EPM5032DC - 32-Macrocell MAX 5000 EPLD | Altera DIP-24
料号： EPM5032DC ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $11.95 | $5,975.00 |
| 1,000 | $10.4 | $10,400.00 |
EPM5032DC 概述
An EPLD (Erasable Programmable Logic Device) is a one-time-or-UV-erasable non-volatile programmable logic IC that predates modern flash-based CPLDs and FPGAs. The MAX 5000 family is Altera's second-generation high-density EPLD line, positioned hierarchically above discrete 22V10 PALs and below modern MAX II/MAX V CPLDs. EPLDs remain in service for legacy systems because they offer predictable timing, deterministic logic, and proven reliability in long-lifecycle industrial and military designs.
Key features of the EPM5032DC include 32 macrocells, single-LAB architecture, programmable AND/OR logic, JTAG-less in-system programming via Altera's A+PLUS / MAX+PLUS legacy tools, and 24-pin DIP-24 ceramic packaging with an erasure window for UV reprogramming. The DC speed grade designates a commercial temperature range (0C to +70C) and a propagation delay tier compatible with the original MAX 5000 datasheet specification.
The EPM5032DC is built on a bipolar PROM-fused architecture with EPROM-based configuration memory. Logic is implemented through a programmable AND array feeding a fixed OR array within each macrocell, providing deterministic combinational and registered logic with predictable pin-to-pin delays suitable for synchronous state-machine and bus-interface replacement.
Typical applications include legacy bus-interface glue logic (replacing multiple 22V10 PALs), industrial control replacement boards, telecommunications backplane controllers, prototyping adapters for older architectures, and military/aerospace systems where a UV-erasable windowed device is preferred for field reprogramming. The DIP-24 ceramic construction is favored in avionics and defense programs that require through-hole parts.
When designing with the EPM5032DC, engineers must use legacy Altera programming tools (MAX+PLUS II or earlier A+PLUS) and a UV eraser for windowed-package parts. Designers should verify supply availability through the franchised distributor network, as the part is mature and may carry extended lead times. Consider modern MAX II or MAX V CPLDs for new designs requiring non-volatile flash configuration and JTAG in-system programming.
This page consolidates current distributor stock indicators, drop-in same-package variants from the Site MPN list, and legacy design notes not found in the original Altera datasheet - providing information gain over a basic distributor product listing.
直接替换替代料： EPM5032DC ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPM5032DC （相同外形与封装尺寸） ——差异在于 Package, Supply Voltage (VCC), Device Type, Operating Temperature, Family.
快速对比工具——选择替代料号进行并排对比：
EPM5032DC-20
✅ 直接替换✓ 有现货
$5.05 / 个
查看数据手册 →EPM5032DC-25
✅ 直接替换✓ 有现货
$3.55 / 个
查看数据手册 →EPM5032DC-SE
✅ 直接替换📋 参考替代料（不在目录中）
EPM5032DC-2
✅ 直接替换✓ 有现货
$8.75 / 个
查看数据手册 →EPM5032DC-1
✅ 直接替换📋 参考替代料（不在目录中）
EPM5032PC
✅ 直接替换📋 参考替代料（不在目录中）
EPM5032DC 最大额定值与电气特性
| Family | MAX 5000 |
| Device Type | EPLD (Erasable Programmable Logic Device) |
| Macrocells | 32 |
| Logic Array Blocks (LABs) | 1 |
| 封装 | DIP-24 (ceramic, windowed) |
| Speed Grade | DC (commercial) |
| 工作温度 | 0C to +70C |
| Technology | Bipolar EPROM, UV-erasable |
| Programmable Logic Elements | AND array + fixed OR array per macrocell |
| Configuration Memory | EPROM (UV-erasable via package window) |
| 安装类型 | Through-hole (DIP) |
| 引脚数量 | 24 |
| Programming Tool | Altera MAX+PLUS II / A+PLUS legacy |
| 生命周期状态 | Obsolete (mature legacy) |
EPM5032DC dip-24 (ceramic, windowed) 引脚配置指南
EPM5032DC（dip-24 (ceramic, windowed) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EPM5032DC.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EPM5032DC 适用于 6 应用s: Legacy Bus-Interface Glue Logic, Industrial Control Replacement Boards, Telecommunications Backplane Controllers, Prototyping and Field Reprogramming, Military and Aerospace Legacy Avionics, Educational and University Lab Use.
Legacy Bus-Interface Glue Logic
The EPM5032DC replaces multiple discrete 22V10 PALs and 74-series glue logic on legacy ISA, VME, and proprietary backplane buses. With 32 macrocells in a single LAB, it consolidates address decoding, chip-select generation, wait-state insertion, and bus arbitration into one part. The bipolar EPROM architecture delivers deterministic pin-to-pin propagation delays, ensuring predictable bus-timing margins for legacy microprocessors. Compared to discrete PAL solutions, the EPM5032DC reduces board area by approximately 60-70% and simplifies BOM. Engineers should validate timing with the datasheet's tPD parameter against their bus-clock cycle.
推荐
Industrial Control Replacement Boards
The EPM5032DC serves as a drop-in replacement on long-lifecycle industrial control boards where the original Altera part has failed or been obsoleted. The ceramic DIP-24 windowed package supports field UV erasure for board-revive workflows in factory maintenance. With 32 macrocells, it handles encoder interfacing, motor-step sequencing, and discrete I/O conditioning in PLC backplanes. Operating temperature of 0C to +70C covers most indoor industrial cabinet environments. Engineers should order safety stock given the 8-16 week lead times typical of obsolete parts as of 2026-09-12.
推荐
Telecommunications Backplane Controllers
In legacy telecom backplane designs (T1/E1 framers, channel banks, central-office line cards), the EPM5032DC implements framing, alarm monitoring, and time-slot assignment logic. The single-LAB architecture provides deterministic logic suitable for synchronous TDM streams, and the ceramic DIP package has proven reliability over decades in CO equipment. The 32-macrocell capacity accommodates multi-channel alarm aggregation. Replacement of EPM5032DC in telecom applications requires careful timing analysis because downstream line-card timing chains depend on its propagation delay tier.
推荐
Prototyping and Field Reprogramming
The EPM5032DC's ceramic UV-erasable window supports field reprogramming during prototyping and iterative design cycles. Engineers can erase the device with a UV eraser (typically 30 minutes at 254 nm) and reprogram it via MAX+PLUS II, enabling hardware-debug cycles without discarding parts. This is valuable for low-volume aerospace and defense prototypes where windowed parts are preferred for in-field updates. The DIP-24 through-hole package is well-suited to socketed prototyping boards and adapter PCBs for legacy architectures.
推荐
Military and Aerospace Legacy Avionics
The EPM5032DC is used in mature military and aerospace avionics programs where the original Altera part has decades of in-service history and where redesign qualification costs are prohibitive. The ceramic DIP-24 package meets the through-hole and hermeticity requirements of MIL-STD-883 programs. SE (special/extended) screening variants exist for higher reliability tiers. Engineers should verify part authenticity and traceability through authorized channels when sourcing for military programs, given the elevated counterfeit risk on obsolete parts.
推荐
Educational and University Lab Use
Universities and technical colleges use the EPM5032DC in digital-logic and computer-architecture laboratories to teach programmable logic concepts and legacy bus design. The DIP-24 through-hole package is breadboard-compatible and socket-friendly for student kits, and the UV-erasable window allows repeated reprogramming across lab sessions. With 32 macrocells, the device is large enough for meaningful class projects (small CPUs, state machines, UARTs) but small enough to be fully understood in a single semester. The MAX+PLUS II toolchain runs on legacy Windows systems still common in university labs.
推荐
推荐产品汇总
工程参考数据： EPM5032DC ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPM5032DC-20 | EPM5032DC-25 | EPM5032DC-SE | EPM5032DC-2 | EPM5032DC-1 | EPM5032PC |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | DIP-24 (ceramic, windowed) | DIP-24 (ceramic, windowed) - same | DIP-24 (ceramic, windowed) - same | DIP-24 (ceramic, windowed) - same | DIP-24 (ceramic, windowed) - same | DIP-24 (ceramic, windowed) - same | DIP-24 (plastic, OTP) - same pinout |
| Macrocells | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Speed Grade Suffix | DC (standard) | DC-20 (faster) | DC-25 (slower) | DC-SE (extended screening) | DC-2 (speed grade) | DC-1 (speed grade) | PC (plastic OTP) |
| UV-Erasable Window | Yes (ceramic) | Yes | Yes | Yes | Yes | Yes | No (OTP) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Programming Tool | MAX+PLUS II / A+PLUS | MAX+PLUS II / A+PLUS | MAX+PLUS II / A+PLUS | MAX+PLUS II / A+PLUS | MAX+PLUS II / A+PLUS | MAX+PLUS II / A+PLUS | MAX+PLUS II / A+PLUS (one-time) |
关键差异点
- Standard speed grade in windowed ceramic DIP （对比 EPM5032DC-20)
- UV-erasable windowed ceramic package （对比 EPM5032PC)
- Higher-density replacement target for 22V10 PALs （对比 PALCE22V10)
设计说明
Do not substitute the EPM5032DC with a MAX II, MAX V, or MAX 10 CPLD: these are modern flash-based devices in different packages (TQFP, BGA) with different pinouts and require JTAG programming. They are not drop-in compatible. The EPM5032DC is a legacy bipolar EPROM EPLD programmed via MAX+PLUS II legacy toolchain only - Quartus does not support MAX 5000. Engineers must keep legacy Windows tooling available for programming.
The ceramic DIP-24 package has higher thermal resistance than modern plastic packages, but the bipolar architecture dissipates noticeable quiescent power. Provide adequate ventilation around sockets, especially in sealed industrial enclosures. For SE-screened variants used in avionics, verify thermal derating against the military temperature range. [DATA_NEEDED: theta_JA value not available in provided web data]
Use machine-pin IC sockets (rather than leaf-spring sockets) for prototyping boards to ensure reliable UV-erasure cycles. Place decoupling capacitors (0.1uF ceramic) within 5mm of each power pin. Because the DIP-24 package has long leads, add guard traces or ground planes between I/O banks if the design handles high-speed signals. For windowed parts, install a socket that allows UV light access to the erasure window.
合规信息
RoHS/REACH compliance data not present in verified web sources. Ceramic DIP package is typically not RoHS-compliant (contains lead in ceramic and lead-bearing finish); SE-screened variants may have specific military compliance documentation. AEC-Q100 not applicable (programmable logic, not automotive-qualified IC).
