporting protocols such as PCIe Gen1/Gen2, XAUI, CPRI, and Serial RapidIO. The 1152-ball FCBGA utilizes a 35 mm x 35 mm substrate with 1.0 mm ball pitch, requiring high-density PCB manufacturing.
Typical applications include 10G Ethernet line cards, baseband processing for wireless infrastructure, video broadcast and imaging pipelines, military secure-communication modems, and high-channel-count data acquisition systems. Its combination of transceivers, DSP blocks, and large memory makes it especially effective for signal-processing pipelines requiring both packet handling and parallel arithmetic.
When designing with this FPGA, prioritize signal-integrity-aware stackup design for the FCBGA footprint, allocate sufficient decoupling (typically 0.1 uF, 1 uF, and bulk capacitance) around each transceiver tile power pin, and validate pin assignments against the Quartus II pin-out file before layout commit. Industrial-grade I3 silicon requires proper thermal management to keep junction temperature below 100C at full transceiver utilization.
This page synthesizes distributor pricing, same-family pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP4SGX70HF35I3G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX70HF35I3G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Process Technology, Mounting Type, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SGX70HF35C3G
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP4SGX70HF35C4G
✅ 드롭인✓ 재고 있음
$1650 / 개
데이터시트 보기 →EP4SGX70HF35C2G
✅ 드롭인✓ 재고 있음
$1490 / 개
데이터시트 보기 →EP4SGX70HF35I4G
✅ 드롭인✓ 재고 있음
$1150 / 개
데이터시트 보기 →EP4SGX110HF35I3G
✅ 드롭인✓ 재고 있음
$7900 / 개
데이터시트 보기 →EP4SGX70DF29I3G
✅ 드롭인✓ 재고 있음
$1080 / 개
데이터시트 보기 →EP4SGX70HF35I3G 최대 정격 & 전기적 특성
| Series | Stratix IV GX |
| Logic Elements | 72,600 LE |
| Adaptive Logic Modules (ALMs) | 29,040 ALM |
| Embedded Memory | 7.20 Mbit (7,564,880 bits) |
| User I/Os | 480 |
| Transceivers | 9 channels up to 8.5 Gbps (GX) |
| 18x18 Multipliers | 488 |
| PLLs | 4 per quadrant |
| Process Technology | 40 nm TSMC |
| Core Supply Voltage | 950 mV |
| 동작 온도 | -40C to +100C (Industrial) |
| Speed Grade | I3 |
| 패키지 | 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch |
| 실장 유형 | Surface Mount (Flip-Chip BGA) |
| Packaging | Tray |
EP4SGX70HF35I3G 1152-ball fcbga, 35x35 mm, 1.0 mm pitch 핀 구성 가이드
EP4SGX70HF35I3G(1152-ball fcbga, 35x35 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SGX70HF35I3G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SGX70HF35I3G 적합 용도: 6 애플리케이션s: 10G Ethernet Line Card, Wireless Baseband Processing, Video Broadcast and Imaging Pipeline, Military Secure Communication Modem, High-Channel Data Acquisition System, Radar Signal Processing.
10G Ethernet Line Card
The EP4SGX70HF35I3G integrates 9 transceivers at up to 8.5 Gbps and 488 (18x18) multipliers, making it well suited to 10G Ethernet line-card datapaths. Placed as the fabric element between SFP+/XFP optical modules and a network processor, the FPGA handles MAC framing, CRC offload, and small-form-factor pipeline processing. The 7.20 Mbit embedded SRAM absorbs packet bursts while DDR3 external memory interfaces feed deep lookup tables. Industrial temperature grade supports telco central-office and edge-aggregation deployments where ambient cabinet temperatures approach 75C. Compared with pure ASSP solutions, the FPGA delivers protocol flexibility for evolving 10G/40G bridge standards.
추천
Wireless Baseband Processing
The EP4SGX70HF35I3G's DSP-rich fabric with 488 (18x18) multipliers and high transceivers count supports LTE and 5G NR baseband signal processing pipelines. Designers instantiate FFT/iFFT blocks, channel estimators, and MIMO detectors directly in fabric while the transceivers carry CPRI or JESD204B links to RF front ends. The 1152-ball FCBGA package provides ample I/O for parallel CPRI streams up to 9 channels. Industrial temperature grade enables outdoor small-cell and macro-base-station deployment. The same pinout as EP4SGX110HF35I3G allows smooth scaling when channel-count requirements grow.
추천
Video Broadcast and Imaging Pipeline
Video broadcast routers, multi-viewer processors, and 4K/UHD imaging systems benefit from the EP4SGX70HF35I3G's 7.20 Mbit embedded memory, 480 user I/Os, and 8.5 Gbps transceivers. The FPGA buffers uncompressed video frames in M9K/M144K blocks while DPRAM interfaces to external DDR3 frame stores. Transceivers enable SDI-over-IP or SMPTE 2022-6/7 transport. Industrial temperature grade supports outside-broadcast trucks and studio equipment operating at elevated ambient. The same-package EP4SGX110HF35I3G upgrade path supports higher channel counts.
추천
Military Secure Communication Modem
The military secure-communication segment requires FPGAs that combine cryptographic throughput, robust I/O, and harsh-environment qualification. The EP4SGX70HF35I3G delivers 488 multipliers for AES/SHA acceleration, transceivers up to 8.5 Gbps for protected RF datalinks, and -40C to +100C industrial temperature range suitable for tactical deployments. Conformal-coated assemblies based on this FPGA appear in radio modems, line-of-sight datalinks, and satellite-communication modems. The HF35 package option supports PCB designs requiring maximum I/O access for parallel sensor aggregation.
추천
High-Channel Data Acquisition System
High-channel-count DAQ systems digitize hundreds of analog inputs through multi-channel ADCs and require a central FPGA for sample storage, channelization, and pre-processing. The EP4SGX70HF35I3G serves this role with 488 multipliers, 7.20 Mbit buffer memory, 480 I/Os for parallel ADC/LVDS lanes, and 8.5 Gbps transceivers for backplane upload. Industrial temperature grade suits test-stand and field-deployment DAQ in industrial, geophysical, and aerospace applications. The same HF35 pinout as EP4SGX110HF35I3G allows design teams to flex between two density points without PCB rework.
추천
Radar Signal Processing
Phased-array radar and synthetic-aperture-radar (SAR) systems require intensive real-time FFT, pulse compression, and beamforming, all of which map efficiently onto the EP4SGX70HF35I3G's 488 (18x18) multipliers and 9 transceivers. The FPGA sits between the RF front end and a host processor, performing channelization, Doppler filtering, and target detection. Industrial temperature grade supports shipboard, ground-vehicle, and airborne radar. The HF35 package provides the largest I/O envelope for parallel ADC aggregation; alternative DF29 / F40 packages trade I/O for smaller board area.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SGX70HF35I3G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SGX70HF35C3G | EP4SGX70HF35C4G | EP4SGX70HF35C2G | EP4SGX70HF35I4G | EP4SGX110HF35I3G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FCBGA (HF35) | 1152-ball FCBGA (HF35) - same | 1152-ball FCBGA (HF35) - same | 1152-ball FCBGA (HF35) - same | 1152-ball FCBGA (HF35) - same | 1152-ball FCBGA (HF35) - same |
| Logic Elements | 72,600 | 72,600 | 72,600 | 72,600 | 72,600 | 105,600 |
| Embedded Memory | 7.20 Mbit | 7.20 Mbit | 7.20 Mbit | 7.20 Mbit | 7.20 Mbit | 10.89 Mbit |
| 18x18 Multipliers | 488 | 488 | 488 | 488 | 488 | 704 |
| User I/Os | 480 | 480 | 480 | 480 | 480 | 480 |
| Transceivers | 9 ch up to 8.5 Gbps | 9 ch up to 8.5 Gbps | 9 ch up to 8.5 Gbps | 9 ch up to 8.5 Gbps | 9 ch up to 8.5 Gbps | 9 ch up to 8.5 Gbps |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | I3 | C3 | C4 | C2 | I4 | I3 |
주요 차별점
- Industrial temperature grade vs commercial-only HF35 variants (vs EP4SGX70HF35C3G)
- Larger design headroom in the same HF35 footprint (vs EP4SGX70HF35I4G)
- Smaller and larger density options in same package family (vs EP4SGX110HF35I3G)
설계 노트
The 1152-ball FCBGA package with 1.0 mm ball pitch requires a controlled-impedance stackup with matched trace lengths for transceiver channels; route to Altera Stratix IV GX transceiver channel-length matching guidelines to keep within 25 mil tolerance. Use microvia or staggered-via construction; place antipads below ground-pour power planes to maintain return path. Allow the FCBGA land pattern from Altera's mechanical specifications - never substitute a generic BGA footprint.
Decouple every transceiver tile power pin with one 0.1 uF and one 1 uF X7R ceramic capacitor placed within 100 mils of the package balls. Add a single 22 uF bulk capacitor per power rail near the BGA periphery. The 950 mV core rail typically draws 4-6 A at full utilization; estimate junction temperature rise using the Quartus II PowerPlay early-power-estimator output before committing layout.
FCBGA thermal performance depends heavily on PCB copper content and airflow. The HF35 35x35 mm package exhibits theta_JA near 11 C/W with 8-layer 2 oz copper and 200 LFM airflow. At full transceiver utilization and industrial +100C ambient, you must meet the datasheet maximum-junction specification. Use a heatsink with thermal interface material if airflow falls below 150 LFM, especially in outdoor telecom or military deployments.
Do not mix HF35 pinout with H40 / F29 / DF29 pinout files - these are distinct pin maps for the same silicon. Pin-out mismatches between Engineering Sample silicon and Production silicon can also occur across device-revision letters; always re-export the pin assignment from Quartus II 13.1+ with the device handbook revision matched to the silicon device-letter on the package marking.
규정 준수 정보
RoHS and REACH compliance per Intel/Altera product declarations. AEC-Q100 not applicable (FPGA is not an automotive-qualified IC under AEC-Q100). Halogen-free status not stated in the available data and is reported as unknown.
