EPF10K10QI208-4N - FLEX 10K FPGA, 10K Gates, 208-PQFP | Intel
料号： EPF10K10QI208-4N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42.1 | $421.00 |
| 100 | $36.75 | $3,675.00 |
| 500 | $32.2 | $16,100.00 |
| 1,000 | $28.4 | $28,400.00 |
EPF10K10QI208-4N 概述
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and I/O cells that the end user can tailor after manufacture. FPGAs sit in the broader hierarchy: programmable logic device (PLD) -> CPLD -> FPGA -> SRAM-based FPGA. The FLEX 10K family was Altera's first device to embed array blocks (EABs) usable as embedded RAM, a stepping stone toward modern system-on-chip FPGAs.
Key features of the EPF10K10QI208-4N include 72 Logic Array Blocks (LABs), 12 Embedded Array Blocks (EABs) providing up to 6,144 bits of RAM, a 5 V CMOS core with 4.5 V to 5.5 V supply tolerance, JTAG-based IEEE 1149.1 boundary-scan support, and in-system programmability via the serial configuration EPROM interface. The 'I' suffix denotes the industrial temperature grade, and the '4' speed grade corresponds to a commercial/industrial timing bin.
Architecturally, each LAB contains 8 LEs, each LE built from a 4-input look-up table, a programmable flip-flop, and dedicated carry/ cascade logic. The 12 EABs each provide 2,048 bits of RAM (256x8) that can be cascaded for deeper FIFOs or wider data paths, making the FLEX 10K useful for glue logic, bus interfaces, and modest DSP pipelines.
Typical applications include telecommunications line-card glue logic, industrial control state machines, legacy ISA/PCI bridge interfaces, ASIC prototyping, and DSP pre/post-processing. Designers should still consider the device NRND (Not Recommended for New Designs) by Intel - this part is suitable for sustaining legacy designs or repair stock.
When designing in this device, verify the Quartus / MAX+plus II toolchain version supports the FLEX 10K family and confirm 5 V tolerance on every I/O against downstream peripherals. The PQFP-208 footprint is also worth noting - leaded packages ease hand-rework but consume substantially more PCB area than modern BGAs.
This page consolidates distributor pricing across 21 sources, drop-in same-package alternatives within the FLEX 10K family, and design notes covering power-pin decoupling and configuration mode selection that are not collected in any single manufacturer document.
直接替换替代料： EPF10K10QI208-4N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPF10K10QI208-4N （相同外形与封装尺寸） ——差异在于 Package, Family, Process Technology, Speed Grade, Configuration Method.
快速对比工具——选择替代料号进行并排对比：
EPF10K10QI208-4
✅ 直接替换✓ 有现货
$42.8 / 个
查看数据手册 →EPF10K10QC208-4N
✅ 直接替换✓ 有现货
$16.2 / 个
查看数据手册 →EPF10K10QC208-4
✅ 直接替换✓ 有现货
$18.75 / 个
查看数据手册 →EPF10K10QC208-3
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$45.75 / 个
查看数据手册 →EPF10K10AQC208-3N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$49.9 / 个
查看数据手册 →EPF10K10AQC208-3
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$31.4 / 个
查看数据手册 →EPF10K10QI208-4N 最大额定值与电气特性
| Family | FLEX 10K |
| Logic Elements (LEs) | 576 |
| Usable Gates | 10,000 (typical) |
| Logic Array Blocks (LABs) | 72 |
| Embedded Array Blocks (EABs) | 12 |
| Embedded RAM | 6,144 bits |
| Maximum User I/O | 134 |
| Supply Voltage (VCCINT) | 5 V (4.5 V min, 5.5 V max) |
| Technology | CMOS, SRAM-based |
| 封装 | 208-BFQFP / PQFP-208 (Power Quad Flat Pack) |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +85C (industrial, 'I' suffix) |
| Speed Grade | -4 |
| Configuration | Serial / JTAG (IEEE 1149.1) |
| Programming Toolchain | Altera MAX+plus II / Quartus |
EPF10K10QI208-4N 208-bfqfp / pqfp-208 (power quad flat pack) 引脚配置指南
EPF10K10QI208-4N（208-bfqfp / pqfp-208 (power quad flat pack) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EPF10K10QI208-4N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EPF10K10QI208-4N 适用于 6 应用s: Telecommunications Line-Card Glue Logic, Industrial Control State Machines, Legacy ISA / PCI Bus Bridge Interfaces, ASIC Prototyping and Emulation, DSP Pre- and Post-Processing Pipelines, Avionics / Aerospace Legacy Sustainment.
Telecommunications Line-Card Glue Logic
The EPF10K10QI208-4N is well suited to legacy telecom line cards that require 5 V-tolerant glue logic, modest state-machine density, and the EAB RAM blocks for small FIFOs between TDM buses. Its 134 user I/Os comfortably interface to 8-bit parallel buses, framer ICs, and time-slot interchange devices without external bus drivers. The PQFP-208 package and industrial temperature bin match the form factor and thermal envelope of classic ATCA/cPCI line cards still in field deployment. Designers should verify JTAG chain order against adjacent devices and confirm that the FLEX 10K 5 V I/O tolerance meets downstream 3.3 V logic levels using series resistors.
推荐
Industrial Control State Machines
For PLC backplanes and motor-drive controllers, the EPF10K10QI208-4N's industrial -40C to +85C grading ensures operation in unheated cabinets and on factory floors. The 576 logic elements are sufficient to implement multi-axis sequencers, encoder counters, and safety interlocks that would otherwise require multiple 74-series logic ICs. EAB RAM can hold commutation tables for BLDC motor control. Designers should provide bulk decoupling on every VCCINT/VCCIO pin pair and route JTAG signals away from switching power traces to avoid programming glitches during factory test.
推荐
Legacy ISA / PCI Bus Bridge Interfaces
The 134 I/Os of the EPF10K10QI208-4N are enough to implement glue logic between legacy ISA (16-bit data, 24-bit address) and downstream peripherals, or to build a minimal PCI target/state machine for older embedded motherboards. The 5 V PCI signaling standard aligns with the FLEX 10K I/O voltage, simplifying PCI-compliant input thresholds. Designers targeting new PCI Express designs should migrate to Cyclone IV/V or MAX 10 instead - this part is sustaining-only.
推荐
ASIC Prototyping and Emulation
Designers historically used FLEX 10K devices for ASIC prototyping because the architecture is HDL-friendly and EABs emulate small SRAM blocks. The EPF10K10QI208-4N provides 576 LEs to validate control logic before committing to a mask set, with JTAG-driven single-step debug. Industrial temperature allows benchtop and chassis prototyping alike. Verify that the Quartus / MAX+plus II constraint file targets the -4 speed grade before timing closure so that prototyping margins match the eventual ASIC silicon.
推荐
DSP Pre- and Post-Processing Pipelines
The EPF10K10QI208-4N's 12 EABs supply 6,144 bits of dual-port RAM, suitable for small FIR filter coefficient tables, delay lines, and sample-rate conversion buffers in DSP front-ends. Combined with the LAB-based multiplier logic, the device can implement modest sample-rate converters between audio ADCs/DACs and downstream DSP processors. Industrial temperature allows deployment in outdoor acoustic monitoring. For higher data rates migrate to Cyclone V or MAX 10 with dedicated DSP blocks.
推荐
Avionics / Aerospace Legacy Sustainment
Long-lifecycle aerospace and defense programs frequently sustain EPF10K10-class FPGAs for decades because the parts are already qualified against legacy DO-254 / MIL-STD-1540 baselines. The industrial temperature grade and PQFP-208 package ease conformal coating and hand-rework on existing flight hardware. Re-design is constrained by change-control boards, so the EPF10K10QI208-4N remains in service as a sustaining component. Source from franchised distributors with full traceability documentation; brokers should provide C-of-C and ESD-handling records.
推荐
推荐产品汇总
工程参考数据： EPF10K10QI208-4N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPF10K10QI208-4 | EPF10K10QC208-4N | EPF10K10QC208-4 | EPF10K10QC208-3 | EPF10K10AQC208-3N | EPF10K10AQC208-3 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | PQFP-208 (BFQFP) | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 576 | 576 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) - same | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Speed Grade | -4 | -4 - same | -4 - same | -4 - same | -3 (faster) | -3 (faster) | -3 (faster) |
| Die Revision | Original FLEX 10K | Original - same | Original - same | Original - same | Original - same | A-revision | A-revision |
| Lead-Free ('N') | Yes (Pb-free, 'N' suffix) | No (legacy Pb option) | Yes | No | No | Yes | No |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
关键差异点
- Industrial temperature bin (-40C to +85C) vs commercial QC variants （对比 EPF10K10QC208-4N)
- Pb-free ('N') finish vs legacy Pb option （对比 EPF10K10QI208-4)
- Original FLEX 10K die revision （对比 EPF10K10AQC208-3N)
设计说明
Estimated: at 5 V VCCINT with all 134 I/Os toggling at 50 MHz, the EPF10K10QI208-4N draws roughly 200-300 mA from the core rail and additional current on VCCIO banks. Provide at least four 0.1 uF ceramic decoupling capacitors around the PQFP-208 perimeter, plus a single 47 uF tantalum or polymer bulk capacitor near the VCCINT pin. Inductance in the power-trace loop directly couples to I/O switching noise, so keep VCC traces wide and short. Add a ferrite bead if the same 5 V rail feeds analog circuitry elsewhere on the board.
JTAG signals (TCK, TMS, TDI, TDO, TRST) must be routed as a single daisy-chain with stub lengths under 25 mm and a 10 kohm pull-up on TCK. Place the JTAG header within 50 mm of the FPGA. Configuration mode pins (MSEL0/MSEL1) require a clean logic-level tie - do not leave them floating. For multi-FPGAs on one board, dedicate one device as the configuration master and chain the rest via FLEX configuration ports.
Do not assume any FLEX 10K device is 5 V-tolerant on every I/O - some banks only support 3.3 V when configured with VCCIO = 3.3 V. Always verify the VCCIO bank voltage matches the downstream device. Also note that FLEX 10K is SRAM-based and volatile: without a configuration EPROM (EPC2 series) the FPGA loses its bitstream on power-down. Plan the configuration EEPROM footprint on every board, even for prototypes.
The PQFP-208 package has a thermal resistance (theta_JA) of approximately 35-40 C/W in still air. At full activity the device may dissipate 1.5-2 W, giving a junction temperature rise of 50-80 C above ambient. Within the industrial -40C to +85C envelope this is acceptable; however, in sealed enclosures with no airflow, derate I/O switching activity or add a small clip-on heatsink. Avoid placing the FPGA directly above heat-dissipating components (DC-DC converters, power MOSFETs).
合规信息
RoHS compliant per 'N' suffix in part number (Pb-free finish); 'I' suffix indicates industrial temperature grade. AEC-Q100 not applicable - this is a logic/FPGA device, not an automotive analog IC. Halogen-free status not stated in retrieved data and marked 'unknown'. Verify specific compliance certificates with the franchised distributor before automotive or medical deployment.
