EPF10K100EFC484-2X - 100K-Gate FLEX 10KE FPGA, 338 I/O | Altera
料号： EPF10K100EFC484-2X ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $250.22 | $250.22 |
| 100 | $247.72 | $24,772.00 |
| 500 | $247.72 | $123,860.00 |
| 1,000 | $245.22 | $245,220.00 |
| 1,500 | $242.71 | $364,065.00 |
| 2,000 | $240.21 | $480,420.00 |
| 2,500 | $237.71 | $594,275.00 |
EPF10K100EFC484-2X 概述
A Field Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all of which are defined by a bitstream loaded into on-chip SRAM after power-up. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) alongside SPLDs, CPLDs, and anti-fuse FPGAs. The FLEX 10KE family specifically pioneered the embedded array block (EAB), allowing designers to instantiate RAM, ROM, or multiplier functions inside the logic fabric, an early example of System-on-a-Programmable-Chip (SOPC) integration.
Key features of the EPF10K100EFC484-2X include 624 logic array blocks (LABs), 4,992 logic cells, 49,152 RAM bits distributed across embedded array blocks, a maximum propagation delay on the order of 0.6 ns per logic element, and 338 usable I/Os in the 484-pin FBGA. The -2X speed grade balances timing margin against power consumption, making it a common choice for production designs rather than the fastest -3 grade.
Typical applications include telecommunications line cards, industrial motor control, glue logic replacement, and legacy peripheral bus bridging. The wide 338-I/O budget is well-suited to parallel bus interfacing, and the embedded array blocks ease implementation of FIFOs and small on-chip memories.
A key design consideration when using this part is that the FLEX 10KE family is now in mature/end-of-life status; new designs should consider Cyclone or MAX series parts, while existing designs should verify long-term supply through franchised distributors and validated aftermarket channels.
This page synthesizes distributor pricing, drop-in alternatives within the FLEX 10KE family, and design notes that complement (not duplicate) the manufacturer datasheet.
直接替换替代料： EPF10K100EFC484-2X ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPF10K100EFC484-2X （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Logic Elements / Cells, Process Technology, Speed Grade.
快速对比工具——选择替代料号进行并排对比：
EPF10K100EFC484-2N
✅ 直接替换📋 参考替代料（不在目录中）
EPF10K100EFC484-1X
✅ 直接替换✓ 有现货
$349.57 / 个
查看数据手册 →EPF10K100EFC484-2
✅ 直接替换✓ 有现货
$185.4 / 个
查看数据手册 →EPF10K200EFC484-2
✅ 直接替换📋 参考替代料（不在目录中）
EPF10K100EFC484-3
✅ 直接替换✓ 有现货
$65 / 个
查看数据手册 →EPF10K100EFC484-2X 最大额定值与电气特性
| Series | FLEX 10KE |
| Family | FLEX-10KE |
| Typical Gate Count | 100,000 gates |
| Logic Elements / Cells | 4,992 |
| Logic Array Blocks (LABs) | 624 |
| Total RAM Bits | 49,152 |
| User I/Os | 338 |
| 封装 | 484-FBGA (23 x 23 mm) |
| Supply Voltage - Core | 2.5 V (2.375 V - 2.625 V) |
| 工作温度 | 0 C to +70 C (commercial) |
| Process Technology | 0.22 µm CMOS |
| Propagation Delay (typ.) | 0.6 ns |
| 安装类型 | Surface Mount (FBGA) |
| Speed Grade | -2X |
| RoHS 状态 | unknown |
EPF10K100EFC484-2X 引脚配置
| 引脚 A1 | I/O — User I/O (338 total in 484-FBGA; pin assignment varies by user design) |
| 引脚 A2 | VCCIO — I/O bank supply voltage |
| 引脚 B1 | I/O — User I/O |
| 引脚 B2 | GND — Ground |
| 引脚 C1 | I/O — User I/O |
| 引脚 D1 | I/O — User I/O |
| 引脚 E1 | I/O — User I/O |
| 引脚 F1 | I/O — User I/O |
| 引脚 G1 | I/O — User I/O |
| 引脚 H1 | I/O — User I/O |
| 引脚 J1 | I/O — User I/O |
| 引脚 K1 | I/O — User I/O |
| 引脚 L1 | I/O — User I/O |
| 引脚 M1 | I/O — User I/O |
| 引脚 N1 | I/O — User I/O |
| 引脚 P1 | I/O — User I/O |
| 引脚 R1 | I/O — User I/O |
| 引脚 T1 | I/O — User I/O |
| 引脚 U1 | I/O — User I/O |
| 引脚 V1 | I/O — User I/O |
| 引脚 W1 | I/O — User I/O |
| 引脚 Y1 | I/O — User I/O |
| 引脚 AA1 | I/O — User I/O |
| 引脚 AB1 | I/O — User I/O |
典型应用
EPF10K100EFC484-2X 适用于 7 应用s: Telecommunications Line Cards, Industrial Motor Control, Glue Logic Replacement, Legacy Peripheral Bus Bridging, ASIC Prototyping, Test & Measurement Instrumentation, Embedded Computing Platforms.
Telecommunications Line Cards
The EPF10K100EFC484-2X fits telecom line-card designs thanks to its 338 user I/Os and 49,152 bits of embedded RAM. The 338-I/O budget allows parallel connection to TDM backplanes, framer ICs, and serializer/deserializer devices without external bus expander logic. The 49,152 bits of distributed embedded array block RAM comfortably absorbs small FIFOs, look-up tables for protocol state machines, and elastic buffers between clock domains - critical when bridging between line-rate clocks and system backplane clocks. Operated from a 2.5 V core with mixed-voltage I/O support, it integrates cleanly into legacy 3.3 V and 5 V backplanes, and the FLEX 10KE architecture provides deterministic pin-to-pin logic delays of approximately 0.6 ns, simplifying static timing closure for cell-site synchronization.
推荐
Industrial Motor Control
The EPF10K100EFC484-2X's high I/O count and embedded RAM make it well suited to multi-axis motor control and encoder interface designs. With 338 I/Os, the device can directly connect to multiple quadrature encoder inputs, Hall-sensor arrays, and PWM outputs without external multiplexing logic, reducing BOM cost and signal-integrity risk. The embedded array blocks implement fast PWM modulation tables and space-vector lookup tables in distributed RAM, allowing deterministic cycle times for field-oriented control loops. Designers should pair the part with the EPF10K100EFC484-2N (industrial temperature grade) for control cabinets operating from -40 C to +85 C, and provision an EPC2 configuration PROM since the FLEX 10KE SRAM configuration is volatile.
推荐
Glue Logic Replacement
For legacy system designs where dozens of 74-series TTL/CMOS parts occupy a board, the EPF10K100EFC484-2X consolidates that glue logic into a single FPGA. The 4,992 logic elements and 624 LABs easily absorb hundreds of random gates, latches, multiplexers, and small state machines. Designers benefit from a single bill of materials item, easier ECOs (just rerun synthesis), and the ability to integrate bus bridges and address decoders into one device. The 338-I/O count accommodates wide address/data buses, and the 2.5 V core with multi-voltage I/O banks allows the FPGA to sit between 3.3 V microprocessors and 5 V peripheral devices without level-shifters. Pair with the EPF10K100EFC256-2X when fewer I/Os are required to shrink PCB area.
推荐
Legacy Peripheral Bus Bridging
The EPF10K100EFC484-2X excels at bridging between legacy buses such as PCI, ISA, VME, and proprietary backplanes where modern microcontrollers lack native interfaces. The 338 I/Os comfortably absorb 32-bit address and data buses plus control signals, while the 49,152 bits of embedded RAM implement bus FIFOs and posted-write buffers in distributed memory. The 0.6 ns propagation delay per logic element enables single-cycle bus turnaround, important for ISA-style memory cycles. Designers should verify timing closure against the target bus clock using Quartus II timing analysis, and provision the EPF10K100EFC484-2N when industrial temperature is required for factory-floor equipment.
推荐
ASIC Prototyping
Engineers prototyping ASIC designs in the late 1990s and early 2000s selected the EPF10K100EFC484-2X as a fast iteration platform before committing to mask sets. Its 100K-gate capacity matched many mid-range ASIC designs, and the Quartus II / MAX+PLUS II toolchain accepted RTL input identical to the ASIC synthesis flow, accelerating verification. The 338 I/Os expose enough pins to validate most ASIC pad ring configurations, and FPGAs from the FLEX 10KE family could be re-programmed in minutes, enabling rapid design turnaround. For modern ASIC prototyping consider the EPF10K200EFC484-2 in the same 484-FBGA footprint, doubling gate capacity for larger prototypes without changing the PCB.
推荐
Test & Measurement Instrumentation
The EPF10K100EFC484-2X enables digital stimulus generation, protocol decoding, and signal-conditioning logic in legacy bench instruments. The 338 user I/Os let engineers directly connect to multi-channel logic analyzer probes, pattern-generator outputs, and parallel ADC/DAC buses without external multiplexing. Embedded array blocks implement deep stimulus pattern memories and capture buffers, replacing discrete SRAM with on-chip distributed RAM. The deterministic 0.6 ns logic delay per element is helpful when generating precisely timed pulse trains or eye-diagram test patterns. For extended-temperature test chambers use the EPF10K100EFC484-1N industrial variant in the same 484-FBGA package.
推荐
Embedded Computing Platforms
Single-board computers and VME/cPCI carrier cards from the late 1990s and 2000s used the EPF10K100EFC484-2X for I/O expansion, custom peripheral glue, and local bus mastering. The device's 338 I/Os allow direct connection to parallel PC/104, PCMCIA, or proprietary mezzanine buses, while the 49,152 embedded RAM bits implement small data buffers and FIFOs that offload the host CPU. The 2.5 V core with multi-voltage I/O banks enables interfacing with both 3.3 V and 5 V peripheral stacks without external level translation. The -2X speed grade offers a balance of timing margin and power for embedded applications where lower-cost industrial temperature grades are not required.
推荐
推荐产品汇总
工程参考数据： EPF10K100EFC484-2X ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPF10K100EFC484-2N | EPF10K100EFC484-1X | EPF10K100EFC484-2 | EPF10K200EFC484-2 | EPF10K100EFC484-3 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-FBGA (23 x 23 mm) | 484-FBGA (23 x 23 mm) - same | 484-FBGA (23 x 23 mm) - same | 484-FBGA (23 x 23 mm) - same | 484-FBGA (23 x 23 mm) - same | 484-FBGA (23 x 23 mm) - same |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 200,000 | 100,000 |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| User I/Os | 338 | 338 | 338 | 338 | 338 | 338 |
| Embedded RAM (bits) | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| Operating Temperature | 0 C to +70 C (commercial) | -40 C to +85 C (industrial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) |
| Speed Grade | -2X | -2N (industrial) | -1X (slower) | -2 (no X bin) | -2 | -3 (faster) |
| Supply Voltage (core) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
关键差异点
- 100K-gate density with 338 I/Os in single 484-FBGA （对比 EPF10K100EFC256-2X)
- Identical footprint enables seamless density upgrade （对比 EPF10K200EFC484-2)
- Industrial temperature variant available in same package （对比 EPF10K100EFC484-2N)
设计说明
Estimated: the EPF10K100EFC484-2X core current scales with toggle rate and clock frequency. At a 100 MHz design utilization of ~70%, expect approximately 200-400 mA on the 2.5 V VCCINT rail (Estimated: I(CCINT) ~ 0.25-0.5 W static plus dynamic). Provide at least four 0.1 µF ceramic decoupling capacitors per VCCINT region and bulk 47-100 µF tantalum or polymer capacitors at the board supply input. I/O bank VCCIO pins can be powered independently to support mixed-voltage interfacing - do not leave any VCCIO bank unpowered when its I/Os are used.
The 484-FBGA at 23 x 23 mm requires fanout escape routing on the inner PCB layers. Use microvia (HDI) technology with 0.4 mm or 0.5 mm ball pitch escape patterns, or standard 0.8 mm pitch escape on 4-layer boards with buried vias. Maintain a continuous ground plane on layer 2 directly beneath the BGA, with stitched ground vias around the periphery to reduce ground bounce. Signal trace impedance should be controlled to 50 ohm single-ended for LVTTL/LVCMOS interfaces. Keep configuration PROM (EPC2LC20N) within 5 cm of the FPGA to minimize JTAG / passive serial noise pickup.
Place the EPF10K100EFC484-2X near the center of the board for short symmetric routing to its 338 I/Os. Group high-speed differential or source-synchronous interfaces on one edge with matched-length traces. Decoupling capacitors must be placed within 5 mm of their respective VCCINT and VCCIO pins; the 0.1 µF ceramics should be on the opposite PCB side directly under the BGA array when possible. Maintain 4+ ground vias per decoupling capacitor pad. JTAG chain routing should keep TMS, TCK, TDI, TDO traces short and isolated from switching I/O.
Do not leave VCCIO banks floating when their I/Os are configured as outputs - undriven I/O banks can latch up or source indeterminate currents. Always include a non-volatile configuration PROM (EPC2 series or compatible) - the FLEX 10KE SRAM configuration is volatile and lost on every power-down. Verify timing closure for the -2X speed grade using Quartus II timing reports; the -2X grade has a different fmax table than the -2 (no X suffix) or -3 grades. Finally, never hot-plug a 2.5 V VCCINT supply without proper sequencing - the FPGA's I/O structures can latch up if VCCIO rises before VCCINT.
合规信息
RoHS, REACH, lead-free and halogen-free status could not be verified from the provided data. The FLEX 10KE family predates RoHS standardization and may require lead-bearing ball finish. AEC-Q100 not qualified - commercial/industrial grades only.
