EPF10K50VRC240-2 - Flex 10K FPGA, 50K Gates, 240-RQFP | Intel
料号： EPF10K50VRC240-2 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.9 | $289.00 |
| 100 | $24.75 | $2,475.00 |
| 500 | $21.4 | $10,700.00 |
| 1,000 | $18.95 | $18,950.00 |
EPF10K50VRC240-2 概述
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs/LABs) connected through programmable interconnect, allowing hardware designers to implement custom digital logic that can be reconfigured after manufacturing. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA -> System-on-Chip FPGA. The Flex 10K series introduced embedded array blocks (EABs) for System-on-a-Programmable-Chip (SOPC) integration, combining lookup-table based logic with on-chip RAM.
Key features of the EPF10K50VRC240-2 include 20,480 typical logic elements, a maximum internal frequency of approximately 125 MHz (66.67 MHz in some datasheet graphs), a propagation delay of 0.6 ns, and embedded array blocks for memory implementation. The -2 speed grade identifies a mid-range performance bin within the Flex 10K family. The device is graded for commercial operating temperature (0 °C to +70 °C) and ships in surface-mount gull-wing RQFP-240.
Architecturally, the Flex 10K combines a fine-grained logic fabric (LABs built from 8 logic elements each) with coarse-grained Embedded Array Blocks (EABs), enabling dense on-chip RAM and product-term logic. The 3.3 V core, 0.42 µm process, and SRAM-based configuration make the part volatile (configuration must be loaded at every power-up from a serial or parallel PROM).
Typical applications include glue logic and bus interfaces in telecommunications backplanes, industrial control and instrumentation, prototyping of ASIC-equivalent designs, embedded control in test equipment, and legacy system upgrades where the Flex 10K is already qualified. Designers continue to use EPF10K50VRC240-2 in maintenance and low-volume production of mature platforms.
When designing with this part, plan for external configuration memory (an EPC1/EPC2 configuration PROM, or a microcontroller) because SRAM configuration cells lose their contents on power-down. Provide proper decoupling on every VCCINT/VCCIO pin and observe I/O banking rules for mixed-voltage interfaces.
This page synthesizes distributor pricing, drop-in alternative MPNs from the same Flex 10K family, and practical design notes that go beyond the manufacturer datasheet's tables.
直接替换替代料： EPF10K50VRC240-2 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPF10K50VRC240-2 （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Family, Operating Temperature, Configuration Method.
快速对比工具——选择替代料号进行并排对比：
EPF10K50VRC240-1N
✅ 直接替换✓ 有现货
$28.5 / 个
查看数据手册 →EPF10K50VRC240-2N
✅ 直接替换✓ 有现货
$81.2 / 个
查看数据手册 →EPF10K50VRC240-3
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$61.75 / 个
查看数据手册 →EPF10K50VRC240-1
✅ 直接替换✓ 有现货
$130.32 / 个
查看数据手册 →EPF10K50VRC240-3N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$58.75 / 个
查看数据手册 →EPF10K50VRC240-2 最大额定值与电气特性
| Family | Flex 10K |
| Logic Cells | 2,880 |
| Typical Gates | 50,000 |
| Logic Elements (LEs) | 20,480 |
| Logic Array Blocks (LABs) | 360 |
| User I/Os | 189 |
| Maximum Internal Frequency | 125 MHz |
| Propagation Delay | 0.6 ns |
| Process Technology | 0.42 µm CMOS |
| Core Supply Voltage | 3.3 V |
| Speed Grade | -2 (mid) |
| 封装 | 240-pin RQFP / HFQFP (exposed pad), gull-wing |
| 安装类型 | Surface Mount |
| 工作温度 | 0 °C to +70 °C (commercial) |
| Configuration Memory | SRAM (volatile, external PROM required) |
EPF10K50VRC240-2 240-pin rqfp / hfqfp (exposed pad), gull-wing 引脚配置指南
EPF10K50VRC240-2（240-pin rqfp / hfqfp (exposed pad), gull-wing 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EPF10K50VRC240-2.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EPF10K50VRC240-2 适用于 6 应用s: Telecommunications Backplane Glue Logic, Industrial Control & Instrumentation, ASIC Prototyping & Emulation, Legacy Test & Measurement Equipment, Aerospace & Defense Upgrade Programs, Embedded Control in Printers & Imaging.
Telecommunications Backplane Glue Logic
The EPF10K50VRC240-2 fits telecommunications backplane glue logic because its 189 user I/Os, 50K gates, and 3.3 V core give enough headroom for bus bridges, address decoding, and protocol conversion between legacy TDM and packet domains. Its 0.6 ns propagation delay supports glue logic running at bus speeds up to 125 MHz on short paths. Placed near connector banks with FIFO buffers and transceivers, the device absorbs timing skew across backplane traces while consuming a moderate ~300 mW core current. Compared with a discrete 74-series implementation, it cuts board area by roughly 70% and adds JTAG-driven in-system updates. The Flex 10K family has a long-proven track record in central-office equipment, and the VRC240 footprint is a drop-in for legacy Altera-based designs.
推荐
Industrial Control & Instrumentation
The EPF10K50VRC240-2 serves industrial control platforms because its 240-pin RQFP exposes enough I/O for parallel encoder/decoder matrices, optocoupler interfaces, and relay drivers in motor-control cabinets. The 0.42 µm CMOS process delivers stable operation across the 0-70 °C commercial range typical of factory-floor enclosures. With 360 LABs and embedded array blocks, the part implements up to ~20 Kbytes of on-chip RAM for state machines and PID loops without external SRAM. Engineers often pair it with isolated ADC front-ends and CAN/RS-485 transceivers to build deterministic multi-axis controllers. Compared with a CPLD-only solution, the Flex 10K adds programmable 32-bit datapaths for trapezoidal commutation algorithms. Long-term availability through distribution channels remains stable for industrial retrofit programs.
推荐
ASIC Prototyping & Emulation
The EPF10K50VRC240-2 is well-suited for ASIC prototyping because its 20,480 logic elements and embedded array blocks give 50K gates of usable logic, which is enough to host a medium-complexity ASIC netlist for functional verification. The 240-pin RQFP provides 189 user I/Os, allowing direct connection to ASIC-style parallel buses, memory interfaces, and external test fixtures. Combined with the Quartus II design flow (legacy support), engineers can iterate RTL quickly and re-use the same Flex 10K board across multiple ASIC tape-out cycles. The part supports JTAG boundary-scan (IEEE 1149.1) for in-system bring-up, plus serial configuration from an EPC2 PROM for standalone prototype deployment. Compared with HDL simulators, real-hardware emulation runs at near-real-time, exposing race conditions and reset bugs that pure simulation misses.
推荐
Legacy Test & Measurement Equipment
The EPF10K50VRC240-2 fits legacy test and measurement equipment where decades-old ATE platforms use Flex 10K-based timing controllers, pattern generators, and pin-electronics interfaces. Its 0.6 ns propagation delay and 125 MHz internal frequency give deterministic timing for handshake protocols between the tester CPU and per-pin ASICs. The 240-pin RQFP leaves enough I/O for parallel tester channels with margin for future channel-count expansion. Designers retain the part because the existing DUT-board fixtures, calibration tables, and test programs are built around its exact timing behavior. Substitution to a Cyclone IV would require full re-characterization of every timing path, so maintainers keep the Flex 10K as long as Intel distribution remains open.
推荐
Aerospace & Defense Upgrade Programs
The EPF10K50VRC240-2 is used in aerospace and defense upgrade programs where avionics and mission-computer subsystems qualified with the Flex 10K family must be reproduced or refreshed without re-certifying the entire board. Its commercial 0-70 °C range and known FIT-rate behavior fit retrofit programs that do not require full MIL-spec parts. The 240-pin RQFP and 3.3 V core match existing harness, power-tree, and FPGA-slot pin maps exactly. Engineers integrate the part with legacy MIL-STD-1553 transceivers, ARINC 429 line drivers, and discrete logic ICs to extend the service life of fielded platforms. Compared with re-spinning onto a newer FPGA, drop-in replacement minimizes re-validation scope and cuts FAA/DoD certification cycles by months.
推荐
Embedded Control in Printers & Imaging
The EPF10K50VRC240-2 fits embedded control in high-end printers, plotters, and imaging systems that need precise stepper-motor timing, paper-path sensor fusion, and high-speed image-data routing. With 189 I/Os the device can fan-out to multiple print-head controllers, ADCs, and DRAM interfaces without external bus expander logic. The 0.6 ns propagation delay keeps image pipelines within deterministic latency budgets at pixel rates above 100 MHz. Combined with on-chip EABs, the part stores line buffers and gamma tables directly, simplifying the BOM and lowering the bill of materials. Designers prefer this part because the Flex 10K generation is well-characterized in the imaging industry and its RQFP-240 footprint is already laid out in mature reference designs from major printer OEMs.
推荐
推荐产品汇总
工程参考数据： EPF10K50VRC240-2 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPF10K50VRC240-1N | EPF10K50VRC240-2N | EPF10K50VRC240-3 | EPF10K50VRC240-1 | EPF10K50VRC240-3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 240-RQFP (HFQFP) | 240-RQFP (HFQFP) - same | 240-RQFP (HFQFP) - same | 240-RQFP (HFQFP) - same | 240-RQFP (HFQFP) - same | 240-RQFP (HFQFP) - same |
| Speed Grade | -2 | -1 (slower) | -2 (same) | -3 (faster) | -1 (slower) | -3 (faster) |
| Lead-free Termination | Pb-containing (legacy) | Yes (Pb-free) | Yes (Pb-free) | Pb-containing | Pb-containing | Yes (Pb-free) |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Typical Gates | 50K | 50K | 50K | 50K | 50K | 50K |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 |
关键差异点
- Identical silicon and footprint as the entire VRC240 family （对比 EPF10K50EQC240-2)
- Drop-in compatibility with -1N and -2N variants （对比 EPF10K50VRC240-1N)
- Long-proven Flex 10K architecture in telecom and industrial （对比 EPF10K30RC240-4N)
设计说明
The EPF10K50VRC240-2 draws roughly 300 mA on its VCCINT (3.3 V core) rail when fully utilized at 125 MHz, plus 50-100 mA on each VCCIO bank depending on switching activity. Estimated: at VCCINT=3.3 V and 300 mA core current, total core power is about 1.0 W, so a 1.5 W LDO (e.g. LT1117-3.3) is sufficient for core; for VCCIO add a separate regulator per bank if mixing 3.3 V and 5 V peripherals. Decouple every VCC/VCCIO pin with a 0.1 µF X7R placed within 3 mm of the pin, and add four bulk 22 µF tantalum or polymer caps distributed around the package footprint. Configure unused I/Os as outputs driving ground and tie nCONFIG high through a 10 kΩ resistor to ensure clean power-up.
Lay out the EPF10K50VRC240-2 on a 4-layer PCB with a continuous ground plane directly under the package to provide a low-impedance return path for high-speed signals. Estimated: the 240-pin RQFP at 0.5 mm pitch needs 0.15 mm/0.20 mm trace/space on outer layers to escape from all four sides; on inner layers use 0.20 mm/0.20 mm. The exposed thermal pad (when present on the package variant) must be soldered to a 10 mm × 10 mm copper pour with 6-9 thermal vias (0.3 mm drill) to a ground plane to keep θJA below 25 °C/W. Place the EPC1/EPC2 configuration PROM within 25 mm of the FPGA to keep the DCLK trace short and avoid reflection-induced configuration errors.
Three pitfalls trip first-time Flex 10K designers: (1) MSEL pin settings - tie MSEL0/MSEL1 to VCCINT or GND via 10 kΩ resistors to select the configuration mode, never leave them floating; (2) nSTATUS and CONF_DONE need 10 kΩ pull-ups to VCCIO - if nSTATUS stays low after config the FPGA entered an error state, usually from a corrupt EPC image or a noisy DCLK; (3) I/O banking - mixing 5 V inputs into a 3.3 V bank without a series resistor can latch-up the I/O, so always check VCCIO bank assignments in the Quartus pin-planner before layout. A 1 ms CONFIG_DELAY is typical; if the host holds nCONFIG low for longer than 100 ms, re-check the POR circuit.
Estimated: the 240-pin RQFP package has a θJA of roughly 25 °C/W with the recommended copper pad layout. At 1.0 W core power and ambient 60 °C inside a sealed enclosure, the junction runs at ~85 °C - well within the 0-70 °C commercial limit when derated. If the application exceeds 70 °C ambient, switch to a Flex 10K industrial variant or improve airflow; the EPF10K50VRC240-2 is commercial grade only. Use the on-die thermal diode (when present) with an external sensor to monitor junction temperature during bring-up and qualification.
合规信息
RoHS and REACH status not stated in the verified data; the part was originally offered with Pb-containing termination. Choose the EPF10K50VRC240-2N suffix variant for lead-free assembly.
