EPF10K200SFC484-2N - 200K Gate FLEX 10KE FPGA | Intel / Altera
料号： EPF10K200SFC484-2N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $128 | $1,280.00 |
| 100 | $112.5 | $11,250.00 |
| 250 | $102 | $25,500.00 |
| 500 | $95 | $47,500.00 |
EPF10K200SFC484-2N 概述
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that combines configurable logic blocks (LABs/CLBs), programmable interconnect, and I/O cells on a single die. FPGAs sit at the top of the programmable-logic hierarchy (below: PLD -> CPLD -> FPGA) and serve as integration platforms for system-on-a-programmable-chip (SOPC) designs. The FLEX 10KE family, built on a 0.22 µm CMOS process with embedded array blocks (EABs), bridges the gap between classic CPLDs and high-density SRAM-based FPGAs by offering distributed RAM, dedicated multiplier-ready DSP blocks, and 5 V-tolerant I/O.
Key features include 200 MHz internal performance, 0.4 ns propagation delay, JTAG (IEEE 1149.1) boundary-scan support, in-system programmability via SRAM configuration, and 5 V-tolerant I/O with MultiVolt core. The 484-FBGA (1.0 mm pitch) FineLine BGA package uses SameFrame pin-out, allowing device migration between FLEX 10KE densities sharing the same package.
Technically, the device integrates 24 Kbits of distributed RAM per LAB cluster plus dedicated EABs that can be configured as dual-port RAM, ROM, or first-in first-out (FIFO) buffers. The 2.5 V core is paired with MultiVolt I/O banks that can be set to 3.3 V, 2.5 V, or 1.8 V to interface cleanly with legacy 5 V-TTL peripherals via 5 V-tolerant inputs.
Typical applications include telecommunications line cards, industrial control and factory-automation controllers, high-performance computing coprocessors, ASIC prototyping, and embedded DSP front-ends. The 369 user I/Os make it suitable for parallel bus bridging and protocol conversion designs.
When designing, place at least 8 decoupling capacitors (0.1 µF plus 10 µF bulk) around the BGA, follow Intel/Altera FineLine BGA routing guidelines, and use the Quartus II (or legacy MAX+PLUS II) toolchain for synthesis and place-and-route. SameFrame pin compatibility within the package family simplifies migration between EPF10K130EFC484-x and EPF10K200SFC484-x density points.
This page synthesizes distributor pricing, verified drop-in same-brand alternatives from the FLEX 10KE family, and practical design notes not found in the standalone manufacturer datasheet.
直接替换替代料： EPF10K200SFC484-2N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPF10K200SFC484-2N （相同外形与封装尺寸） ——差异在于 Family, Package, Operating Temperature, Speed Grade, Series.
快速对比工具——选择替代料号进行并排对比：
EPF10K200SFC484-3N
✅ 直接替换✓ 有现货
$261 / 个
查看数据手册 →EPF10K200SFC484-2
✅ 直接替换✓ 有现货
$88.4 / 个
查看数据手册 →EPF10K200SFC484-1N
✅ 直接替换✓ 有现货
$185.25 / 个
查看数据手册 →EPF10K200SFC484-1X
✅ 直接替换✓ 有现货
$142 / 个
查看数据手册 →EPF10K130EFC484-3N
✅ 直接替换✓ 有现货
$109.25 / 个
查看数据手册 →EPF10K100EFC484-2X
✅ 直接替换✓ 有现货
$237.71 / 个
查看数据手册 →EPF10K200SFC484-2N 最大额定值与电气特性
| Family | FLEX 10KE |
| Logic Elements / Cells | 9,984 |
| Gate Count | 200,000 |
| Logic Array Blocks (LABs) | 1,248 |
| Embedded RAM Bits | 98,304 (96 Kbit) |
| User I/O Pins | 369 |
| Number of I/Os (alt spec) | 470 (per digchip datasheet summary) |
| Core Supply Voltage | 2.375 V to 2.625 V (2.5 V nominal) |
| Internal Performance | 200 MHz |
| Propagation Delay | 0.4 ns |
| Process Technology | 0.22 µm CMOS |
| 工作温度 | 0°C to 70°C (Commercial) |
| 封装 | 484-FBGA FineLine BGA, 23 x 23 mm, 1.0 mm pitch |
| 安装类型 | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1), SRAM configuration |
| I/O Standard Support | 5 V-tolerant, MultiVolt (1.8 V / 2.5 V / 3.3 V) |
| Logic Family | CMOS |
EPF10K200SFC484-2N 484-fbga fineline bga, 23 x 23 mm, 1.0 mm pitch 引脚配置指南
EPF10K200SFC484-2N（484-fbga fineline bga, 23 x 23 mm, 1.0 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EPF10K200SFC484-2N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EPF10K200SFC484-2N 适用于 6 应用s: Telecommunications Line Cards, Industrial Control and Factory Automation, ASIC Prototyping and Emulation, DSP Coprocessor and Signal Front-End, Legacy System Maintenance and Field Replenishment, Embedded Protocol Bridging and Bus Conversion.
Telecommunications Line Cards
The EPF10K200SFC484-2N fits telecom line-card designs because of its 369 user I/Os, 98 Kbits of embedded RAM organized as EABs, and 5 V-tolerant MultiVolt I/O banks that interface directly to legacy 3.3 V / 5 V-TTL bus transceivers. The 1,248 LABs plus dedicated EABs implement protocol-framing state machines, HDLC/PPP controllers, and small FIFO buffers without external memory, while the 200 MHz fMAX sustains T1/E1 and low-order Ethernet backplane data rates. The FineLine BGA 484 package keeps board area compact for high-density line cards, and JTAG-based SRAM configuration enables field re-programmability for firmware updates in deployed systems.
推荐
Industrial Control and Factory Automation
The EPF10K200SFC484-2N is suitable for industrial PLC and factory-automation controller designs where 5 V-TTL sensor/actuator interfaces must coexist with modern 3.3 V / 2.5 V logic. The 200K-gate capacity and 1,248 LABs can host multiple IEC 61131-3 soft-PLCs, EtherCAT or Profibus slave controllers, and dedicated motor-control state machines in a single device. The 0.4 ns propagation delay ensures deterministic sub-microsecond scan times, while the 369 user I/Os accommodate multi-axis servo control loops. Surface-mount FBGA packaging suits modern SMT assembly lines, and SRAM-based ISP allows field firmware updates over JTAG during commissioning.
推荐
ASIC Prototyping and Emulation
The EPF10K200SFC484-2N is a useful ASIC prototyping vehicle because its 9,984 logic elements and 98 Kbits of embedded RAM can emulate medium-complexity ASICs up to roughly 200K gates. Designers can use SameFrame pin-out migration to EPF10K200SFC484-3N to verify timing closure at the fastest speed grade before committing to silicon. The 5 V-tolerant I/Os allow direct connection to legacy ASIC test fixtures, and SRAM-based ISP lets engineers iterate design revisions in minutes rather than waiting for mask-set fabrication. The 23 x 23 mm 484-FBGA package remains modern enough to support current PCB manufacturing processes.
推荐
DSP Coprocessor and Signal Front-End
The EPF10K200SFC484-2N functions as a DSP coprocessor for data-acquisition front-ends because its EAB blocks can be configured as fast dual-port RAM or ROM lookup tables for sine/cosine, FIR coefficients, or FFT twiddle factors. The 200 MHz fMAX sustains real-time baseband sample rates up to 80 MHz in pipelined multipliers, and the 369 I/Os handle parallel AD/DA converter interfaces without external glue logic. The MultiVolt I/O banks accept 3.3 V and 2.5 V ADC/DAC outputs directly, simplifying front-end layout. SRAM-based ISP allows field tuning of DSP coefficients per application.
推荐
Legacy System Maintenance and Field Replenishment
The EPF10K200SFC484-2N remains in demand for legacy system maintenance because the FLEX 10KE family powers long-lifecycle equipment in telecom, defense, and industrial automation where replacement is impractical. The 484-FBGA SameFrame pin-out preserves board-level compatibility with earlier FLEX 10K and 10KA products, allowing drop-in replacement during repair. Authorised excess distributors such as MicrochipUSA, Arrow, and FPGAkey still hold allocation of original Altera-fabricated parts. Original bitstreams generated with MAX+PLUS II or Quartus II 13.0sp1 continue to work without recompile, simplifying field replenishment.
推荐
Embedded Protocol Bridging and Bus Conversion
The EPF10K200SFC484-2N is well-suited as an embedded protocol bridge between PCI, VME, ISA, and proprietary backplanes because the 200K-gate density can host complete bus-interface state machines, DMA controllers, and FIFO buffers without external logic. The 369 user I/Os make multi-bus bridging (PCI <-> VME for example) practical on a single chip. The MultiVolt I/O banks operate at 3.3 V or 5 V, allowing the FPGA to sit directly between mixed-voltage buses. SRAM-based ISP enables late-stage board updates when protocol bugs are discovered late in qualification.
推荐
推荐产品汇总
工程参考数据： EPF10K200SFC484-2N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPF10K200SFC484-3N | EPF10K200SFC484-2 | EPF10K200SFC484-1N | EPF10K130EFC484-3N | EPF10K100EFC484-2X |
|---|---|---|---|---|---|---|
| Package | 484-FBGA FineLine BGA, 23x23 mm, 1.0 mm pitch | 484-FBGA FineLine BGA, 23x23 mm, 1.0 mm pitch - same | 484-FBGA FineLine BGA, 23x23 mm, 1.0 mm pitch - same | 484-FBGA FineLine BGA, 23x23 mm, 1.0 mm pitch - same | 484-FBGA FineLine BGA, 23x23 mm, 1.0 mm pitch - same | 484-FBGA FineLine BGA, 23x23 mm, 1.0 mm pitch - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Gate Count | 200,000 | 200,000 | 200,000 | 200,000 | 130,000 (-35%) | 100,000 (-50%) |
| Logic Elements | 9,984 | 9,984 | 9,984 | 9,984 | 6,656 | 4,992 |
| LABs | 1,248 | 1,248 | 1,248 | 1,248 | 832 | 624 |
| Speed Grade | -2 (mid) | -3 (fastest) | -2 (same) | -1 (slowest) | -3 (fastest) | -2 (same) |
| Core Voltage | 2.5 V (2.375 V - 2.625 V) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) |
| Operating Temperature | 0°C to 70°C (Commercial, N suffix) | 0°C to 70°C | 0°C to 70°C | 0°C to 70°C | 0°C to 70°C | 0°C to 70°C |
关键差异点
- Largest logic density in the 484-FBGA SameFrame FLEX 10KE family （对比 EPF10K130EFC484-3N)
- Mid-tier speed grade offering balanced price/performance （对比 EPF10K200SFC484-3N)
- 5 V-tolerant MultiVolt I/Os simplify mixed-voltage designs （对比 EPF10K100EFC484-2X)
设计说明
Estimated: a 484-FBGA FineLine BGA with 23 x 23 mm body at 1.0 mm pitch requires at least 4 PCB routing layers with 0.127 mm (5 mil) trace and 0.25 mm via pads. Follow Intel/Altera FineLine BGA layout guidelines: place 0.1 µF + 10 µF decoupling groups within 5 mm of every supply ball (8+ balls total), use a continuous GND plane on layer 2, and keep all I/O signal traces on the outer layers with matched lengths for LVDS/DDR pairs.
Estimated: the EPF10K200SFC484-2N draws up to 600 mA typical from the 2.5 V core supply (about 1.5 W) under heavy logic utilisation. Use a low-dropout regulator with at least 1 A headroom, and tie all VCCINT and VCCIO balls to their respective planes. Power-rail sequencing requires VCCINT to ramp within 100 ms of the configuration logic; violating this window may leave the SRAM configuration cells in an indeterminate state.
Estimated: at maximum 1.5 W dissipation with the 484-FBGA package, theta-JA is approximately 12 °C/W for a JEDEC EIA/JESD51 4-layer test board. Worst-case junction temperature at 70 °C ambient is roughly 88 °C - within the commercial 0-70 °C junction spec. For improved margin, increase the inner GND copper pour area under the BGA and add thermal vias in the central ball grid.
Common pitfalls: (1) assuming EPF10K200SFC484-2N bitstreams are forward-compatible with Cyclone, MAX 10, or Agility FPGAs - they are NOT; the FLEX 10KE architecture uses a unique SRAM cell map. (2) Using Quartus versions newer than 13.0sp1, which removed FLEX 10KE support - use Quartus 13.0sp1 or MAX+PLUS II instead. (3) Forgetting the JTAG chain must include pull-ups on TMS, TDI, and TCK; otherwise in-system programming fails intermittently.
JTAG and configuration signals (TDI, TDO, TMS, TCK, nSTATUS, CONF_DONE, nCONFIG) should be unrouted around the BGA to keep stubs short. The CONFIG_OE/DATA[7:0] EPROM interface must use parallel D-flip-flop clocking at the same frequency as the internal fMAX - use a 50 MHz oscillator with 50 ppm accuracy. Route clocks on a separate impedance-controlled layer with reference to GND, never across split planes.
合规信息
RoHS / REACH status not confirmed in the verified web data; the FLEX 10KE family predates widespread RoHS adoption so the standard 200K 484-FBGA variant is likely lead-containing. For RoHS-compliant equivalents see the EPF10K200SFC484-1X or EPF10K100EFC484-2X lead-free variants listed in alternatives.
